IP Library › Granted Patent US 12,207,445
Granted Patent B2
US 12,207,445 · App. 18/154,858 · Granted Jan 21, 2025

Two-phase immersion-type composite heat dissipation device

Inventors: Chun-Te Wu (New Taipei, TW); Ching-Ming Yang (New Taipei, TW); Yu-Wei Chiu (New Taipei, TW); Tze-Yang Yeh (New Taipei, TW)
Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
H05K7/20409H05K7/203
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Quick Facts
Patent No.
US 12,207,445
App. No.
18/154,858
Granted
Jan 21, 2025
Kind
B2
Abstract

A two-phase immersion-type composite heat dissipation device is provided, which includes a heat dissipation substrate, a plurality of fins, and a surface porous layer. The heat dissipation substrate has a first surface and a second surface. The first surface is configured to be in contact with a heat source, and the second surface is opposite to the first surface and is distant from the heat source. A projection region of the heat dissipation substrate that corresponds to the heat source is defined as a high-temperature region, and a low-temperature region is defined at an outer periphery of the high-temperature region. The fins are opposite to the heat source, and are disposed within the high-temperature region of the second surface of the heat dissipation substrate. The surface porous layer is disposed within a range of the low-temperature region of the heat dissipation substrate.

Claims (13)

1. A two-phase immersion-type composite heat dissipation device, comprising:

a heat dissipation substrate having a first surface and a second surface, wherein the first surface is configured to be in contact with a heat source, and the second surface is opposite to the first surface and is distant from the heat source; wherein a projection region of the heat dissipation substrate that corresponds to the heat source is defined as a high-temperature region, and a low-temperature region is defined at an outer periphery of the high-temperature region;

a plurality of fins opposite to the heat source and disposed within the high-temperature region of the second surface of the heat dissipation substrate; and

a surface porous layer disposed within a range of the low-temperature region of the heat dissipation substrate.

2. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein a material of the fins is made from copper, a copper alloy, aluminum, or an aluminum alloy.

3. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the fins are formed by one of following manufacturing processes: a bending process, a forging process, an extrusion process, or a powder sintering process.

4. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the fins have a height greater than 3 mm and a porosity less than 15%.

5. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the fins cover 90% of a region that is located directly above the heat source.

6. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein a material of the surface porous layer is made from copper, a copper alloy, an aluminum alloy, graphite, or silver.

7. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the surface porous layer is arranged on the second surface, and covers 70% of a surface area of the second surface aside from the surface area occupied by the fins.

8. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the surface porous layer is arranged on the first surface, and covers 20% of a surface area of the first surface aside from the surface area occupied by an orthogonal projection of the heat source.

9. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the surface porous layer has a thickness less than 1.2 mm and a porosity greater than 40%.

10. The two-phase immersion-type composite heat dissipation device according to claim 1 , wherein the surface porous layer is formed by one of following manufacturing processes: a metal mesh process, a chemical etching process, a powder sintering process in cooperation with a pore-forming agent, a chemical deposition process, an electroplating process, a vapor deposition process, or a machining process.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2023
From: WU, CHUN-TE; YANG, CHING-MING; CHIU, YU-WEI; YEH, TZE-YANG
To: AMULAIRE THERMAL TECHNOLOGY, INC.
Reel/Frame 062379/0583 →
Continuity (1)
Related Publication 20240244797A1 · Jul 18, 2024
References Cited (2)
US 7802437B2 · Gruss · 2010 [cited by examiner]
US 20060032622A1 · Yen · 2006 [cited by examiner]