IP Library › Granted Patent US 12,208,471
Granted Patent B2
US 12,208,471 · App. 18/065,356 · Granted Jan 28, 2025

Solder materials including supercooled micro-capsules and alloyed particles

Inventors: Martin Thuo (Ames, IA); Ian Tevis (Ames, IA); Dana Drochner (Boone, IA)
Assignee: THE INDIUM CORPORATION OF AMERICA
B23K35/0244B22F1/09B22F1/16B22F1/17B23K35/262B23K35/264B22F2301/30
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Quick Facts
Patent No.
US 12,208,471
App. No.
18/065,356
Granted
Jan 28, 2025
Kind
B2
Abstract

A material includes a plurality of supercooled micro-capsules each including a metallic core in a liquid state at a temperature below a solidification temperature of the metallic core and further includes a metallic shell surrounding each respective metallic core. A plurality of alloyed metallic particles and flux are mixed with the plurality of supercooled micro-capsules to form a solder paste. Upon heating the solder paste, the plurality of alloyed particles melt. As the metallic shells destabilize, the liquid metallic cores interdiffuse with the melted alloyed particles forming a new alloy that has a higher melting temperature than the melting temperature of the alloyed metallic particles.

Claims (28)

1. A material comprising:

a plurality of supercooled micro-capsules each including a metallic core in a liquid state at a temperature below a solidification temperature of the metallic core;

a plurality of alloyed metallic particles; and

a flux.

2. The material of claim 1 wherein each of the plurality of supercooled micro-capsules include a respective metallic shell in a solid-state.

3. The material of claim 2 wherein a dissolution of at least a portion of the metallic shells of the plurality of supercooled micro-capsules causes at least partial dissolution of the plurality of alloyed metallic particles, forming a resulting alloy.

4. The material of claim 3 wherein the dissolution occurs at a temperature above a melting temperature of the plurality of alloyed metallic particles.

5. The material of claim 3 wherein the resulting alloy has a melting temperature above a melting temperature of the plurality of alloyed metallic particles.

6. The material of claim 1 wherein a percent by weight of the plurality of supercooled micro-capsules is less than a percent by weight of the plurality of alloyed metallic particles.

7. A method of forming a material comprising:

providing a plurality of supercooled micro-capsules each having a shell and a liquid metal core;

providing a plurality of solid metallic particles having a melting point lower than a melting point of the shell; and

creating a mixture of the plurality of supercooled micro-capsules and the plurality of solid metallic particles.

8. The method of claim 7 , wherein when the mixture is heated to a temperature below a melting point of the shell, the plurality of solid metallic particles transition to a liquid state.

9. The method of claim 8 wherein while the solid metallic particles are within the liquid state, at least a portion of the shells of the plurality of solid metallic particles are dissolved such that the liquid metal cores are intermixed with the plurality of solid metallic particles that are in a liquid state to create a resulting alloy.

10. The method of claim 9 wherein the resulting alloy has a melting temperature above a melting temperature of the plurality of solid metallic particles.

11. The method of claim 8 wherein the solid to liquid phase transformation occurs at a temperature below a melting temperature of the liquid metal core.

12. The method of claim 7 wherein a percent by weight of the plurality of supercooled micro-capsules is less than a percent by weight of the plurality of solid metallic particles.

13. A material comprising:

a plurality of micro-capsules each including a metallic shell surrounding a metallic core, wherein the metallic core is in a liquid state at a temperature below a solidification temperature of the metallic core; and

a plurality of metallic particles in a solid state.

14. The material of claim 13 further comprising a flux.

15. The material of claim 13 wherein at least a portion of metallic shells of the plurality of micro-capsules are configured to destabilize at a temperature equal to or above a melting temperature of the plurality of metallic particles.

16. The material of claim 15 wherein the destabilization of at least a portion of the metallic shells of the plurality of micro-capsules enables at least a portion of the metallic cores of the plurality of micro-capsules to intermix with at least a portion of the plurality of metallic particles that are in a liquid state to form an alloy.

17. The material of claim 16 wherein the alloy has a melting temperature that is greater than a melting temperature of the plurality of metallic particles.

18. The material of claim 13 wherein the micro-capsules are formed from a combination of bismuth, tin and indium.

19. The material of claim 13 wherein the plurality of metallic particles are formed from an alloy of bismuth, tin and indium.

20. The material of claim 13 wherein a percent by weight of the plurality of micro-capsules is less than a percent by weight of the plurality of metallic particles.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2023
From: SAFI-TECH, INC.
To: THE INDIUM CORPORATION OF AMERICA
Reel/Frame 064455/0785 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2023
From: THUO, MARTIN; TEVIS, IAN; DROCHNER, DANA
To: SAFI-TECH, INC.
Reel/Frame 062259/0620 →
Continuity (3)
Provisional Application 63373379 · Aug 24, 2022
Provisional Application 63265344 · Dec 13, 2021
Related Publication 20230182236A1 · Jun 15, 2023
References Cited (5)
US 20160317992A1 · Thuo · 2016 [cited by examiner]
US 20170014958A1 · Thuo · 2017 [cited by examiner]
US 20180354037A1 · Thuo · 2018 [cited by examiner]
US 20190203327A1 · Thuo · 2019 [cited by examiner]
Durafuse LT, “Indium Corporation, Available Online at: https://www.indium.com/products/solders/solder-alloys/durafuse/”, Dec. 2, 2021, 6 pages. [cited by applicant]