IP Library › Granted Patent US 12,237,046
Granted Patent B2
US 12,237,046 · App. 17/951,567 · Granted Feb 25, 2025

Memory system including an interface circuit connecting a controller and memory

Inventors: Youngmin Jo (Hwaseong-si, KR); Tongsung Kim (Suwon-si, KR); Chiweon Yoon (Seoul, KR); Byunghoon Jeong (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
G11C7/1087G11C7/109G11C7/1093G11C7/222
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Quick Facts
Patent No.
US 12,237,046
App. No.
17/951,567
Granted
Feb 25, 2025
Kind
B2
Abstract

A memory system includes a plurality of memory devices, each connected to internal channels respectively including an internal data channel and an internal control channel, and each configured to perform communication based on a first interface protocol, a controller connected to an external channel including an external data channel and an external control channel and configured to perform communication based on a second interface protocol, and an interface circuit connecting the external channel to each of the internal channels. The interface circuit is configured to perform channel conversion by serializing a parallel data signal received from the controller through the external data channel and outputting the serialized signal to the internal control channel included in a first one of the internal channels, or parallelizing a signal received through the external control channel and outputting the parallelized signal to the internal data channel included in the first one of the internal channels.

Claims (52)

1. A memory system comprising:

first non-volatile memories connected to a first internal channel;

second non-volatile memories connected to a second internal channel;

a memory controller controlling the first and second non-volatile memories through an external channel; and

an interface circuit connecting the external channel to each of the first and second internal channels,

wherein the interface circuit includes:

a command latch enable (CLE) pin, an address latch enable (ALE) pin, and an external data (DQ) pin group, connected to the external channel;

a first command/address (CA) pin group and a first internal DQ pin group connected to the first internal channel;

a decoder configured to determine whether a parallel data signal received from the external DQ pin group is a command signal, an address signal, or a real data signal based on a CLE signal and an ALE signal received from the CLE pin and the ALE pin respectively, and output a decision result signal;

a first serializer configured to serialize the parallel data signal and output the serialized signal to the first internal channel through the first CA pin group;

a first retimer configured to correct a timing of the parallel data signal and output the timing-corrected signal to the first internal channel through the first internal DQ pin group; and

a first demultiplexer configured to provide the parallel data signal to either the first serializer or the first retimer based on the decision result signal of the decoder.

2. The memory system of claim 1 , wherein the interface circuit further includes:

a second CA pin group and a second internal DQ pin group connected to the second internal channel;

a second serializer configured to serialize the parallel data signal and output the serialized signal to the second internal channel through the second CA pin group;

a second retimer configured to correct a timing of the parallel data signal and output the timing-corrected signal to the second internal channel through the second internal DQ pin group;

a second demultiplexer configured to provide the parallel data signal to either the second serializer or the second retimer based on the decision result signal of the decoder; and

a third demultiplexer configured to provide the parallel data signal received from the external DQ pin group to the first demultiplexer or the second demultiplexer based on a selection signal from the memory controller.

3. The memory system of claim 2 , wherein the interface circuit further includes a chip enable (nCE) pin connected to the external channel and configured to receive the selection signal for selecting the first internal channel or the second internal channel from the memory controller.

4. The memory system of claim 1 , wherein the interface circuit further includes:

an external write enable (nWE) pin connected to the external channel;

a first internal nWE pin connected to the first internal channel; and

a clock generator configured to receive an external clock signal from the external nWE pin and output an internal clock signal having a frequency N times (N is a natural number) the frequency of the external clock signal to the first internal nWE pin.

5. The memory system of claim 4 , wherein the frequency of the internal clock signal is determined based on the number N of cycle periods included in a defined time period when one command signal or address signal is output through the first CA pin group in the defined time period.

6. The memory system of claim 5 , wherein the first serializer is configured to output the CLE signal and the ALE signal through the first CA pin group in a specific cycle period of cycle periods of the defined time period, and to output the serialized parallel data signal through the first CA pin group in the remaining cycle periods of the cycle periods.

7. The memory system of claim 1 , wherein the interface circuit is configured to receive a data strobe signal together with the parallel data signal, and

the first retimer is configured to generate a phase-delayed clock signal by delaying a phase of the data strobe signal, and generate the timing-corrected signal by sampling the parallel data signal using the phase-delayed clock signal.

8. The memory system of claim 1 , wherein:

the memory controller is configured to input and output signals based on a first interface protocol, and

the first and second non-volatile memories are configured to input and output signals based on a second interface protocol.

9. The memory system of claim 1 , wherein the first and second non-volatile memories and the interface circuit constitute a non-volatile memory package.

10. The memory system of claim 9 , wherein the memory controller and the non-volatile memory package are implemented as part of a single package formed on a printed circuit board.

11. The memory system of claim 9 , wherein the memory controller and the non-volatile memory package are implemented as separate packages.

12. The memory system of claim 9 , wherein the first and second non-volatile memories are configured to be stacked.

13. The memory system of claim 12 , wherein the first and second non-volatile memories and the interface circuit are directly connected to each other through wire bonding.

14. A memory system comprising:

a plurality of memory devices, each connected to internal channels respectively including an internal data channel and an internal control channel, and each configured to perform communication based on a first interface protocol;

a controller connected to an external channel including an external data channel and an external control channel and configured to perform communication based on a second interface protocol; and

an interface circuit connecting the external channel to each of the internal channels,

wherein the interface circuit is configured to perform channel conversion by serializing a parallel data signal received from the controller through the external data channel and outputting the serialized signal to the internal control channel included in a first one of the internal channels, or parallelizing a serial signal received through the external control channel and outputting the parallelized signal to the internal data channel included in the first one of the internal channels.

15. The memory system of claim 14 , further comprising:

for each memory device, a plurality of first pins connecting the memory device to the interface circuit through the internal channels; and

a plurality of second pins connecting the interface circuit to the controller through the external channel.

16. The memory system of claim 15 , wherein:

for each memory device, the internal channels include:

a first internal data channel for inputting and outputting the serialized data signal to a first group of pins of the plurality of first pins, and

a first internal control channel for inputting control signals to a second group of pins of the plurality of first pins.

17. The memory system of claim 16 , wherein:

the external channel includes:

a first external data channel for inputting and outputting the parallel data signal to a first group of pins of the plurality of second pins, and

a first external control channel for inputting control signals to a second group of pins of the plurality of second pins.

18. The memory system of claim 16 , wherein the interface circuit is on an interface chip.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2022
From: JO, YOUNGMIN; KIM, TONGSUNG; YOON, CHIWEON; JEONG, BYUNGHOON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061401/0609 →
Priority Claims (2)
KR 10-2021-0164104 · Nov 25, 2021 · national
KR 10-2022-0027356 · Mar 3, 2022 · national
Continuity (1)
Related Publication 20230162766A1 · May 25, 2023
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