IP Library › Granted Patent US 12,204,972
Granted Patent B2
US 12,204,972 · App. 17/942,601 · Granted Jan 21, 2025

Easily attachable RFID tag and method of making the same

Inventor: Kenneth F. Schoening (St. Charles, IL)
Assignee: A-1 PACKAGING SOLUTIONS, INC.
G06K19/07722G06K19/07773
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Quick Facts
Patent No.
US 12,204,972
App. No.
17/942,601
Granted
Jan 21, 2025
Kind
B2
Abstract

A location designation RFID tag for use in a storage facility includes an inlay, a first layer disposed on a first side of the inlay and having a first thickness, and a second layer disposed on a second side of the inlay. The first layer has a first thickness and the second layer has a second thickness. The inlay includes substrate, an antenna disposed on the substrate, and an integrated circuit disposed on the substrate. The location designation RFID tag may be easily and non-invasively placed and relocated on a floor of a storage facility in a manner that mitigates, and likely resolves, the issues experienced by known RFID tags when placed on a floor. Utilizing an inlay having a long, thin antenna, reduces the overall thickness of the location designation RFID tag, which allows layers to be disposed on the inlay that include a sufficient thickness to improve durability, mitigate detuning, and allow movable devices to readily pass over the location designation RFID tag.

Claims (46)

1. A location designation radio frequency identification (RFID) tag for use in a facility, the RFID tag comprising:

an inlay having a first side, a second side opposite the first side, the inlay further comprising:

an antenna,

an integrated circuit, and

a substrate, the antenna and the integrated circuit being disposed on the substrate;

a first layer disposed on the first side of the inlay, the first layer having a first thickness;

a second layer disposed on the second side of the inlay, the second layer having a second thickness; and

a first lamination layer disposed on the first layer such that the first layer is disposed between the first side of the inlay and the first lamination layer, the first lamination layer being coupled to a floor in the facility to encapsulate the inlay, the first layer, and the second layer between the floor and the first lamination layer.

2. The location designation RFID tag of claim 1 , further comprising a printing layer fixedly disposed on the first layer such that the printing layer accepts printing.

3. The location designation RFID tag of claim 1 , wherein the second layer has a first side and a second side, the first side being disposed near the inlay and the second side being disposed opposite the inlay, and

wherein the second side of the second layer includes an adhesive disposed thereon.

4. The location designation RFID tag of claim 1 , wherein the inlay includes a length between 1 to 10 inches and a width between 0.10 to 10 inch.

5. The location designation RFID tag of claim 1 , wherein the inlay includes a length between 3 to 4 inches and a width between 0.10 to 1 inch.

6. The location designation RFID tag of claim 1 , wherein the inlay includes a length approximately equal to 3.55 inches and a width approximately equal to 0.75 inch.

7. The location designation RFID tag of claim 1 , wherein the first thickness is approximately between 0.10 inches and 0.30 inches.

8. The location designation RFID tag of claim 1 , wherein the first thickness is approximately 0.1095 inches.

9. The location designation RFID tag of claim 1 , wherein the second thickness is approximately between 0.10 inches and 0.300 inches.

10. The location designation RFID tag of claim 1 , wherein the second thickness is approximately 0.1095 inches.

11. The location designation RFID tag of claim 1 , wherein the first layer is attached to the inlay using a first adhesive and the second layer is attached to the inlay using a second adhesive.

12. The location designation RFID tag of claim 11 , wherein the first and second adhesives are the same.

13. The location designation RFID tag of claim 1 , further comprising a second lamination layer disposed on the second layer.

14. The location designation RFID tag of claim 11 , wherein the adhesive is cyanoacrylates, structural acrylic, or epoxy.

15. The location designation RFID tag of claim 1 , having a length in a first direction, a width in a second direction that is perpendicular to the first direction, and a thickness in a third direction that is perpendicular to the first and second direction,

wherein the length is between 2 and 10 inches, the width is between 0.5 and 5 inches, and the thickness is between 0.10 and 0.30 inches.

