IP Library Granted Patent US 12,237,345
Granted Patent B2
US 12,237,345 · App. 18/366,859 · Granted Feb 25, 2025

Semiconductor device

Inventors: Hajime Watakabe (Tokyo, JP); Isao Suzumura (Tokyo, JP); Akihiro Hanada (Tokyo, JP); Yohei Yamaguchi (Tokyo, JP)
Assignee: Japan Display Inc.
H01L27/1292H01L27/1225H01L29/24H01L29/66757H01L29/66969H01L29/78666H01L29/7869
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,237,345
App. No.
18/366,859
Granted
Feb 25, 2025
Kind
B2
Abstract

A display device including a substrate having thin film transistors (TFT) comprising: the TFT including an oxide semiconductor film, a gate electrode and an insulating film formed between the oxide semiconductor film and the gate electrode, wherein a first aluminum oxide film and a second aluminum oxide film, which is formed on the first aluminum oxide film, are formed between the insulating film and the gate electrode, an oxygen concentration in the first aluminum oxide film is bigger than an oxygen concentration in the second aluminum oxide film.

Claims (19)

1. A semiconductor device comprising:

an oxide semiconductor film,

a gate electrode, and

a gate insulating film arranged between the oxide semiconductor film and the gate electrode,

wherein an aluminum oxide film is arranged between the gate insulating film and the gate electrode,

the aluminum oxide film has a first aluminum oxide film and a second aluminum oxide film,

the gate insulating film is made of silicon oxide,

a first oxygen concentration in the first aluminum oxide film is bigger than a second oxygen concentration in the second aluminum oxide film.

2. The semiconductor device according to claim 1 ,

wherein a thickness of the second aluminum oxide film is bigger than a thickness of the first aluminum oxide film.

3. The semiconductor device according to claim 2 ,

wherein a thickness of the first aluminum oxide film is 2-5 nm.

4. The semiconductor device according to claim 2 ,

wherein a thickness of the second aluminum oxide film is 5-10 nm.

5. The semiconductor device according to claim 1 ,

wherein the gate insulating film is formed between the gate electrode and the oxide semiconductor film, and

the gate insulating film is not formed on a drain or a source of the oxide semiconductor film.

6. The semiconductor device according to claim 5 ,

the aluminum oxide film and the gate electrode are formed by patterning after stacking to cover the oxide semiconductor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2025
From: JAPAN DISPLAY INC.
To: MAGNOLIA WHITE CORPORATION
Reel/Frame 072130/0313 →
Priority Claims (1)
JP 2017-207026 · Oct 26, 2017 · national
Continuity (4)
Continuation 17459423 · Aug 27, 2021
Continuation 16852925 · Apr 20, 2020
Continuation PCTJP2018028405 · Jul 30, 2018
Related Publication 20230387146A1 · Nov 30, 2023
References Cited (9)
US 11133337B2 · Watakabe · 2021 [cited by examiner]
US 11764233B2 · Watakabe · 2023 [cited by examiner]
US 20120112182A1 · Ishii et al. · 2012 [cited by applicant]
US 20140061632A1 · Lee et al. · 2014 [cited by applicant]
US 20170207245A1 · Hanada et al. · 2017 [cited by applicant]
JP 2012099757A · 2012 [cited by applicant]
JP 2014053590A · 2014 [cited by applicant]
JP 2017126693A · 2017 [cited by applicant]
Japanese Office Action dated Aug. 15, 2023, for the corresponding Japanese Patent Application No. 2022-115423, with English translation. [cited by applicant]