Wet alignment method for micro-semiconductor chip and display transfer structure
A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.
1. A micro LED chips transferring method for LED display, the method comprising:
a first transferring process transferring a plurality of micro LED chips onto a transfer substrate having a plurality of grooves, the first transferring process comprises:
supplying liquid to the plurality of grooves in the transfer substrate;
supplying the plurality of micro LED chips onto the transfer substrate; and
aligning the plurality of micro LED chips with the plurality of grooves in the transfer substrate by moving the transfer substrate to enable a liquid absorber to scan across the transfer substrate; and
a second transferring process transferring the plurality of micro LED chips on the transfer substrate onto a display substrate having a display driving circuit.
2. The micro LED chips transferring method of claim 1 , wherein the moving the transfer substrate comprising:
moving the transfer substrate while maintaining contact between the liquid absorber and the transfer substrate.
3. The micro LED chips transferring method of claim 1 , wherein the supplying of the liquid and the supplying of the plurality of micro LED chips are performed as a single process of supplying a suspension comprising the liquid and the plurality of micro LED chips to the transfer substrate.
4. The micro LED chips transferring method of claim 1 , wherein the second transferring process is performed by attaching directly the transfer substrate and the display substrate.
5. The micro LED chips transferring method of claim 1 , wherein the micro LED chips comprises an electrode disposed on a surface of the micro LED chip, and
when the micro LED chips enter the plurality of grooves of the transfer substrate, the electrode of the micro LED chip is disposed to face an upper opening of the plurality of grooves via the moving of the transfer substrate that changes a relative position of the transfer substrate with respect to the liquid absorber.
6. The micro LED chips transferring method of claim 1 , wherein the aligning the plurality of micro LED chips comprises allowing the liquid absorber to contact the transfer substrate and pass across the plurality of grooves.
7. The micro LED chips transferring method of claim 1 , wherein the liquid absorber comprises fabric, a tissue, a polyester fiber, paper, or a wiper.
8. The micro LED chips transferring method of claim 1 , wherein the liquid comprises any one or any combination of water, ethanol, alcohol, polyol, ketone, halocarbon, acetone, a flux, and an organic solvent.
9. The micro LED chips transferring method of claim 1 , wherein the transfer substrate comprises a metal layer disposed on an upper surface of the plurality of grooves.
10. A micro LED chips transfer structure comprising:
a transfer substrate comprising a plurality of grooves;
a metal layer disposed directly on a top surface of the transfer substrate without being provided on the plurality of grooves; and
a plurality of micro LED chips that are disposed in the plurality of grooves,
wherein each of the plurality of micro LED chips comprises a first electrode and a second electrode that are disposed on a top surface of each of the plurality of micro LED chips to face an upper opening of a corresponding groove of the plurality of grooves, and
wherein bottom surfaces of the plurality of micro LED chips are in contact with bottom surfaces of the plurality of grooves, respectively.
11. The micro LED chips transfer structure of claim 10 , wherein the metal layer comprises at least one of Ag, Au, Pt, Ni, Cr, and Al.