Package substrate z-disaggregation with liquid metal interconnects
A z-disaggregated integrated circuit package substrate assembly comprises a first substrate component (a coreless patch), a second substrate component (a core patch), and a third substrate component (an interposer). The coreless patch comprises thinner dielectric layers and higher density routing and can comprise an embedded bridge to allow for communication between integrated circuit dies attached to the coreless patch. The core layer acts as a middle layer interconnect between the coreless patch and the interposer and comprises liquid metal interconnects to connect the core patch physically and electrically to the coreless patch and the interposer. Core patch through holes comprise liquid metal plugs. Some through holes can be surrounded by and coaxially aligned with magnetic plugs to provide improved power signal delivery. The interposer comprises thicker dielectric layers and lower density routing. The substrate assembly can reduce cost and provide improved overall yield and electrical performance relative to monolithic substrates.
1. An apparatus comprising:
a first substrate component comprising:
a plurality of first conductive contacts located on a face of the first substrate component;
one or more first interconnect layers comprising conductive traces; and
one or more first dielectric layers, individual of the first interconnect layers disposed between adjacent first dielectric layers;
a second substrate component comprising:
one or more second dielectric layers;
a plurality of first coupling components comprising liquid metal;
a plurality of second coupling components comprising liquid metal; and
a plurality of through holes extending through the second dielectric layers, individual of through holes having a first coupling component disposed at a first end of the individual through hole and a second coupling component disposed at a second end of the individual through hole that opposes the first end of the individual through hole; and
a third substrate component comprising:
a plurality of second conductive contacts located on a face of the third substrate component;
one or more second interconnect layers comprising conductive traces; and
one or more third dielectric layers, individual of the second interconnect layers disposed between adjacent third dielectric layers;
wherein the plurality of the first coupling components connect to the plurality of the first conductive contacts;
wherein the plurality of the second coupling components connect to the plurality of the second conductive contacts; and
wherein the second substrate component is disposed between the first substrate component and the third substrate component.
2. The apparatus of claim 1 , the apparatus further comprising an integrated circuit die attached to the first substrate component via a third plurality of coupling components.
3. The apparatus of claim 1 , wherein the face of the first substrate component is a first face of the first substrate component, the first substrate component further comprising a third conductive contact and a fourth conductive contact on a second face of the first substrate component that opposes the first face of the first substrate component, the first substrate component further comprising:
a bridge embedded within the first substrate component, the bridge comprising one or more bridge conductive traces; and
one or more substrate vias;
wherein the one or more substrate vias and the one or more bridge conductive traces comprise at least part of a conductive path from the third conductive contact to the fourth conductive contact.
4. The apparatus of claim 1 , wherein one of the through holes is at least partially filled with liquid metal.
5. The apparatus of claim 4 , wherein the one of the through holes is surrounded by a plug comprising a magnetic material.
6. The apparatus of claim 5 , wherein the one of the through holes is substantially coaxially aligned with the plug.
7. The apparatus of claim 1 , wherein individual of the first conductive contacts comprises a copper protrusion that connects with one of the first coupling components.
8. An electrical device comprising:
a printed circuit board; and
an integrated circuit component attached to the printed circuit board, the integrated circuit component comprising:
a first substrate component comprising:
a plurality of first conductive contacts located on a face of the first substrate component;
one or more first interconnect layers comprising conductive traces; and
one or more first dielectric layers, individual of the first interconnect layers disposed between adjacent first dielectric layers;
a second substrate component comprising:
one or more second dielectric layers;
a plurality of first coupling components comprising liquid metal;
a plurality of second coupling components comprising liquid metal; and
a plurality of through holes extending through the second dielectric layers, individual of through holes having a first coupling component disposed at a first end of the individual through hole and a second coupling component disposed at a second end of the individual through hole that opposes the first end of the individual through hole;
a third substrate component comprising:
a plurality of second conductive contacts located on a face of the third substrate component;
one or more second interconnect layers comprising conductive traces; and
one or more third dielectric layers, individual of the second interconnect layers located between adjacent third dielectric layers; and
one or more integrated circuit dies attached to the first substrate component;
wherein the plurality of the first coupling components connect to the plurality of the first conductive contacts;
wherein the plurality of the second coupling components connect to the plurality of the second conductive contacts; and
wherein the second substrate component is located between the first substrate component and the third substrate component.
