Disk device
A disk device according to one embodiment includes a magnetic disk, a magnetic head, and a flexible printed circuit board. The flexible printed circuit board is electrically connected to the magnetic head. The flexible printed circuit board includes a first layer, a second layer having conductive property, and a third layer having insulation property. The first layer includes a first surface having insulation property. The second layer overlays the first surface, and includes a first conductor and a second conductor spaced from the first conductor. The third layer covers at least a part of the first surface and at least a part of the second layer. The flexible printed circuit board is provided with a first hole that is located between the first conductor and the second conductor with spacing from the second layer and penetrates the third layer.
1. A disk device comprising:
a magnetic disk;
a magnetic head configured to read and write information from and to the magnetic disk;
a flexible printed circuit board electrically connected to the magnetic head, the flexible printed circuit board including:
a first layer including a first surface having insulation property,
a second layer overlaying the first surface and having conductive property, the second layer including a first conductor and a second conductor spaced from the first conductor, and
a third layer having insulation property and covering at least a part of the first surface and at least a part of the second layer,
the flexible printed circuit board provided with a first hole that is located between the first conductor and the second conductor with spacing from the second layer and penetrates the third layer;
a first component connected to the first conductor;
solder attached to the second conductor;
a second component which is different from the first component and connected to the second conductor through the solder; and
an underfill extending between the first component and the flexible printed circuit board, wherein
the first hole is located between the underfill and the solder.
2. The disk device according to claim 1 , wherein
the first hole is empty.
3. The disk device according to claim 1 , wherein
the third layer with a second hole exposing the second conductor includes
a second surface facing the first surface, and
a third surface opposite the second surface and to which the second hole is open, and
the flexible printed circuit board includes a first protruding surface between the first conductor and the second conductor in a direction along the first surface, the first protruding surface protruding from the third surface.
4. The disk device according to claim 3 , wherein
the first hole is located between the first protruding surface and the second hole in the direction along the first surface.
5. The disk device according to claim 3 , wherein
the second layer includes ground wiring that is located between the first conductor and the second conductor and is electrically connected to a ground, and
the first protruding surface protrudes from the third surface along the ground wiring.
6. The disk device according to claim 3 , wherein
the first hole is located adjacent to an end of the first protruding surface in a direction in which the first protruding surface extends.
7. The disk device according to claim 3 , further comprising:
a wall having rigidity higher than the first layer and attached to the flexible printed circuit board, wherein
the wall has a fifth surface facing the flexible printed circuit board and a second protruding surface protruding from the fifth surface, and
the first protruding surface protrudes from the third surface along the second protruding surface.
8. The disk device according to claim 1 , further comprising:
a wall having rigidity higher than the first layer and attached to the flexible printed circuit board, wherein
the first layer is provided with a third hole located between the third layer and the wall, the third hole penetrating the first layer to communicate with the first hole, and
the wall is provided with a fourth hole penetrating the wall to communicate with the third hole.
9. The disk device according to claim 1 , wherein
the first component is an amplifier, and
the second component is a voice coil motor.
10. A disk device comprising:
a magnetic disk;
a magnetic head configured to read and write information from and to the magnetic disk;
a flexible printed circuit board electrically connected to the magnetic head, the flexible printed circuit board includes:
a first layer including a first surface having insulation property,
a second layer overlaying the first surface and having conductive property, the second layer including a first conductor and a second conductor spaced from the first conductor,
a third layer having insulation property, the third layer including a second surface facing the first surface and a third surface opposite the second surface, to cover at least a part of the first surface and at least a part of the second layer, and
a protrusion that is located between the first conductor and the second conductor in a direction along the first surface, and protrudes from the third surface;
a first component connected to the first conductor;
solder attached to the second conductor;
a second component which is different from the first component and connected to the second conductor through the solder; and
an underfill extending between the first component and the flexible printed circuit board, wherein
the protrusion is located between the underfill and the solder.
11. The disk device according to claim 10 , wherein
the first component is an amplifier, and
the second component is a voice coil motor.