IP Library › Granted Patent US 12,200,854
Granted Patent B2
US 12,200,854 · App. 17/933,494 · Granted Jan 14, 2025

Electronic assembly having both chassis and module dual-flow connectors and associated methods

Inventors: Voi Nguyen (Oviedo, FL); Charles Weirick (Melbourne, FL)
Assignee: EAGLE TECHNOLOGY, LLC
H05K1/0203F16L37/34F16L37/35H05K1/0272H05K7/20272
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Quick Facts
Patent No.
US 12,200,854
App. No.
17/933,494
Granted
Jan 14, 2025
Kind
B2
Abstract

An electronic assembly may include a chassis having electronic module mounting positions. Each mounting position may have associated therewith a chassis liquid dual-flow connector. A respective electronic module may be received in each electronic module mounting position and include a circuit board, a liquid cooling path associated with the circuit board, and a module liquid dual-flow connector coupled to the liquid cooling path and configured to be mateable with the chassis liquid dual-flow connector.

Claims (33)

1. An electronic assembly comprising:

a chassis having a plurality of electronic module mounting positions, each mounting position having associated therewith a chassis liquid dual-flow connector;

a respective electronic module received in each electronic module mounting position and comprising

a circuit board,

a liquid cooling path associated with the circuit board, and

a module liquid dual-flow connector coupled to the liquid cooling path and configured to be mateable with the chassis liquid dual-flow connector so that the chassis liquid dual-flow connector and module liquid dual-flow connector establish an inner liquid flow path before an outer liquid flow path when in a partially mated position.

2. The electronic assembly of claim 1 wherein the chassis liquid dual-flow connector and module liquid dual-flow connector define a quick disconnect connector arrangement.

3. The electronic assembly of claim 1 wherein the chassis liquid dual-flow connector comprises a chassis connector body and first and second chassis liquid valves carried thereby.

4. The electronic assembly of claim 3 wherein the first and second chassis liquid valves are in a closed position when the chassis liquid dual-flow connector is in an unmated position, and are in an open position when the chassis liquid dual-flow connector is in a fully mated position.

5. The electronic assembly of claim 1 wherein the module liquid dual-flow connector comprises a module connector body and first and second module liquid valves carried thereby.

6. The electronic assembly of claim 5 wherein the first and second module liquid valves are in a closed position when the module liquid dual-flow connector is in an unmated position, and are in an open position when the module liquid dual-flow connector is in a fully mated position.

7. The electronic assembly of claim 1 wherein the chassis comprises a backplane electrical connector; and wherein the electronic module comprises an electrical connector carried by the circuit board along a back edge thereof and mateable with the backplane electrical connector.

8. The electronic assembly of claim 7 wherein the module liquid dual-flow connector is on the back edge of the circuit board adjacent the electrical connector.

9. An electronic assembly comprising:

a chassis having a plurality of electronic module mounting positions, each mounting position having associated therewith a chassis liquid dual-flow connector;

a respective electronic module received in each electronic module mounting position and comprising

a circuit board,

a liquid cooling path associated with the circuit board, and

a module liquid dual-flow connector coupled to the liquid cooling path and configured to be mateable with the chassis liquid dual-flow connector in a quick disconnect connector arrangement;

the chassis liquid dual-flow connector and the module liquid dual-flow connector establishing an inner liquid flow path and an outer liquid flow path surrounding the inner liquid flow path when in a fully mated position, the chassis liquid dual-flow connector and module liquid dual-flow connector establishing the inner liquid flow path before the outer liquid flow path when in a partially mated position.

10. The electronic assembly of claim 9 wherein the chassis liquid dual-flow connector comprises a chassis connector body and first and second chassis liquid valves carried thereby.

11. The electronic assembly of claim 10 wherein the first and second chassis liquid valves are in a closed position when the chassis liquid dual-flow connector is in an unmated position, and are in an open position when the chassis liquid dual-flow connector is in a fully mated position.

12. The electronic assembly of claim 9 wherein the module liquid dual-flow connector comprises a module connector body and first and second module liquid valves carried thereby.

13. The electronic assembly of claim 12 wherein the first and second module liquid valves are in a closed position when the module liquid dual-flow connector is in an unmated position, and are in an open position when the module liquid dual-flow connector is in a fully mated position.

14. The electronic assembly of claim 9 wherein the chassis comprises a backplane electrical connector; and wherein the electronic module comprises an electrical connector carried by the circuit board along a back edge thereof and mateable with the backplane electrical connector.

15. The electronic assembly of claim 14 wherein the module liquid dual-flow connector is on the back edge of the circuit board adjacent the electrical connector.

16. A method of mounting an electronic module in a respective mounting position of a chassis, the mounting position having associated therewith a chassis liquid dual-flow connector, the electronic module comprising a circuit board, a liquid cooling path associated with the circuit board, and a module liquid dual-flow connector coupled to the liquid cooling path, the method comprising:

slidably mounting the electronic module in a respective mounting position of the chassis so that module liquid dual-flow connector removably mates with the chassis liquid dual-flow connector so that the chassis liquid dual-flow connector and module liquid dual-flow connector establish an inner liquid flow path before an outer liquid flow path when in a partially mated position.

17. The method of claim 16 wherein the chassis liquid dual-flow connector and the module liquid dual-flow connector define a quick disconnect connector arrangement.

18. The method of claim 16 wherein the chassis liquid dual-flow connector comprises a chassis connector body and first and second chassis liquid valves carried thereby.

19. The method of claim 18 wherein the first and second chassis liquid valves are in a closed position when the chassis liquid dual-flow connector is in an unmated position, and are in an open position when the chassis liquid dual-flow connector is in a fully mated position.

20. The method of claim 16 wherein the module liquid dual-flow connector comprises a module connector body and first and second module liquid valves carried thereby.

21. The method of claim 20 wherein the first and second module liquid valves are in a closed position when the module liquid dual-flow connector is in an unmated position, and are in an open position when the module liquid dual-flow connector is in a fully mated position.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2022
From: NGUYEN, VOI; WEIRICK, CHARLES
To: EAGLE TECHNOLOGY, LLC
Reel/Frame 061179/0821 →
Continuity (1)
Related Publication 20240098874A1 · Mar 21, 2024
References Cited (11)
US 345516A · Keller · 1969 [cited by examiner]
US 4732414A · Inaba · 1988 [cited by examiner]
US 7717470B1 · Pluymers · 2010 [cited by examiner]
US 10473252B2 · Oberdorfer · 2019 [cited by examiner]
US 11363738B2 · Thompson et al. · 2022 [cited by applicant]
US 11792959B2 · Gao · 2023 [cited by examiner]
US 20030034648A1 · Zitkowic, Jr. · 2003 [cited by examiner]
US 20070241560A1 · Malone · 2007 [cited by examiner]
US 20130049355A1 · Weinhold · 2013 [cited by examiner]
US 20230086534A1 · Gao · 2023 [cited by examiner]
US 20230089354A1 · Gao · 2023 [cited by examiner]