IP Library › Granted Patent US 12,234,978
Granted Patent B2
US 12,234,978 · App. 18/039,819 · Granted Feb 25, 2025

Water-cooled high-power LED module

Inventors: Shaohui Pan (Guangdong, CN); Yaoshun Hong (Guangdong, CN)
Assignee: SHENZHEN LEAFLIFE TECHNOLOGY CO., LTD.
F21V29/58F21V23/002F21V29/503F21V29/89F21V31/005F21Y2113/00F21Y2115/10
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Quick Facts
Patent No.
US 12,234,978
App. No.
18/039,819
Granted
Feb 25, 2025
Kind
B2
Abstract

An LED module includes a base, a rear plate, an LED chip board and a glass window. The back surface of the base includes a channel for introducing cooling water. A sealing ring is compressed between the back surface of the base and the rear plate to seal the channel. A plurality of LED chips connected in series form the LED chip board which is mounted on the front surface of the base and is covered with the glass window.

Claims (18)

1. A light source module comprising:

a base having a channel formed in a back surface of the base, and cooling water included in the channel;

a sealing ring provided adjacent to the channel;

a rear plate coupled to the back surface of the base, such that the sealing ring is compressed between the rear plate and the base to seal the channel;

an LED chip board coupled to a front surface of the base, and comprising a plurality of LED chips;

a wire plate configured to be connected to a power source;

a positive electrode and a negative electrode, each electrode having respective front ends connected with the LED chip board, and respective rear ends connected to the wire plate; and

a window coupled to the front surface of the base and configured to cover the LED chip board.

2. The light source module according to claim 1 , wherein the base is made of copper and gold-plated materials.

3. The light source module according to claim 1 , wherein the channel has a generally S-shape with a plurality of concave portions.

4. The light source module according to claim 1 , wherein the LED chip board includes a substrate made of beryllium oxide ceramic coated with an artificial diamond film, and the substrate is a heat sink.

5. The light source module according to claim 1 , wherein the window is made of glass and fixed to the base by an adhesive.

6. The light source module according to claim 1 , wherein the base further includes an air suction and filling hole, is configured to be used for connecting air suction equipment and pumping out air in a cavity defined between the base and the window, and the air suction and filling hole is further configured to inject a gas into the cavity between the base and the window.

7. The light source module according to claim 1 , the base defining a front opening, wherein each of the plurality of LED chips is a square chip, the LED chip board includes a plurality of gold wires welded in series, and the shape of the LED chip board is matched with that of the front opening of the base.

8. The light source module according to claim 1 , wherein the base further includes an air suction hole configured to be used for connecting air suction equipment and pumping out air in a cavity defined between the base and the window; and an air filling hole, wherein the air suction hole and the air filling hole are configured to be sealed after the base is evacuated of air.

9. The light source module according to claim 8 , wherein the air filling hole is configured to inject a gas into the cavity between the base and the window; and to be sealed after the cavity is filled.

10. The light source module according to claim 1 , wherein each of the plurality of LED chips is welded in series.

11. The light source module according to claim 10 , wherein each of the plurality of LED chips is welded in series using gold wires.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2023
From: PAN, SHAOHUI; HONG, YAOSHUN
To: SHENZHEN LEAFLIFE TECHNOLOGY CO., LTD.
Reel/Frame 063829/0761 →
Priority Claims (1)
CN 202210941675.0 · Aug 8, 2022 · national
Continuity (1)
Related Publication 20240302033A1 · Sep 12, 2024
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