Pneumatic shutters to control organic vapor jet printing
View Patent ↗Devices, systems, and techniques are provided for improved OVJP deposition using a shutter disposed within the OVJP print head, between the print head inlet and the nozzle outlets. An OVJP print head as disclosed includes an inlet for organic material entrained in a carrier gas, a micronozzle array outlet, and a shutter disposed in the gas flow path between the inlet and the micronozzle array outlet. The shutter allows for rapid cutoff of carrier gas flow through the print head with extremely low latency.
1. An organic vapor jet printing (OVJP) deposition device, comprising:
an OVJP print head comprising:
a micronozzle array comprising at least one inlet through which organic material entrained in a carrier gas enters the micronozzle array and a plurality of nozzle outlets through which material is ejected from the micronozzle array; and
a shutter comprising a movable structure having an aperture and disposed between the plurality of nozzle outlets and the inlet, wherein the shutter is movable from an open configuration in which the aperture is aligned with the inlet and a closed configuration in which the aperture is not aligned with the inlet, wherein the shutter allows gas flow into the plurality of nozzle outlets in the open configuration and prevents gas flow into the plurality of nozzle outlets in the closed configuration.
2. The OVJP deposition device of claim 1 , wherein the shutter is disposed closer to the nozzle outlets than to the at least one inlet.
3. The OVJP deposition device of claim 1 , further comprising an actuator that causes the shutter to change from the open configuration to the closed configuration.
4. The OVJP deposition device of claim 3 , wherein the actuator comprises a mechanism type selected from the group consisting of: electrical, magnetic, electromagnetic, pneumatic, and physical.
5. The OVJP deposition device of claim 1 , further comprising a first shutter inlet disposed proximal to a first end of the movable structure and a second shutter inlet disposed proximal to a second end of the movable structure.
6. The OVJP deposition device of claim 5 , wherein the shutter is moved toward the second shutter inlet when gas flows through the first shutter inlet and exerts pressure on the first wall; and the shutter is moved toward the first shutter inlet when gas flows through the second shutter inlet and exerts pressure on the second wall.
7. The OVJP deposition device of claim 1 , wherein applying a first electrical signal to the shutter causes the shutter to be in the closed configuration.
8. The OVJP deposition device of claim 7 , wherein applying a second electrical signal to the shutter causes the shutter to be in the open configuration.
9. The OVJP deposition device of claim 1 , further comprising:
an organic material source comprising an organic material to be deposited by the print head on a substrate; and
a source of carrier gas in fluid communication with the organic material source and with the at least one inlet.
10. The OVJP deposition device of claim 1 , wherein the micronozzle array is fabricated from a monolithic block of material.
11. An OVJP deposition device, comprising:
an OVJP print head comprising:
a micronozzle array comprising at least one inlet through which organic material entrained in a carrier gas enters the micronozzle array and a plurality of nozzle outlets through which material is ejected from the micronozzle array; and
a shutter disposed between the plurality of nozzle outlets and the inlet and having an open configuration and a closed configuration, wherein the shutter allows gas flow into the plurality of nozzle outlets in the open configuration and prevents gas flow into the plurality of nozzle outlets in the closed configuration;
wherein the shutter comprises a flexible bridge portion that flexes toward the plurality of nozzle openings in the open configuration.
12. The OVJP deposition device of claim 11 , wherein the shutter is configured to be in the open configuration when gas flows into the OVJP print head at a pressure above a threshold pressure.
13. The OVJP deposition device of claim 12 , wherein the shutter is configured to be in the open configuration when an electrical signal is applied to the shutter.
14. The OVJP deposition device of claim 12 , wherein the threshold pressure is 10 kPa.
15. The OVJP deposition device of claim 11 , further comprising:
an organic material source comprising an organic material to be deposited by the print head on a substrate; and
a source of carrier gas in fluid communication with the organic material source and with the at least one inlet.
16. An OVJP deposition device, comprising:
an OVJP print head comprising:
a micronozzle array comprising at least one inlet through which organic material entrained in a carrier gas enters the micronozzle array and a plurality of nozzle outlets through which material is ejected from the micronozzle array; and
a shutter disposed between the plurality of nozzle outlets and the inlet and having an open configuration and a closed configuration, wherein the shutter allows gas flow into the plurality of nozzle outlets in the open configuration and prevents gas flow into the plurality of nozzle outlets in the closed configuration;
wherein the shutter comprises a polysilicon bridge and a single-crystal silicon substrate.
17. The OVJP deposition device of claim 16 , wherein the shutter further comprises a layer of SiO 2 disposed between the polysilicon bridge and the single-crystal silicon substrate.
18. The OVJP deposition device of claim 16 , wherein the polysilicon bridge comprises one or more openings offset from the inlet which allow gas to flow to the plurality of nozzle outlets when the shutter is in the open position.
19. The OVJP deposition device of claim 16 , further comprising:
an organic material source comprising an organic material to be deposited by the print head on a substrate; and
a source of carrier gas in fluid communication with the organic material source and with the at least one inlet.
20. The OVJP deposition device of claim 16 , wherein applying a first electrical signal to the shutter causes the shutter to be in the closed configuration.