16. The location designation RFID tag of claim 15 , wherein the length is approximately 4 inches, the width is approximately 1 inch, and the thickness is approximately 0.236 inches.

17. The location designation RFID tag of claim 1 , wherein the first thickness is substantially equal to the second thickness.

18. The location designation RFID tag of claim 1 , wherein the first thickness is less than the second thickness.

19. The location designation RFID tag of claim 1 , wherein the first layer is a semi-rigid polyester, a rigid polyvinyl chloride (PVC), a polycarbonate, a polyethylene, or a polypropylene.

20. A method of reading at least one location designation RFID tag disposed on a floor of a facility having a mobile device disposed therein, the method comprising:

associating each of a plurality of location designation RFID tags with respective location information for corresponding ones of a plurality of locations;

placing the plurality of location designation RFID tag at the corresponding ones of the plurality of locations on the floor of the facility, each of the plurality of location designation RFID tags including an inlay including an antenna and an integrated circuit, a first side, and a second side opposite the first side, a first layer disposed on the first side of the inlay having a first thickness, a second layer disposed on the second side of the inlay having a second thickness, and a first lamination layer disposed on the first layer, the first layer disposed between the first lamination layer and the first side of the inlay, the first lamination layer being coupled to ene of the floor of the facility to encapsulate the inlay, the first layer, and the second layer between the floor and the first lamination layer, each of the plurality of location designation RFID tags having a length in a first direction and a width in a second direction perpendicular to the first direction;

reading, via a reader disposed on the mobile device, at least one location designation RFID tag from among the plurality of location designation RFID tags as the mobile device travels over or near the at least one location designation RFID tag;

detecting, based on the reading of the at least one location designation RFID tag and based on corresponding location information associated with the at least one RFID tag, a location within the facility.

21. The method of claim 20 , wherein the placing the plurality of location designation RFID tags comprises orienting each of the plurality of location designation RFID tags such that the lengths of the plurality of location designation RFID tags are perpendicular to a direction of travel of the mobile device.

22. The method of claim 20 , wherein the reading comprises orienting the reader on the mobile device such that the reader is perpendicular to the length of the at least one location designation RFID tag.

23. The method of claim 20 , wherein the placing the at least one location designation RFID tag comprises placing at first location designation RFID tag at least twelve (12) inches away from a second location designation RFID tag from among the plurality of location designation RFID tags.

24. The method of claim 23 , wherein the placing the at least one location designation RFID tag comprises orienting the first location designation RFID tag in parallel with the second location designation RFID tag.

25. A method of manufacturing at least one location designation RFID tag for use on a floor in a facility, the method comprising:

providing a supply of inlays disposed on a carrier sheet, a supply of first layers, and a supply of second layers;

coupling the supply of inlays at a first location of a conveyer belt, the supply of first layer at a second location on the conveyer belt, and the supply of second layers at a third location on the conveyer belt;

attaching a first layer from the supply of first layers to a first side of the carrier sheet, each first layer in the supply of first layers having a first thickness;

attaching a second layer from the supply of second layers to a second side of the carrier sheet, each second layer in the supply of second layers having a second thickness, such that the at least one inlay is disposed between the first layer and the second layer; and

applying a first lamination layer to the first layer such that the first layer is disposed between the first lamination layer and the inlay, and such that the first lamination layer encapsulates the inlay, the first layer, and the second layer between the floor and the first lamination layer when the at least one location designation RFID tag is placed on the floor in the facility.

26. The method of claim 25 , further comprising attaching a printing layer onto either the first layer or the second layer.

27. The method of claim 25 , further comprising applying an adhesive to at least one of the first layer and the second layer.

28. The method of claim 25 , further comprising applying a second lamination layer to the second layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2022
From: SCHOENING, KENNETH F.
To: A-1 PACKAGING SOLUTIONS, INC.
Reel/Frame 061071/0841 →
Continuity (3)
Continuation 16855587 · Apr 22, 2020
Provisional Application 62837138 · Apr 22, 2019
Related Publication 20230010878A1 · Jan 12, 2023
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