IP Library Granted Patent US 12,224,200
Granted Patent B2
US 12,224,200 · App. 17/394,868 · Granted Feb 11, 2025

Substrate treating apparatus

Inventors: Ji Hoon Jeong (Hwaseong-si, KR); Won-Geun Kim (Goyang-si, KR); Young Dae Chung (Incheon, KR); Jee Young Lee (Suwon-si, KR); Tae Shin Kim (Suwon-si, KR)
Assignee: SEMES CO., LTD.
H01L21/68764H01L21/67098
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,224,200
App. No.
17/394,868
Granted
Feb 11, 2025
Kind
B2
Abstract

The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a beam to the substrate and heat the substrate, and the heating unit further includes an irradiation part that irradiates the beam, and a rotation part that rotates the beam.

Claims (52)

1. A substrate treating apparatus comprising:

a support unit configured to support a substrate; and

a heating unit configured to irradiate a beam to the substrate and heat the substrate,

wherein the heating unit further includes:

an irradiation part configured to irradiate the beam; and

a rotation part configured to rotate the beam and including a pair of cylindrical lenses located on a travel path of the beam irradiated by the irradiation part; wherein the pair of cylindrical lenses are configured to be rotatable and rotational directions of the pair of cylindrical lenses are the same;

wherein the support unit and the heating unit are arranged on the same side with respect to the substrate.

2. The substrate treating apparatus of claim 1 , wherein each of the cylindrical lenses has a shape, one surface of which is a planar surface that is flat, and an opposite surface of which is a curved surface.

3. The substrate treating apparatus of claim 2 , wherein the planar surface of any one of the pair of cylindrical lenses and the planar surface of the other of the pair of cylindrical lenses face each other.

4. The substrate treating apparatus of claim 1 , wherein the heating unit further includes:

a reflection part configured to reflect the beam that passed through the rotation part in a direction that faces the substrate.

5. The substrate treating apparatus of claim 4 , wherein the reflection part includes:

a reflective mirror, of which a surface, to which the beam is input, has a flat or deflected shape.

6. The substrate treating apparatus of claim 5 , wherein the heating unit further includes:

a dispersion part configured to disperse the beam reflected by the reflection part.

7. The substrate treating apparatus of claim 6 , wherein the dispersion part includes:'

a lens barrel; and

one or more dispersion lenses housed in the lens barrel.

8. The substrate treating apparatus of claim 7 , wherein a plurality of dispersion lenses are provided, and a relative distance of the plurality of dispersion lenses is variable.

9. The substrate treating apparatus of claim 8 , wherein the support unit further includes:

a transmission plate formed of a transparent material; and

a chuck pin configured to chuck the substrate while an upper surface of the transmission plate and a lower surface of the substrate are spaced apart from each other, and

wherein the beam irradiated by the irradiation part is irradiated to the lower surface of the substrate.

10. The substrate treating apparatus of claim 9 , wherein the support unit further includes:

a support member configured to support an edge of the transmission plate; and

a rotation member configured to rotate the support member.

11. A substrate treating apparatus comprising:

a support unit configured to support a substrate and optionally rotate the substrate;

a liquid supply unit configured to supply a treatment liquid to the substrate; and

a heating unit configured to irradiate a beam to the substrate and heat the substrate, and

wherein the heating unit includes:

an irradiation part configured to irradiate the beam; and

a rotation part configured to rotate the beam and including a pair of cylindrical lenses located on a travel path of the beam irradiated by the irradiation part; wherein the pair of cylindrical lenses are configured to be rotatable and rotational directions of the pair of cylindrical lenses are the same;

wherein the support unit and the heating unit are arranged on the same side with respect to the substrate.

12. The substrate treating apparatus of claim 11 , wherein the support unit further includes:

a transmission plate formed of a transparent material; and

a chuck pin configured to chuck the substrate while an upper surface of the transmission plate and a lower surface of the substrate are spaced apart from each other, and

wherein the beam irradiated by the irradiation part is irradiated to the lower surface of the substrate.

13. The substrate treating apparatus of claim 12 , wherein the support unit further includes:

a support member configured to support an edge of the transmission plate; and

a rotation member configured to rotate the support member.

14. The substrate treating apparatus of claim 11 , wherein each of the cylindrical lenses has a shape, one surface of which is a planar surface that is flat, and an opposite surface of which is a curved surface.

15. A substrate treating apparatus comprising:

a support member configured to support a substrate and formed of a transparent material; and

a heating unit configured to heat the substrate by irradiating a laser beam to a lower surface of the substrate supported by the support member,

wherein the heating unit includes:

an irradiation part configured to irradiate the laser beam; and

a rotation part configured to rotate the laser beam, and

wherein the rotation part includes:

a cylindrical lens located on a travel path of the laser beam irradiated by the irradiation part and configured to be rotatable.

16. The substrate treating apparatus of claim 15 , wherein rotational directions of the cylindrical lenses are the same, and

wherein each of the cylindrical lenses has a shape, one surface of which is a planar surface that is flat, and an opposite surface of which is a curved surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2021
From: JEONG, JI HOON; KIM, WON-GEUN; CHUNG, YOUNG DAE; LEE, JEE YOUNG; KIM, TAE SHIN
To: SEMES CO., LTD.
Reel/Frame 057093/0921 →
Priority Claims (1)
KR 10-2020-0106800 · Aug 25, 2020 · national
Continuity (1)
Related Publication 20220068698A1 · Mar 3, 2022
References Cited (13)
US 20110284510A1 · Reeves-Hall · 2011 [cited by examiner]
US 20200251359A1 · Wakabayashi · 2020 [cited by examiner]
JP 2003031517A · 2003 [cited by applicant]
JP 2013153061A · 2013 [cited by applicant]
JP 5294916B2 · 2013 [cited by applicant]
JP 2014515501A · 2014 [cited by applicant]
KR 1020140135127A · 2014 [cited by applicant]
KR 1020160099165A · 2016 [cited by applicant]
KR 102008311B1 · 2019 [cited by applicant]
KR 1020210047010A · 2021 [cited by applicant]
WO WO2004112107A1 · 2004 [cited by applicant]
Korean Patent Office, Office action issued on Oct. 25, 2022. [cited by applicant]
Korean Patent Office, Notice of Allowance issued on Apr. 6, 2023. [cited by applicant]