IP Library › Granted Patent US 12,232,306
Granted Patent B2
US 12,232,306 · App. 18/553,148 · Granted Feb 18, 2025

Electromagnetic wave shielding film and shielded printed wiring board

Inventors: Takahiko Katsuki (Kizugawa, JP); Hiroshi Tajima (Kizugawa, JP); Sirou Yamauchi (Kizugawa, JP)
Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
H05K9/0086H05K1/0218H05K2201/0715
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,232,306
App. No.
18/553,148
Granted
Feb 18, 2025
Kind
B2
Abstract

An electromagnetic wave shielding film has permeability to volatile components, shielding characteristics, and resistance to folding. The electromagnetic wave shielding film includes an adhesive layer; a metal layer made of a metal and placed on the adhesive layer; and an insulating layer placed on the metal layer. Multiple openings are formed in the metal layer; the openings include openings (A) including island-shaped metal layer fragments, each opening (A) having island-shaped metal layer fragments formed therein, and the openings (A) including island-shaped metal layer fragments include openings (A 1 ) including one or more island-shaped metal layer fragments. Each opening (A 1 ) defines an opening (A) including island-shaped metal layer fragments in which a total area of the island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).

Claims (32)

1. An electromagnetic wave shielding film comprising:

an adhesive layer;

a metal layer made of a metal and placed on the adhesive layer; and

an insulating layer placed on the metal layer,

wherein a plurality of openings are formed in the metal layer;

the openings include openings (A) including one or more island-shaped metal layer fragments, each opening (A) having one or more island-shaped metal layer fragments formed therein, and

the openings (A) including one or more island-shaped metal layer fragments include openings (A 1 ) including one or more island-shaped metal layer fragments, each opening (A 1 ) defining an opening (A) including one or more island-shaped metal layer fragments in which a total area of the one or more island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).

2. The electromagnetic wave shielding film according to claim 1 , wherein a percentage of the number of the openings (A) including one or more island-shaped metal layer fragments is 25% or more based on the number of the openings.

3. The electromagnetic wave shielding film according to claim 1 , wherein a percentage of the number of the openings (A 1 ) including one or more island-shaped metal layer fragments is 5% or more based on the number of the openings.

4. The electromagnetic wave shielding film according to claim 1 , wherein the metal layer has an opening rate of 5 to 90%.

5. The electromagnetic wave shielding film according to claim 1 , wherein an average area inside the contour of one of the openings is 5 to 2000 μm 2 .

6. The electromagnetic wave shielding film according to claim 1 , wherein the metal layer has a thickness of 0.4 to 1.9 μm 2 .

7. The electromagnetic wave shielding film according to claim 1 , wherein the metal layer comprises at least one metal selected from the group consisting of copper, silver, gold, aluminum, nickel, tin, palladium, chromium, titanium, or zinc.

8. The electromagnetic wave shielding film according to claim 1 , wherein the electromagnetic wave shielding film has a water vapor transmission rate of 40 g or more per m 2 ·24 h at a temperature of 80° C., a humidity of 95% RH, and a differential pressure of 1 atm, in accordance with JISK7129.

9. A shielded printed circuit board, comprising:

a printed circuit board comprising a base member having a printed circuit and an insulating film provided on the base member to cover the printed circuit; and

an electromagnetic wave shielding film provided on the printed circuit board,

wherein the electromagnetic wave shielding film is the electromagnetic wave shielding film according to claim 1 .

10. An electromagnetic wave shielding film comprising:

an adhesive layer;

a metal layer made of a metal and placed on the adhesive layer; and

an insulating layer placed on the metal layer,

wherein a plurality of openings are formed in the metal layer;

the openings include openings (A) including one or more island-shaped metal layer fragments, each opening (A) having one or more island-shaped metal layer fragments formed therein, and

a total of areas of the one or more island-shaped metal layer fragments in the whole metal layer accounts for 1 to 90% of a total of areas inside contours of the openings in the whole metal layer.

11. The electromagnetic wave shielding film according to claim 10 , wherein the openings (A) including one or more island-shaped metal layer fragments include openings (A 1 ) including one or more island-shaped metal layer fragments, each opening (A 1 ) defining an opening (A) including one or more island-shaped metal layer fragments in which a total area of the one or more island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).

12. The electromagnetic wave shielding film according to claim 11 , wherein a percentage of the number of the openings (A 1 ) including one or more island-shaped metal layer fragments is 5% or more based on the number of the openings.

13. The electromagnetic wave shielding film according to claim 10 , wherein a percentage of the number of the openings (A) including one or more island-shaped metal layer fragments is 25% or more based on the number of the openings.

14. A shielded printed circuit board, comprising:

a printed circuit board comprising a base member having a printed circuit and an insulating film provided on the base member to cover the printed circuit; and

an electromagnetic wave shielding film provided on the printed circuit board,

wherein the electromagnetic wave shielding film is the electromagnetic wave shielding film according to claim 10 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2023
From: KATSUKI, TAKAHIKO; TAJIMA, HIROSHI; YAMAUCHI, SIROU
To: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
Reel/Frame 065067/0293 →
Priority Claims (1)
JP 2021-054984 · Mar 29, 2021 · national
Continuity (1)
Related Publication 20240172405A1 · May 23, 2024
References Cited (21)
US 10820457B1 · Kishi · 2020 [cited by examiner]
US 20090126984A1 · Saneto et al. · 2009 [cited by applicant]
US 20120175164A1 · Saneto et al. · 2012 [cited by applicant]
US 20160057900A1 · Polak · 2016 [cited by examiner]
US 20160120077A1 · Watanabe · 2016 [cited by examiner]
US 20170002488A1 · Tanaka · 2017 [cited by examiner]
US 20210090794A1 · Woo · 2021 [cited by examiner]
US 20220142022A1 · Su · 2022 [cited by examiner]
US 20220151119A1 · Yanagi · 2022 [cited by applicant]
US 20230155268A1 · Tanaka · 2023 [cited by examiner]
US 20230309283A1 · Chiba · 2023 [cited by examiner]
CN 207124801U · 2018 [cited by applicant]
JP 2008306177A · 2008 [cited by applicant]
JP 2018060987A · 2018 [cited by applicant]
TW 201934697A · 2019 [cited by applicant]
TW 202100352A · 2021 [cited by applicant]
TW 202106514A · 2021 [cited by applicant]
WO 2016052225A1 · 2016 [cited by applicant]
WO 2018147298A1 · 2018 [cited by applicant]
International Search Report dated Jun. 17, 2022, issued in connection with International Application PCT/JP2022/015253. [cited by applicant]
Written Opinion dated Jun. 17, 2022, issued in connection with International Application PCT/JP2022/015253. [cited by applicant]