Porous liquid conducting member with smooth liquid conduction, and heating assembly and atomizing device therewith
View Patent ↗A porous liquid conducting member with a smooth liquid conduction is provided, the liquid conducting member is of a porous material and provided with a hollow cavity therein, and includes an inner side and an outer side. The inner side or the outer side is configured to be in contact with a liquid, and is provided with an air exchange recess to form a thin-wall on the liquid conducting member. A wall thickness of the thin-wall is smaller than a wall thickness between the inner side and the outer side, enabling air to be conducted through the thin-wall. The air exchange recess is outside a heating area of the liquid conducting member, so that air can enter the liquid storage chamber through the air exchange recess during an atomizing process, to avoid porous channels in the heating area from being occupied by the air entering the liquid storage chamber.
1. A porous liquid conducting member with a smooth liquid conduction, the liquid conducting member ( 1 ) being provided with a hollow cavity ( 10 ) therein, and comprising an inner side ( 11 ) and an outer side ( 12 ); wherein the inner side ( 11 ) or the outer side ( 12 ) is configured to be in contact with a liquid, and is provided with an air exchange recess ( 13 ) to form a thin-wall ( 14 ) on the liquid conducting member ( 1 ); a wall thickness of the thin-wall ( 14 ) is smaller than a wall thickness between the inner side ( 11 ) and the outer side ( 12 ), enabling air to be conducted through the thin-wall ( 14 ); the hollow cavity ( 10 ) is a liquid storage groove defined in an upper side of the liquid conducting member ( 1 ); the air exchange recess ( 13 ) is located in a bottom of the liquid storage groove; a liquid supply hole ( 15 ) is provided in a bottom of the liquid storage groove, and the liquid supply hole ( 15 ) is a blind hole; and the wall thickness (a) of the thin-wall ( 14 ) formed by the air exchange recess ( 13 ) is smaller than a wall thickness (b) between a bottom of the liquid supply hole ( 15 ) and an outer side of the liquid conducting member ( 1 ).
2. The porous liquid conducting member with the smooth liquid conduction according to claim 1 , wherein the thin-wall ( 14 ) is a wall between a bottom of the air exchange recess ( 13 ) and a lower surface of the liquid conducting member ( 1 ).
3. The porous liquid conducting member with the smooth liquid conduction according to claim 1 , wherein the thin-wall ( 14 ) is a wall between a side wall of the air exchange recess ( 13 ) and the outer side ( 12 ) of the liquid conducting member ( 1 ).
4. The porous liquid conducting member with the smooth liquid conduction according to claim 3 , wherein a size of one end of the liquid conducting member ( 1 ) provided with the liquid storage groove is larger than that of an opposite end of the liquid conducting member ( 1 ), so that the liquid conducting member ( 1 ) is in a stepped shape.
5. The porous liquid conducting member with the smooth liquid conduction according to claim 1 , wherein the air exchange recess ( 13 ) is located in a side wall of the liquid storage groove; or alternatively,
the air exchange recess ( 13 ) is located in an outer side of the liquid conducting member ( 1 ).
6. The porous liquid conducting member with the smooth liquid conduction according to claim 1 , wherein the hollow cavity ( 10 ) extends through the liquid conducting member ( 1 ), and the liquid conducting member ( 1 ) is tubular or annular, and the air exchange recess ( 13 ) is located in an outer side wall or an inner side wall of the liquid conducting member ( 1 ).
7. The porous liquid conducting member with the smooth liquid conduction according to claim 1 , wherein the wall thickness of the thin-wall ( 14 ) formed by the air exchange recess ( 13 ) is 0.1 mm to 0.5 mm; and
an area of each thin-wall ( 14 ) formed by each corresponding air exchange recess ( 13 ) is 0.05-15 mm 2 .
8. The porous liquid conducting member with the smooth liquid conduction according to claim 1 , wherein a porosity of the liquid conducting member ( 1 ) is 20% to 80%; and
wherein an average micropore diameter of the liquid conducting member ( 1 ) is 5 μm to 50 μm.