9. The electrical device of claim 8 , wherein the printed circuit board is attached to the integrated circuit component via a socket.
10. The electrical device of claim 8 , wherein the integrated circuit component is communicatively coupled to at least one memory via the printed circuit board.
11. The electrical device of claim 8 , wherein the electrical device comprises a housing, the integrated circuit component located within the housing.
12. The electrical device of claim 8 , wherein the one or more integrated circuit dies comprise two types of integrated circuit dies.
13. The electrical device of claim 8 , wherein the face of the first substrate component is a first face of the first substrate component, the first substrate component further comprising a third conductive contact and a fourth conductive contact on a second face of the first substrate component that is opposite the first face of the first substrate component, the first substrate component further comprising:
a bridge embedded within the first substrate component, the bridge comprising one or more bridge conductive traces; and
one or more substrate vias;
wherein the one or more substrate vias and the one or more bridge conductive traces comprise at least part of a conductive path from the third conductive contact to the fourth conductive contact via the bridge.
14. The electrical device of claim 8 , wherein one of the through holes is at least partially filled with liquid metal.
15. The electrical device of claim 14 , wherein the one of the through holes is surrounded by a plug comprising a magnetic material.
16. The electrical device of claim 15 , wherein the one of the through holes is substantially coaxially aligned with the plug.
17. A method comprising:
attaching a first substrate component to a second substrate component; and
attaching a third substrate component to the second substrate component;
wherein the first substrate component comprises:
a plurality of first conductive contacts located on a face of the first substrate component;
one or more first interconnect layers comprising conductive traces;
one or more first dielectric layers, individual of the first interconnect layers disposed between adjacent first dielectric layers; and
wherein the second substrate component comprises:
one or more second dielectric layers;
a plurality of first coupling components comprising liquid metal;
a plurality of second coupling components comprising liquid metal; and
a plurality of through holes extending through the second dielectric layers, individual of through holes having a first coupling component disposed at a first end of the individual through hole and a second coupling component disposed at a second end of the individual through hole that opposes the first end of the individual through hole; and
wherein the third substrate component comprises:
a plurality of second conductive contacts located on a face of the third substrate component;
one or more second interconnect layers comprising conductive traces;
one or more third dielectric layers, individual of the second interconnect layers disposed between adjacent third dielectric layers;
wherein the plurality of the first coupling components connect to the plurality of the first conductive contacts;
wherein the plurality of the second coupling components connect to the plurality of the second conductive contacts; and
wherein the second substrate component is disposed between the first substrate component and the third substrate component; and
wherein the first substrate component, the second substrate component, and the third substrate component form a substrate assembly when attached together.
18. The method of claim 17 , further comprising attaching one or more integrated circuit dies to the substrate assembly.
19. The method of claim 17 , further comprising:
detaching the first substrate component from the second substrate component without an application of heat to enable the detaching; and
attaching a different first substrate component to the second substrate component to replace the first substrate component.
20. The method of claim 17 , further comprising:
detaching the third substrate component from the first substrate component without an application of heat to enable the detaching; and
attaching a different third substrate component to the second substrate component to replace the first substrate component.
21. A substrate component comprising:
a circuit board comprising one or more dielectric layers;
a plurality of first coupling components comprising liquid metal;
a plurality of second coupling components comprising liquid metal; and
a plurality of through holes extending through the dielectric layers, individual of through holes having one of the first coupling components disposed at a first end of the individual through hole and one of the second coupling components disposed at a second end of the individual through hole that opposes the first end of the individual through hole.
22. The substrate component of claim 21 , further comprising one or more interconnect layers comprising conductive traces, individual of the interconnect layers disposed between adjacent dielectric layers.
23. The substrate component of claim 21 , wherein one of the through holes is at least partially filled with liquid metal.
24. The substrate component of claim 23 , wherein the one of the through holes is surrounded by a plug comprising a magnetic material.
25. The substrate component of claim 24 , wherein the one of the through holes is substantially coaxially aligned with the plug.