Condition monitoring device for monitoring the condition of a mechanical machine component
The present disclosure relates to a condition monitoring device for monitoring a condition of a mechanical machine component. The condition monitoring device may include a vibration sensor configured to detect mechanical vibrations on the mechanical machine component; a controller coupled to the vibration sensor and configured to determine a condition of the mechanical machine component based at least in part on measurement data generated by the vibration sensor; and a wired communication interface coupled to the controller and configured to communicate with an external control device, wherein, based at least in part on a request to provide information about the condition of the mechanical machine component, the controller is configured to transmit the requested information via the wired communication interface.
1. An input output link (IO-Link) condition monitoring device for monitoring a condition of a mechanical machine component, comprising:
a vibration sensor configured to detect mechanical vibrations on the mechanical machine component;
a first input configured to connect at least one external temperature sensor configured to record at least one temperature of the mechanical machine component, wherein the first input comprises a plurality of resistant temperature detection (RTD) lines configured to connect to at least one external resistance temperature sensor;
a controller coupled to the vibration sensor and configured to determine the condition of the mechanical machine component based at least in part on measurement data generated by the vibration sensor, wherein the controller is configured to determine the condition of the mechanical machine component based at least in part on measurement data from the first input;
a first analog-to-digital (A/D) converter configured to detect a voltage drop at the plurality of resistant temperature detection lines and relay a digital value of the voltage drop to the controller; and
a wired IO-Link communication interface coupled to the controller and configured to communicate with an external control device, wherein:
the controller is configured to operate as a slave in a master/slave operation and to be controlled via the wired IO-Link communication interface, and
based at least in part on a request to provide information about the condition of the mechanical machine component, the controller is configured to transmit the requested information via the IO-Link wired communication interface; wherein the condition of the mechanical component is classified as one of: no damage, slight predamage, or defective.
2. The IO-Link condition monitoring device according to claim 1 , wherein the wired IO-Link communication interface is configured to couple the IO-Link condition monitoring device to the external control device via a point-to-point connection.
3. The IO-Link condition monitoring device according to claim 1 , wherein the wired IO-Link communication interface is configured to supply the IO-Link condition monitoring device with external direct current (DC) voltage.
4. The IO-Link condition monitoring device according to claim 3 , further comprising:
a DC converter configured to convert the external DC voltage supplied via the wired IO-Link communication interface to an internal system voltage.
5. The IO-Link condition monitoring device according to claim 1 , further comprising:
an IO-link physical layer (PHY) circuit configured to transmit information about the condition of the mechanical machine component to the external control device.
6. The IO-Link condition monitoring device according to claim 1 , further comprising:
an internal power source configured to drive a prespecified current through the at least one external resistance temperature sensor via the plurality of RTD lines.
7. The IO-Link condition monitoring device according to claim 6 , wherein the controller is configured to calculate a resistance proportional to a measured temperature of the at least one external resistance temperature sensor based at least in part on the voltage drop at the plurality of RTD lines and the prespecified current driven via the plurality of RTD lines.
8. The IO-Link condition monitoring device according to claim 1 , further comprising:
a second input configured to connect at least one external speed or position sensor configured to record at least one speed or position, respectively, of the mechanical machine component,
wherein the controller is configured to determine the condition of the mechanical machine component based at least in part on measurement data from the second input.
9. The IO-Link condition monitoring device according to claim 8 , further comprising:
at least one Synchronous Serial Interface (SSI) configured to read measurement data of the at least one external speed or position sensor connected to the second input and transmit the measurement data from the second input to the controller.
10. The IO-Link condition monitoring device according to claim 1 , wherein the vibration sensor is configured as a microelectromechanical system (MEMS)-based semiconductor-based vibration sensor.
11. The IO-Link condition monitoring device according to claim 1 , wherein the controller is configured to determine an amplitude spectrum based at least in part on the measurement data generated by the vibration sensor.
12. The IO-Link condition monitoring device according to claim 11 , further comprising:
a high-pass filter configured to filter the measurement data generated by the vibration sensor;
a rectifier configured to rectify the high-pass filtered measurement data of the vibration sensor; and
a second analogue to digital (A/D) converter configured to convert the rectified high-pass filtered measurement data of the vibration sensor to digital measurement data,
wherein the controller is configured to determine the amplitude spectrum based at least in part on the digital measurement data of the vibration sensor.
13. The IO-Link condition monitoring device according to claim 12 , wherein the second A/D converter is integrated in the vibration sensor, and wherein the high-pass filter comprises a function in the controller.
14. The IO-Link condition monitoring device according to claim 1 , wherein the wired IO-Link communication interface comprises an M12 threaded coupling connector configured to activate the external control device and to connect to a power supply.
15. A method for monitoring a condition of a mechanical machine component, comprising:
detecting, by a vibration sensor, mechanical vibrations on the mechanical machine component;
connecting, by a first input, at least one external temperature sensor configured to record at least one temperature of the mechanical machine component, wherein the first input comprises a plurality of resistant temperature detection lines configured to connect to at least one external resistance temperature sensor;
determining, by a controller, the condition of the mechanical machine component based at least in part on measurement data generated by the vibration sensor and measurement data from the first input, wherein an analog-to-digital (A/D) converter detects a voltage drop at the plurality of resistant temperature detection lines and relays a digital value of the voltage drop to the controller, wherein the controller is configured to operate as a slave in a master/slave operation and to be controlled via a wired IO-Link communication interface; and
transmitting, by the controller, via the wired IO-Link communication interface to an external control device, information about the condition of the mechanical machine component based at least in part on a request to provide the information, wherein the condition of the mechanical component is classified as one of: no damage, slight predamage, or defective.