Method for forming fin structure in fin field effect transistor process and fin structure
View Patent ↗The application discloses a method for forming a fin structure in a fin field effect transistor process, which includes: performing photolithography and etching for a first time to form a first core layer pattern and a second core layer pattern, and depositing an etching mask layer; etching back the etching mask layer to form sidewalls of the first core layer pattern and sidewalls of the second core layer pattern; performing photolithography for a second time; etching the substrate for a first time to form fins and a planar active area consisting of a substrate material; removing sidewalls of a first photoresist pattern, a second photoresist pattern and the second core layer pattern, and reserving the second core layer pattern; performing photolithography for a third time; etching the substrate for a second time to form reference layer overlay mark and a fin cut area consisting of the substrate material.
1. A method for forming a fin structure in a fin field effect transistor process, comprising:
step S 1 : growing a core layer thin film on a substrate;
step S 2 : performing photolithography and etching for a first time to form a first core layer pattern and a second core layer pattern, the first core layer pattern being used to form fins and the second core layer pattern being used to form a reference layer overlay mark;
step S 3 : depositing an etching mask layer, the etching mask layer covering tops and side surfaces of the first core layer pattern and the second core layer pattern, and a surface of the substrate;
step S 4 : etching back the etching mask layer to form sidewalls of the first core layer pattern and sidewalls of the second core layer pattern;
step S 5 : performing photolithography for a second time to form a first photoresist pattern and a second photoresist pattern, the first photoresist pattern being used to form a planar active area and the second photoresist pattern covering the second core layer pattern;
step S 6 : removing the first core layer pattern, reserving the sidewalls of the first core layer pattern, and reserving the second photoresist pattern and the first photoresist pattern;
step S 7 : etching the substrate for a first time to form the fins and the planar active area consisting of a substrate material;
step S 8 : removing the first photoresist pattern, the second photoresist pattern, and the sidewalls of the second core layer pattern, and reserving the second core layer pattern;
step S 9 : performing photolithography for a third time to form a third photoresist pattern which covers all of the planar active area and fins outside a fin cut area, and expose the second core layer pattern and the fins inside the fin cut area; and
step S 10 : etching the substrate for a second time to form at least one reference layer overlay mark and the fin cut area consisting of the substrate material.
2. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein the core layer thin film is one of a single-layer dielectric film layer, a single-layer metal film layer, or a single-layer metal compound film layer.
3. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein the core layer thin film is a multilayer film layer and the multilayer film layer consists of a dielectric film layer and/or a metal film layer and/or a metal compound film layer.
4. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein the core layer thin film is amorphous silicon.
5. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein, in step S 1 , at least one hard mask layer is grown before and/or after the core layer thin film is grown.
6. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein, in step S 2 , the photolithography for the first time is used as a reference layer for a subsequent photolithography layer alignment and overlay; and on a mask used in the photolithography for the first time, one or more reference layer overlay mark patterns with different widths or types are capable of being designed according to process requirements.
7. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein the second core layer pattern comprises a plurality of second core layer patterns, and widths of the second core layer patterns are different.
8. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein the second core layer pattern comprises a plurality of second core layer patterns, and types of the second core layer patterns are different.
9. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein an etching selection ratio of a material of the etching mask layer to a material of the core layer thin film is more than 3:1.
10. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein an etching selection ratio of a material of the etching mask layer to the substrate material is more than 3:1.
11. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein, in step S 4 , after the etching mask layer is etched back, the tops of the first core layer pattern and the second core layer pattern and the surface of the substrate are exposed.
12. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein an etching selection ratio of a material of the first core layer pattern to a material of the sidewalls of the first core layer pattern is more than 3:1.
13. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein an etching selection ratio of a material of the first core layer pattern to a material of the first photoresist pattern and a material of the second photoresist pattern is more than 3:1.
14. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein, in step S 7 , the substrate is etched for the first time by using the sidewalls of the second photoresist pattern, the first photoresist pattern, and the first core layer pattern as an etching mask.
15. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein, in step S 10 , the substrate is etched for the second time by using the third photoresist pattern and the second core layer pattern as an etching mask.
16. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein a width of the reference layer overlay mark is determined by a width of the second core layer pattern.
17. The method for forming the fin structure in the fin field effect transistor process according to claim 1 , wherein a type of the reference layer overlay mark is determined by a type of the second core layer pattern.
18. The fin structure of a fin field effect transistor, wherein the fin structure is fabricated by adopting the method of claim 1 .
19. The fin structure of the fin field effect transistor according to claim 18 , wherein the fin structure comprises the fins, the planar active area, the fin cut area, and the reference layer overlay mark consisting of the substrate material, and wherein a width of the reference layer overlay mark is greater than a width of the fin structure.
20. The fin structure of the fin field effect transistor according to claim 18 , wherein a width of the reference layer overlay mark is greater than a minimum width capable of being recognized by an overlay accuracy measuring machine.