IP Library › Granted Patent US 12,202,193
Granted Patent B2
US 12,202,193 · App. 17/277,634 · Granted Jan 21, 2025

Meniscus-confined three-dimensional electrodeposition

Inventors: David Eliyahu (Tel Aviv, IL); Noam Eliaz (Tel Aviv, IL); Eliezer Gileadi (Tel Aviv, IL)
Assignee: RAMOT AT TEL-AVIV UNIVERSITY LTD.
B29C64/165B22F10/10B22F10/32B22F10/85B22F12/90B29C64/106B29C64/393B33Y10/00B33Y30/00B33Y50/02C25D1/003C25D5/04C25D21/12
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Quick Facts
Patent No.
US 12,202,193
App. No.
17/277,634
Granted
Jan 21, 2025
Kind
B2
Abstract

The invention relates to a process and a system for 3-dimentional (3D) fabrication of sub-micron structures and is established by local electrochemical deposition methods.

Claims (30)

1. A meniscus-confined electrochemical deposition method, the method comprising

dispensing through a deposition tool an amount of an electrolyte solution containing a reducible material onto a surface of a substrate, thereby forming a liquid bridge between a tip of the deposition tool and the surface,

causing said reducible material in the liquid bridge to undergo reduction,

measuring a change in a force applied on the deposition tool with respect to the substrate while the material is deposited, such that when a change in the force is measured/detected, the position of the deposition tool or the substrate is modified vertically with respect to the other, such that dispensing of a further amount of the electrolyte solution onto the reduced material does not detach the liquid bridge between the tip and the reduced material, and

repeating the method one or more times to afford a deposited object on the surface;

wherein the method is carried out under air or under an inert gas or wherein the method is carried out while the substrate is immersed completely or partially in an electrolyte bath.

2. The method according to claim 1 , the method comprising

(a) providing a deposition tool in a form of an electrolyte solution reservoir comprising a reducible form of at least one material, the deposition tool having an end tip for dispensing an amount of the electrolyte solution,

(b) positioning the tip at a distance from the surface of the substrate,

(c) dispensing a first amount of the electrolyte solution onto the surface of the substrate, thereby forming a liquid bridge between the tip and the substrate's surface, and

(d) causing reduction of the reducible form of the at least one material in the liquid bridge.

3. The method according to claim 2 , further comprising measuring a change in the force applied on the tip, and modifying the tip-to-substrate distance by normal or lateral movement.

4. The method according to claim 1 , wherein the deposition tool has a dispensing tip in the form of a micropipette with a microscopic or nanoscopic opening, said opening being optionally between 40 nm and 5 μm.

5. The method according to claim 1 , wherein the deposition tool comprises a plurality of reservoirs, each reservoir having different or independent dispensing tips.

6. The method according to claim 1 , wherein the deposition tool comprises a plurality of reservoirs, at least a portion or all of said plurality of reservoirs being connected to a single dispensing end.

7. The method according to claim 4 , wherein the micropipette is an AFM tip.

8. The method according to claim 4 , wherein the micropipette is in a form of a hollow glass tube.

9. The method according to claim 1 , for fabricating nanowires, high-density interconnects, sub-micron scale circuitry, conductive bridges and precise electrical connections, thermocouples, interposers, high-frequency terahertz antennas, probe arrays and precision sensors; for fabricating micro- or nano-electromechanical systems, batteries and fuel cells; or for repairing or modifying micro-sized or nano-sized features.

10. A meniscus-confined electrochemical deposition method, the method comprising

dispensing through a deposition tool an amount of an electrolyte solution containing a reducible material onto a surface of a substrate, thereby forming a liquid bridge between a tip of the deposition tool and the surface,

causing said reducible material in the liquid bridge to undergo reduction,

measuring a change in a force applied on the deposition tool with respect to the substrate while the material is deposited, such that when a change in the force is measured/detected, the position of the deposition tool or the substrate is modified vertically with respect to the other, such that a liquid bridge containing an amount of the electrolyte solution is maintained during dispensing of a further amount of the electrolyte solution onto the reduced material, and

repeating the method one or more times to afford a deposited object on the surface;

wherein the method is carried out under air or under an inert gas or wherein the method is carried out while the substrate is immersed completely or partially in an electrolyte bath.

11. The method according to claim 1 , further comprising measuring a change in a distance between the tip of the deposition tool and the surface.

12. The method according to claim 1 , wherein a tuning fork is used for determining a change in the force.

13. The method according to claim 11 , wherein the measuring of the change in distance is by use of a tuning fork.

14. The method according to claim 10 , further comprising measuring a change in a distance between the tip of the deposition tool and the surface.

