Multiple charged-particle beam apparatus with low crosstalk
Systems and methods of forming images of a sample using a multi-beam apparatus are disclosed. The method may include generating a plurality of secondary electron beams from a plurality of probe spots on the sample upon interaction with a plurality of primary electron beams. The method may further include adjusting an orientation of the plurality of primary electron beams interacting with the sample, directing the plurality of secondary electron beams away from the plurality of primary electron beams, compensating astigmatism aberrations of the plurality of directed secondary electron beams, focusing the plurality of directed secondary electron beams onto a focus plane, detecting the plurality of focused secondary electron beams by a charged-particle detector, and positioning a detection plane of the charged-particle detector at or close to the focus plane.
1. A method performed by a multi-beam apparatus to form images of a sample, the method comprising:
generating a plurality of secondary electron beams from a plurality of probe spots on the sample along a primary-optical axis upon interaction with a plurality of primary electron beams;
focusing the plurality of secondary electron beams onto a focus plane; and
positioning a detection surface of a secondary electron detector with respect to the focus plane.
2. The method of claim 1 , further comprising adjusting an electrical excitation of a stigmator to compensate astigmatism aberration of the plurality of secondary electron beams.
3. A multi-beam apparatus for inspecting a sample using a plurality of primary electron beams configured to form a plurality of probe spots on the sample, the multi- beam apparatus comprising:
a secondary electron projection system configured to:
receive a plurality of secondary electron beams resulting from the formation of the probe spots, and form images of the plurality of probe spots on the sample on a final image plane; and
a secondary electron detector configured to detect the plurality of secondary electron beams, wherein a position of the secondary electron detector is set based on a position of the final image plane.
4. The multi-beam apparatus of claim 3 , wherein the plurality of secondary electron beams comprises an array of secondary electron beams.
5. The multi-beam apparatus of claim 3 , further comprising an objective lens configured to focus the plurality of primary electron beams on the sample and form images of the plurality of probe spots on an intermediate image plane along a primary optical axis.
6. The multi-beam apparatus of claim 3 , further comprising a beam separator configured to direct the plurality of secondary electron beams towards the secondary electron detector along a secondary optical axis.
7. The multi-beam apparatus of claim 3 , further comprising a stigmator configured to compensate astigmatism aberration of the plurality of secondary electron beams.
8. The multi-beam apparatus of claim 3 , wherein the secondary electron detector is disposed downstream of the secondary electron projection system.
9. The multi-beam apparatus of claim 3 , wherein the secondary electron detector comprises a plurality of detection elements, and wherein a detection element of the plurality of detection elements is associated with a corresponding secondary electron beam of the plurality of secondary electron beams.
10. The multi-beam apparatus of claim 3 , wherein a setting of a position of the secondary electron detector comprises an adjusted tilting angle between a detection plane of the secondary electron detector and the final image plane.
11. The multi-beam apparatus of claim 10 , wherein the setting of the position of the secondary electron detector comprises a reduced tilting angle between the detection plane and the final image plane.
12. The multi-beam apparatus of claim 11 , wherein the reduced tilting angle comprises the setting of the position of the secondary electron detector such that the detection plane substantially coincides with the final image plane.
13. The multi-beam apparatus of claim 10 , wherein the setting of the position of the secondary electron detector further comprises a dynamically adjusted tilting angle based on a collection efficiency of the secondary electron detector.
14. The multi-beam apparatus of claim 10 , wherein the setting of the position of the secondary electron detector further comprises a predetermined value of the tilting angle.
15. The multi-beam apparatus of claim 3 , wherein the final image plane comprises a curved plane.
16. The multi-beam apparatus of claim 13 , wherein the tilting angle of the secondary electron detector is adjusted during the inspection of the sample.
17. The multi-beam apparatus of claim 14 , wherein the position of the secondary electron detector is adjusted to the predetermined value prior to the inspection of the sample.