9. A heating assembly, comprising a porous liquid conducting member ( 1 ) with a smooth liquid conduction and a heating member ( 2 ) disposed on the liquid conducting member ( 1 ); wherein the liquid conducting member ( 1 ) is provided with a hollow cavity ( 10 ) therein, and comprises an inner side ( 11 ) and an outer side ( 12 ); the inner side ( 11 ) or the outer side ( 12 ) is configured to be in contact with a liquid, and is provided with an air exchange recess ( 13 ) to form a thin-wall ( 14 ) on the liquid conducting member ( 1 ); a wall thickness of the thin-wall ( 14 ) is smaller than a wall thickness between the inner side ( 11 ) and the outer side ( 12 ), enabling air to be conducted through the thin-wall ( 14 ); and a heating area ( 21 ) of the heating member ( 2 ) is not located at the thin-wall ( 14 ) formed by the air exchange recess ( 13 ).
10. An atomizing device, comprising a housing and a heating assembly disposed in the housing; wherein the heating assembly comprises a porous liquid conducting member ( 1 ) with a smooth liquid conduction and a heating member ( 2 ) disposed on the liquid conducting member ( 1 ); wherein the liquid conducting member ( 1 ) is provided with a hollow cavity ( 10 ) therein, and comprises an inner side ( 11 ) and an outer side ( 12 ); the inner side ( 11 ) or the outer side ( 12 ) is configured to be in contact with a liquid, and is provided with an air exchange recess ( 13 ) to form a thin-wall ( 14 ) on the liquid conducting member ( 1 ); a wall thickness of the thin-wall ( 14 ) is smaller than a wall thickness between the inner side ( 11 ) and the outer side ( 12 ), enabling air to be conducted through the thin-wall ( 14 ); and a heating area ( 21 ) of the heating member ( 2 ) is not located at the thin-wall ( 14 ) formed by the air exchange recess ( 13 ); and
wherein a liquid storage chamber is defined in the housing, and is communicated with the hollow cavity ( 10 ) in the liquid conducting member ( 1 ), so that liquid in the liquid storage chamber can enter the hollow cavity ( 10 ) and is further conducted to the heating member ( 2 ) through the liquid conducting member ( 1 ), and air can enter the liquid storage chamber through the air exchange recess ( 13 ).
11. The heating assembly according to claim 9 , wherein the hollow cavity ( 10 ) is a liquid storage groove defined in an upper side of the liquid conducting member ( 1 ).
12. The heating assembly according to claim 11 , wherein the air exchange recess ( 13 ) is located in a bottom of the liquid storage groove; a liquid supply hole ( 15 ) is provided in a bottom of the liquid storage groove, and the liquid supply hole ( 15 ) is a blind hole; and the wall thickness (a) of the thin-wall ( 14 ) formed by the air exchange recess ( 13 ) is smaller than a wall thickness (b) between a bottom of the liquid supply hole ( 15 ) and an outer side of the liquid conducting member ( 1 ).
13. The heating assembly according to claim 12 , wherein the thin-wall ( 14 ) is a wall between a bottom of the air exchange recess ( 13 ) and a lower surface of the liquid conducting member ( 1 ).
14. The heating assembly according to claim 12 , wherein the thin-wall ( 14 ) is a wall between a side wall of the air exchange recess ( 13 ) and the outer side ( 12 ) of the liquid conducting member ( 1 ).
15. The heating assembly according to claim 14 , wherein a size of one end of the liquid conducting member ( 1 ) provided with the liquid storage groove is larger than that of an opposite end of the liquid conducting member ( 1 ), so that the liquid conducting member ( 1 ) is in a stepped shape.
16. The heating assembly according to claim 11 , wherein the air exchange recess ( 13 ) is located in a side wall of the liquid storage groove; or alternatively, the air exchange recess ( 13 ) is located in an outer side of the liquid conducting member ( 1 ).
17. The heating assembly according to claim 9 , wherein the hollow cavity ( 10 ) extends through the liquid conducting member ( 1 ), and the liquid conducting member ( 1 ) is tubular or annular, and the air exchange recess ( 13 ) is located in an outer side wall or an inner side wall of the liquid conducting member ( 1 ).
18. The atomizing device according to claim 10 , wherein the wall thickness of the thin-wall ( 14 ) formed by the air exchange recess ( 13 ) is 0.1 mm to 0.5 mm.