15. The method according to claim 10 , wherein a tuning fork is used for determining a change in the force.

16. The method according to claim 14 , wherein the measuring of the change in distance is by use of a tuning fork.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2021
From: ELIYAHU, DAVID; ELIAZ, NOAM; GILEADI, ELIEZER
To: RAMOT AT TEL-AVIV UNIVERSITY LTD.
Reel/Frame 056708/0912 →
Continuity (2)
Provisional Application 62744148 · Oct 11, 2018
Related Publication 20210348288A1 · Nov 11, 2021
References Cited (28)
US 5641391A · Hunter · 1997 [cited by examiner]
US 6756109B2 · Warren · 2004 [cited by examiner]
US 7955486B2 · Yu · 2011 [cited by examiner]
US 20100300886A1 · Lin · 2010 [cited by examiner]
US 20130142566A1 · Yu · 2013 [cited by examiner]
WO 2017055338A1 · 2017 [cited by applicant]
Hirt et al, “Local surface modifications via confined electrochemical deposition with FluidFM” RSC Adv., 2015, 84517-84522. (Year: 2015). [cited by examiner]
Dmitry Momotenko et al., Write-Read 3D Patterning With a Dual-Channel Nanopipette, ACS Nano 2016, vol. 10, No. 9, pp. 8871-8878. [cited by applicant]
J.D. Madden and I.W. Hunter et al., Three-Dimensional Microfabrication by Localized Electrochemical Deposition, Journal of Microelectromechanical Systems, 1996, vol. 5, No. 1, pp. 24-32. [cited by applicant]
E.M. El-Giar et al., Localized Electrochemical Deposition of Copper Microstructure, Journal of the Electrochemical Society, 2000, vol. 147, No. 2, pp. 586-591. [cited by applicant]
A. Jansson et al., High-Resolution 3D Microstructures Made by Localized Electrodeposition of Nickel, Journal of the Electrochemical Society, 2000, vol. 147, No. 5, pp. 1810-1817. [cited by applicant]
S.H. Yeo and J.H. Choo, Effects of Rotor Electrode in the Fabrication of High Aspect Ratio Microstructures by Localized Electrochemical Deposition, Journal of Micromechanics and Microengineering, 2001, vol. 11, pp. 435-… [cited by applicant]
R.A. Said, Localized Electro-Deposition (LED): The March Toward Process Development, Nanotechnology, 2004, vol. 15, pp. S649-S659. [cited by applicant]
J.C. Lin et al., On the Structure of Micrometer Copper Features Fabricated by Intermittent Micro-Anode Guided Electroplating, Electrochimica Acta, 2009, vol. 54, No. 24, pp. 5703-5708. [cited by applicant]
M.M. Sundaram et al., Mask-less Electrochemical Additive Manufacturing: A Feasibility Study, Journal of Manufacturing Science and Engineering, 2015, Article 021006, vol. 137, 9 pages. [cited by applicant]
F. Wang et al., Effects of Applied Potential and the Initial Gap Between Electrodes on Localized Electrochemical Deposition of Micrometer Copper Columns, Scientific Reports, 2016, Article 26270, vol. 6, 8 pages. [cited by applicant]
T. Leïchlé et al., Copper Electrodeposition Localized in Picoliter Droplets Using Microcantilever Arrays, Applied Physics Letters, 2006, Article 254108, vol. 88, No. 25, 5 pages. [cited by applicant]
A.P. Suryavanshi and M.-F. Yu, Probe-Based Electrochemical Fabrication of Freestanding Cu Nanowire Array, Applies Physics Letters, 2006, Article 083103, vol. 88, 4 pages. [cited by applicant]
J. Hu and M.-F. Yu, Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds, Science, 2010, vol. 329, No. 5989, pp. 313-316. [cited by applicant]
S.K. Seol et al., Electrodeposition-Based 3D Printing of Metallic Microarchitectures With Controlled Internal Structures, Small, 2015, vol. 11, No. 32, p. 3896-8902. [cited by applicant]
Z. Yi et al., Vertical, Capacitive Microelectromechanical Switches Produced via Direct Writing of Copper Wires, Microsystems & Nanoengineering, 2016, Article 16010, vol. 2, 7 pages. [cited by applicant]
S. Morsali et al., Multi-Physics Simulation of Metal Printing at Micro/Nanoscale Using Meniscus-Confined Electrodeposition: Effect of Nozzle Speed and Diameter, Journal of Applied Physics, 2017, Article 214305, vol. 121… [cited by applicant]
A. Behroozfar et al., Microscale 3D Printing of Nanotwinned Copper, Advanced Materials, 2018, Article 2705107, vol. 30, 6 pages. [cited by applicant]
A. Meister et al., Nanodispenser for Attoliter Volume Deposition Using Atomic Force Microscopy Probes Modified by Focused-ion-beam Milling, Applied Physics Letters, 2004, vol. 85, No. 25, pp. 6260-6262. [cited by applicant]
A. Meister et al., FluidFM: Combining Atomic Force Microscopy and Nanofluidics in a Universal Liquid Delivery System for Single Cell Applications and Beyond, Nano Letters, 2009, vol. 9, No. 6, pp. 2501-2507. [cited by applicant]
L. Hirt et al., Template-Free 3D Microprinting of Metals Using a Force-Controlled Nanopipette for Layer-by-Layer Electrodeposition, Advanced Materials, 2016, vol. 28, No. 12, pp. 2311-2315. [cited by applicant]
J. C. Lin et al., Localized Electrochemical Deposition of Micrometer Copper Columns by Pulse Plating, Electrochimica Acta, 2010, vol. 55, No. 6. pp. 1888-1894. [cited by applicant]
S. Morsali et al., Multi-Physics Simulation of Metal Printing at Micro/Nanoscale Using Meniscus-Confined Electrodeposition: Effect of Environmental Humidity, Journal of Applied Physics, 2017, Article 24903, vol. 121, No… [cited by applicant]
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