Substrate processing apparatus for manufacturing semiconductor device
A substrate processing apparatus according to the embodiment includes: a substrate holding unit that holds a substrate; a rotation support unit that supports the substrate holding unit and rotates the substrate n a circumferential direction; a drive unit that drives the substrate holding unit with respect to the rotation support unit in a plane direction of the substrate; a detection unit that detects an outer edge portion of the substrate; a chemical liquid discharge unit that discharges a chemical liquid to the outer edge portion of the substrate; and a control unit that causes the drive unit to drive the substrate holding unit based on the outer edge portion detected by the detection unit in a manner that a center position in a plane of the substrate matches a rotation axis of the rotation support unit.
1. A substrate processing apparatus comprising:
a substrate holder that holds a substrate;
a supporter including a rotary motor that supports the substrate holder and rotates the substrate held by the substrate holder in a circumferential direction;
a driver that drives the substrate holder with respect to the supporter in a first direction and a second direction, the first direction extending along a plane of the substrate, the second direction extending along the plane of the substrate and intersecting the first direction;
a detector that detects an outer edge portion of the substrate held by the substrate holder;
a chemical liquid discharger that discharges a chemical liquid to the outer edge portion of the substrate held by the substrate holder;
a controller configured to cause the driver to drive the substrate holder in the first direction and the second direction based on the outer edge portion detected by the detector in a manner that a center position in the plane of the substrate held by the substrate holder matches a rotation axis of the supporter; and
vacuum chucks that fix a position of the substrate in the plane direction with respect to the substrate holder and fix a position of the substrate holder in the plane direction with respect to the supporter,
wherein during a position correction processing of the substrate, the controller is configured to maintain the plane of the substrate along the first direction and the second direction by maintaining that the position of the substrate in the plane direction is fixed with respect to the substrate holder by the locking mechanism, and
the supporter rotates the driver and the vacuum chucks with the substrate holder.
2. The substrate processing apparatus according to claim 1 , wherein the vacuum chucks include
a first vacuum chuck that fixes the position of the substrate in the plane direction with respect to the substrate holder, and
a second vacuum chuck that fixes the position of the substrate holder in the plane direction with respect to the supporter.
3. The substrate processing apparatus according to claim 2 , wherein
the first vacuum chuck is a first chuck that extends from the supporter to the substrate holder, reaches a back surface of the substrate and chucks the substrate to the substrate holder.
4. The substrate processing apparatus according to claim 3 , wherein
the first chuck has flexibility in a connection portion between the supporter and the substrate holder.
5. The substrate processing apparatus according to claim 2 , wherein
the driver is fixed to the supporter, and
the second vacuum chuck is a second chucking mechanism that extends from the supporter to the driver, reaches a back surface of the substrate holder and chucks the substrate holder to the driver.
6. The substrate processing apparatus according to claim 2 , wherein
in a meantime of detecting the outer edge portion by the detector and in a meantime of discharging the chemical liquid from the chemical liquid discharger to the outer edge portion, the controller is configured to fix the position of the substrate with respect to the substrate holder by the first vacuum chuck and fix the position of the substrate holder with respect to the supporter by the second vacuum chuck.
7. The substrate processing apparatus according to claim 2 , wherein
in a meantime of aligning the center position of the substrate and the rotation axis by the driver, the controller is configured to fix the position of the substrate with respect to the substrate holder by the first vacuum chuck and not fix the position of the substrate holder with respect to the supporter by releasing the second vacuum chuck.
8. The substrate processing apparatus according to claim 1 , wherein the controller is configured to
cause the detector to detect the outer edge portion at a plurality of places in the circumferential direction, and
align the center position of the substrate and the rotation axis by the driver based on positions of the plurality of places of the outer edge portion detected by the detector.
9. The substrate processing apparatus according to claim 1 , wherein the detector is a laser sensor including
a light projector that projects laser light toward the outer edge portion, and
a light receiver that receives the laser light projected from the light projector.
10. The substrate processing apparatus according to claim 9 , wherein
the controller is configured to specify the center position of the substrate with respect to the rotation axis based on a width of the laser light received by the light receiver in a direction toward a center position in the plane direction of the substrate holder.
11. The substrate processing apparatus according to claim 1 , wherein
the detector is an imaging device that takes an image of the outer edge portion.
12. The substrate processing apparatus according to claim 11 , wherein
the controller is configured to specify the center position of the substrate with respect to the rotation axis based on a width, in a direction toward a center position in the plane direction of the substrate holder, of the substrate occupying the image of the outer edge portion taken by the imaging device.
13. The substrate processing apparatus according to claim 1 , wherein
an area of a plane of the substrate holder on which the substrate is placed is smaller than an area of a discharge surface of the chemical liquid of the substrate.
14. The substrate processing apparatus according to claim 1 , wherein
the chemical liquid discharger discharges at least one of a removal liquid for removing a film formed on the substrate from the outer edge portion and a raw material liquid as a raw material of a film to be formed on the outer edge portion.