IP Library Granted Patent US 12,226,801
Granted Patent B2
US 12,226,801 · App. 18/423,200 · Granted Feb 18, 2025

Apparatus and system for tuning the resonant frequency of a piezoelectric micromachined ultrasonic transducer

Inventors: Stefon Shelton (Oakland, CA); Fabian Goericke (Berkeley, CA); Benedict Costello (Berkeley, CA)
Assignee: InvenSense, Inc.
B06B1/0629B06B1/0651B06B1/0666B06B1/0685H10N30/04Y10T29/42Y10T29/5313
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Quick Facts
Patent No.
US 12,226,801
App. No.
18/423,200
Granted
Feb 18, 2025
Kind
B2
Abstract

The teachings of the present disclosure enable the manufacture of one or more piezoelectric micromachined ultrasonic transducers (PMUTs) having a resonant frequency of a specific target value and/or substantially matched resonant frequencies. In accordance with the present disclosure, a flexible membrane of a PMUT is modified to impart a desired parameter profile for stiffness and/or mass to tune its resonant frequency to a target value. The desired parameter profile is achieved by locally removing or adding material to regions of one or more layers of the flexible membrane to alter its geometric dimensions and/or density. In some embodiments, material is added or removed non-uniformly across the structural layer to realize a material distribution that more strongly affects membrane stiffness than mass. In some embodiments, material having a specific residual stress is added to, and/or removed from, the membrane to define a desired modal stiffness for the membrane.

Claims (18)

1. An apparatus comprising:

a plurality of piezoelectric micromachined ultrasonic transducers (PMUTs) ( 500 ), each PMUT of the plurality thereof including a membrane ( 204 ) that is characterized by a first design that includes a first lateral dimension (D 1 ), a center (C 1 ), and a periphery (P 1 ), wherein each PMUT of the plurality thereof has a resonant frequency that is based on at least one of the stiffness and mass of its respective membrane;

wherein the membrane of a first PMUT ( 502 - 1 , 1 ) of the plurality thereof has a first profile of at least one of stiffness and mass across its respective first lateral dimension, and wherein the first PMUT has a first resonant frequency that is based on the first profile;

wherein the membrane of a second PMUT ( 502 -M, 1 ) of the plurality thereof has a second profile of at least one of stiffness and mass across its respective first lateral dimension, and wherein the second PMUT has a second resonant frequency that is based on the second profile, and further wherein the second profile is different from the first profile; and

wherein the first and second resonant frequencies are within an acceptable range of resonant frequencies (Δf 0 ).

2. The apparatus of claim 1 wherein the first design is based on a target resonant frequency that is within the acceptable range of resonant frequencies, and wherein each of the first and second profiles is based on the target resonant frequency and the acceptable range of resonant frequencies.

3. The apparatus of claim 1 wherein the first PMUT is disposed on a first substrate and the second PMUT is disposed on a second substrate that is different than the first substrate.

4. The apparatus of claim 1 wherein the first membrane ( 204 - 1 , 1 ) has a first thickness (t′- 1 , 1 ) at its center and a second thickness (t- 1 , 1 ) at its periphery, and wherein the first thickness and second thickness are different.

5. The apparatus of claim 4 wherein the second PMUT ( 204 -M, 1 ) has a third thickness (t′-M, 1 ) at its center and a fourth thickness (t-M, 1 ) at its periphery, and wherein the third thickness and fourth thickness are different, and further wherein there is at least one of (i) a first difference between the first thickness and third thickness and (ii) a second difference between the second thickness and fourth thickness.

6. The apparatus of claim 1 wherein the first PMUT is disposed on a substrate ( 202 ) comprising an aperture ( 208 ) having a second lateral dimension (D 2 ), and wherein the first and second lateral dimensions collectively define a setback region ( 210 ) having a width (s), and further wherein the stiffness of the first membrane is locally reduced in the setback region.

7. A system comprising:

a first plurality of piezoelectric micromachined ultrasonic transducers (PMUTs) ( 500 ), each PMUT of the plurality thereof including a membrane ( 204 ) that is characterized by a first design that includes a first lateral dimension (D 1 ), a center (C 1 ), and a periphery (P 1 ), wherein each PMUT of the plurality thereof has a resonant frequency that is based on at least one of the stiffness and mass of its respective membrane;

wherein the membrane of a first PMUT ( 502 - 1 , 1 ) of the plurality thereof has a first profile of at least one of stiffness and mass across its respective first lateral dimension, and wherein the first PMUT has a first resonant frequency that is based on the first profile;

wherein the membrane of a second PMUT ( 502 -M, 1 ) of the plurality thereof has a second profile of at least one of stiffness and mass across its respective first lateral dimension, and wherein the second PMUT has a second resonant frequency that is based on the second profile, and further wherein the second profile is different from the first profile;

wherein the first and second resonant frequencies are within an acceptable range of resonant frequencies (Δf 0 ); and

wherein at least one PMUT of the plurality thereof is configured as a transmitter or receiver.

8. The system of claim 7 wherein the first PMUT is configured as a transmitter that transmits a first signal and the second PMUT is configured as a receiver that receives the first signal.

9. The system of claim 7 wherein the plurality of PMUTs is configured to collectively function as a transmitter array or a receiver array.

Assignments (2)
MERGER Recorded May 22, 2024
From: CHIRP MICROSYSTEMS, INC.
To: INVENSENSE, INC.
Reel/Frame 067498/0834 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2024
From: GOERICKE, FABIAN; SHELTON, STEFON; COSTELLO, BENEDICT
To: CHIRP MICROSYSTEMS
Reel/Frame 067275/0611 →
Continuity (3)
Division 16957064
Provisional Application 62609987 · Dec 22, 2017
Related Publication 20240157398A1 · May 16, 2024
References Cited (14)
US 4259145A · Harper et al. · 1981 [cited by applicant]
US 6414569B1 · Nakafuku · 2002 [cited by applicant]
US 10058284B2 · Hoseit · 2018 [cited by examiner]
US 10478858B2 · Lasiter et al. · 2019 [cited by applicant]
US 10522737B2 · Boser et al. · 2019 [cited by applicant]
US 11938515B2 · Goericke et al. · 2024 [cited by applicant]
US 20100013574A1 · Huang · 2010 [cited by examiner]
US 20110291207A1 · Martin et al. · 2011 [cited by applicant]
US 20170110504A1 · Panchawagh et al. · 2017 [cited by applicant]
US 20170216883A1 · Hajati · 2017 [cited by applicant]
WO 2016106153A1 · 2016 [cited by applicant]
WO 2017218299A1 · 2017 [cited by applicant]
International Search Report and Written Opinion in International Application No. PCT/US2018/067260, mailed Mar. 8, 2019. [cited by applicant]
Extended European Search Report in European Application No. 18890914.7, dated Jul. 20, 2021. [cited by applicant]
Cited By (2)
US 12,427,344 US 12,601,341