Heat sink and electronic device
A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.
1. A heat sink, configured for use in an electronic device, wherein the electronic device comprises a first heat source and a second heat source that are disposed on a circuit board, the heat sink comprising:
a first heat dissipation module in thermal contact with the first heat source;
a heat dissipation base in thermal contact with the second heat source, wherein the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly disposed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and
a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, wherein the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening at least partially aligned with the first opening, and the first heat dissipation module sequentially extends through the second opening and the first opening to be in thermal contact with the first heat source.
2. The heat sink according to claim 1 , wherein the first heat dissipation module and the second heat dissipation module are both liquid cooling structures.
3. The heat sink according to claim 2 , wherein the first heat dissipation module comprises a cover plate, a cooling cavity, and a cooling plate, the cooling cavity is disposed between the cover plate and the cooling plate, the cover plate is connected to the cooling plate, and the cover plate is provided with a first working substance input/output interface in communication with the cooling cavity.
4. The heat sink according to claim 3 , wherein the second heat dissipation module is provided with a second working substance input/output interface, and the first working substance input/output interface is in communication with the second working substance input/output interface by using a hose.
5. The heat sink according to claim 3 , wherein the second heat dissipation module is further provided with another working substance input/output interface, and the another working substance input/output interface is configured to connect to an external working substance circulation system.
6. The heat sink according to claim 5 , wherein the another working substance input/output interface is connected to a connector, the connector comprises a first cavity and a first valve plug disposed at an inlet/outlet of the first cavity, the first valve plug is connected to a bottom wall of the first cavity by using a first elastic structure, the first valve plug is configured to be blocked at the inlet/outlet of the first cavity under an abutting action of the first elastic structure to make the connector closed, and the first valve plug is configured to exit from the inlet/outlet of the first cavity under an action of external force to conduct the connector.
7. The heat sink according to claim 1 , wherein the heat dissipation base is provided with a first thermally conductive plate, the second heat dissipation module is provided with a second thermally conductive plate, and the first thermally conductive plate is in thermal contact with the second thermally conductive plate.
8. The heat sink according to claim 7 , wherein an elastic thermally conductive block is further disposed between the first thermally conductive plate and the second thermally conductive plate, and the first thermally conductive plate is in thermal contact with the second thermally conductive plate by using the elastic thermally conductive block.
9. The heat sink according to claim 8 , wherein the elastic thermally conductive block is U-shaped.
10. The heat sink according to claim 1 , wherein a heat pipe is disposed between the second heat dissipation module and the heat dissipation base, one end of the heat pipe is connected to the second heat dissipation module, and an other end is connected to the heat dissipation base.
11. The heat sink according to claim 10 , wherein the heat pipe is U-shaped and is deformable in a direction perpendicular to a thermally conductive surface of the heat dissipation base.
12. The heat sink according to claim 1 , wherein the first heat dissipation module is in thermal contact with the first heat source by using a thermal interface material; and the heat dissipation base is in thermal contact with the second heat source by using a thermal pad.
13. The heat sink according to claim 1 , wherein the first heat dissipation module is floatingly disposed on the heat dissipation base by using a floating bolt.
14. An electronic device comprising:
a circuit board,
a first heat source and a second heat source that are disposed on the circuit board, and
a heat sink that comprises:
a first heat dissipation module in thermal contact with the first heat source;
a heat dissipation base in thermal contact with the second heat source, wherein the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly disposed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and
a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, wherein the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening at least partially aligned the first opening, and the first heat dissipation module sequentially extends through the second opening and the first opening to be in thermal contact with the first heat source.
15. The electronic device according to claim 14 , wherein the first heat dissipation module and the second heat dissipation module are both liquid cooling structures.
16. The electronic device according to claim 15 , wherein the first heat dissipation module comprises a cover plate, a cooling cavity, and a cooling plate, the cooling cavity is disposed between the cover plate and the cooling plate, the cover plate is connected to the cooling plate, and the cover plate is provided with a first working substance input/output interface in communication with the cooling cavity.
17. The electronic device according to claim 16 , wherein the second heat dissipation module is provided with a second working substance input/output interface, and the first working substance input/output interface is in communication with the second working substance input/output interface by using a hose.
18. The electronic device according to claim 16 , wherein the second heat dissipation module is further provided with another working substance input/output interface, and the another working substance input/output interface is configured to connect to an external working substance circulation system.
19. The electronic device according to claim 18 , wherein the another working substance input/output interface is connected to a connector, the connector comprises a first cavity and a first valve plug disposed at an inlet/outlet of the first cavity, the first valve plug is connected to a bottom wall of the first cavity by using a first elastic structure, the first valve plug is configured to be blocked at the inlet/outlet of the first cavity under an abutting action of the first elastic structure to make the connector closed, and the first valve plug is configured to exit from the inlet/outlet of the first cavity under an action of external force to conduct the connector.
20. The electronic device according to claim 14 , wherein the first heat source is a chip; and the second heat source comprises a storage element and/or a power supply device.