IP Library Granted Patent US 12,227,672
Granted Patent B2
US 12,227,672 · App. 17/561,007 · Granted Feb 18, 2025

Method for manufacturing a multilayer ceramic capacitor

Inventors: Tae Gyun Kwon (Suwon-si, KR); Eung Seok Lee (Suwon-si, KR); So Hyeon Hong (Suwon-si, KR); Byung Rok Ahn (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
C09D5/24C09D7/20C09D7/45C09D7/68C09D7/69C09D129/04H01G4/008H01G4/012H01G4/30H01G4/248
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,227,672
App. No.
17/561,007
Granted
Feb 18, 2025
Kind
B2
Abstract

A method for manufacturing a multilayer ceramic capacitor including an operation of preparing a ceramic green sheet; an operation of forming a conductive paste on the ceramic green sheet; an operation of forming a ceramic laminate by stacking a ceramic green sheet on which the conductive paste is formed; an operation of sintering the ceramic laminate; and an operation of forming an external electrode on an exterior of the ceramic laminate, wherein the conductive paste includes a first mixture including a metal powder, a dispersant, and a hydrophobic solvent and a second mixture including a hydrophilic binder and a hydrophilic solvent, the conductive paste being an emulsion in which the first mixture is dispersed in the second mixture.

Claims (14)

1. A method for manufacturing a multilayer ceramic capacitor, comprising:

an operation of preparing a ceramic green sheet;

an operation of forming a conductive paste on the ceramic green sheet;

an operation of forming a ceramic laminate by stacking a ceramic green sheet on which the conductive paste is formed;

an operation of sintering the ceramic laminate; and

an operation of forming an external electrode on an exterior of the ceramic laminate, wherein the conductive paste includes a first mixture including a metal powder, a dispersant, and a hydrophobic solvent and a second mixture including a hydrophilic binder and a hydrophilic solvent, the conductive paste being an emulsion in which the first mixture is dispersed in the second mixture.

2. The method for manufacturing a multilayer ceramic capacitor of claim 1 , wherein a volume ratio of the first mixture to the second mixture is 1 or less.

3. The method for manufacturing a multilayer ceramic capacitor of claim 1 , wherein the first mixture particle has a diameter of 0.1 to 100 μm.

4. The method for manufacturing a multilayer ceramic capacitor of claim 1 , wherein a content of the dispersant in the first mixture is 0.01 wt % or more.

5. The method for manufacturing a multilayer ceramic capacitor of claim 1 , wherein the metal powder is at least one selected from a group consisting of Ni, Cu, Au, Ag, Pd, Pt, and alloys thereof.

6. The method for manufacturing a multilayer ceramic capacitor of claim 1 , wherein the dispersant includes one or more of a non-ionic surfactant, a cationic surfactant, and an anionic surfactant.

7. The method for manufacturing a multilayer ceramic capacitor of claim 1 , wherein the hydrophobic solvent includes one or more of an acetate-based solvent, a terpene-based solvent, a hydrocarbon-based solvent, a carboxylic acid-based solvent, and an ester-based solvent.

8. The method for manufacturing a multilayer ceramic capacitor of claim 1 , wherein the hydrophilic binder includes one or more of polyvinyl alcohol, cellulose, and a water-soluble acrylic resin.

9. The method for manufacturing a multilayer ceramic capacitor of claim 1 , wherein the hydrophilic solvent includes one or more of water and dimethyl sulfoxide.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 23, 2021
From: KWON, TAE GYUN; LEE, EUNG SEOK; HONG, SO HYEON; AHN, BYUNG ROK
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 058473/0228 →
Priority Claims (1)
KR 10-2021-0126518 · Sep 24, 2021 · national
Continuity (1)
Related Publication 20230098422A1 · Mar 30, 2023
References Cited (8)
US 9058936B2 · Takeoka · 2015 [cited by examiner]
US 9105411B2 · Chae · 2015 [cited by examiner]
US 10062509B2 · Shimada · 2018 [cited by examiner]
US 10315928B2 · Ajichi · 2019 [cited by examiner]
JP H0917687A · 1997 [cited by applicant]
JP H11233388A · 1999 [cited by applicant]
JP 4626215B2 · 2011 [cited by applicant]
JP 4967223B2 · 2012 [cited by applicant]
Cited By (1)
US 12,580,127