IP Library › Granted Patent US 12,197,202
Granted Patent B2
US 12,197,202 · App. 17/737,797 · Granted Jan 14, 2025

Liquid assisted air cooling module interface in an information handling system

Inventors: Sandburg Hu (Shanghai, CN); Xiaoliang Zhou (Nantong, CN); Joe Wang (Shanghai, CN)
Assignee: Dell Products L.P.
G05B23/0286G06F1/20G06F11/3031G06F11/3058
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,197,202
App. No.
17/737,797
Filed
May 5, 2022
Granted
Jan 14, 2025
Kind
B2
Art Unit
2116
USPC
700/282
Abstract

An information handling system includes a motherboard including a connector interface, and a liquid assisted air cooling (LAAC) module. The LAAC module includes a coolant pump to circulate coolant to one or more components in the information handling system, a leak sensor to detect whether the coolant is leaking, and a processor. The processor detects whether the coolant pump is operating properly. In response to the coolant pump not operating properly, the processor provides a first tachometer signal on a particular pin of the connector interface of the motherboard. The processor further monitors a voltage level received from the leak sensor. A first voltage level indicates a leak being detected, and a second voltage level indicates no leak being detected. In response to the voltage level being the first voltage level, the processor provides a second tachometer signal on the particular pin of the connector interface of the motherboard.

Claims (45)

1. An information handling system comprising:

a motherboard including a connector interface; and

a liquid assisted air cooling (LAAC) module to communicate with the connector interface of the motherboard, the LAAC module including:

a coolant pump to circulate coolant to one or more components in the information handling system;

a leak sensor to detect whether the coolant is leaking within the LAAC module; and

a processor to communicate with the coolant pump and the leak sensor, the processor to:

detect whether the coolant pump is operating properly;

in response to the coolant pump not operating properly, provide a first tachometer signal on a particular pin of the connector interface of the motherboard;

monitor a voltage level received from the leak sensor, wherein a first voltage level indicates a leak being detected, and a second voltage level indicates no leak being detected; and

in response to the voltage level being the first voltage level, provide a second tachometer signal on the particular pin of the connector interface of the motherboard, wherein the second tachometer signal is a pulse width modulated signal, and a speed of the second tachometer signal is greater than a maximum speed for the pulse width modulated signal.

2. The information handling system of claim 1 , wherein in response to reception of the second tachometer signal, the motherboard to shut down the coolant pump.

3. The information handling system of claim 1 , wherein in response to reception of the second tachometer signal, the motherboard to log a leakage failure.

4. The information handling system of claim 1 , wherein the detection of a leak is a higher priority than the coolant pump not operating properly.

5. The information handling system of claim 1 , wherein in response to the coolant pump operating properly and no leak being detected, the processor to provide a third tachometer signal on the particular pin of the connector interface.

6. The information handling system of claim 1 , wherein the first tachometer signal is a static signal.

7. The information handling system of claim 1 , wherein second tachometer signal is a high frequency signal.

8. The information handling system of claim 1 , wherein the leak sensor is a leak detector rope.

9. A method comprising:

detecting, by a processor of a liquid assisted air cooling (LAAC) module in an information handling system, whether a coolant pump of the information handling system is operating properly;

in response to the coolant pump not operating properly, providing a first tachometer signal on a particular pin of a connector interface of a motherboard in the information handling system;

monitoring, by the processor, a voltage level received from a leak sensor, wherein a first voltage level indicates a leak being detected, and a second voltage level indicates no leak being detected; and

in response to the voltage level being the first voltage level, providing a second tachometer signal on the particular pin of the connector interface of the motherboard, wherein the second tachometer signal is a pulse width modulated signal, and a speed of the second tachometer signal is greater than a maximum speed for the pulse width modulated signal.

10. The method of claim 9 , wherein in response to reception of the second tachometer signal, the method further comprises:

shutting down, by the motherboard, the coolant pump.

11. The method of claim 9 , wherein in response to reception of the second tachometer signal, the method further comprises:

logging, by the motherboard, a leakage failure in the LAAC module.

12. The method of claim 9 , wherein the detection of a leak is a higher priority than the coolant pump not operating properly.

13. The method of claim 9 , wherein in response to the coolant pump operating properly and no leak being detected, the method further comprises:

providing, by the processor, a third tachometer signal on the particular pin of the connector interface.

14. The method of claim 9 , wherein the first tachometer signal is a static signal.

15. The method of claim 9 , wherein second tachometer signal is a high frequency signal.

16. An information handling system comprising:

a motherboard including a connector interface; and

a liquid assisted air cooling (LAAC) module to communicate with the connector interface of the motherboard, the LAAC module including:

a coolant pump to circulate coolant to one or more components in the information handling system;

a leak sensor to detect whether the coolant is leaking within the LAAC module; and

a processor to communicate with the coolant pump and the leak sensor, the processor to:

if the coolant pump is not operating properly, then provide a first tachometer signal on a particular pin of the connector interface of the motherboard;

monitor a voltage level received from the leak sensor, wherein a first voltage level indicates a leak being detected, and a second voltage level indicates no leak being detected;

if the voltage level is the first voltage level, then provide a second tachometer signal on the particular pin of the connector interface of the motherboard, wherein the second tachometer signal is a pulse width modulated signal, and a speed of the second tachometer signal is greater than a maximum speed for the pulse width modulated signal, wherein in response to reception of the second tachometer signal, the motherboard to shut down the coolant pump;

if the coolant pump is operating properly and no leak being detected, then the processor to provide a third tachometer signal on the particular pin of the connector interface.

17. The information handling system of claim 16 , wherein in response to reception of the second tachometer signal, the motherboard to log a leakage failure.

18. The information handling system of claim 16 , wherein the detection of a leak is a higher priority than the coolant pump not operating properly.

19. The information handling system of claim 16 , wherein the first tachometer signal is a static signal.

20. The information handling system of claim 16 , wherein second tachometer signal is a high frequency signal.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2022
From: HU, SANDBURG; ZHOU, XIAOLIANG; WANG, JOE
To: DELL PRODUCTS L.P.
Reel/Frame 059833/0087 →
Priority Claims (1)
CN 202210279592.X · Mar 21, 2022 · national
Continuity (1)
Related Publication 20230297099A1 · Sep 21, 2023
References Cited (4)
US 20170068258A1 · Lyon · 2017 [cited by examiner]
US 20200042052A1 · Shabbir et al. · 2020 [cited by applicant]
US 20200378858A1 · Curtis et al. · 2020 [cited by applicant]
US 20210088404A1 · Li et al. · 2021 [cited by applicant]