IP Library › Granted Patent US 12,241,926
Granted Patent B2
US 12,241,926 · App. 17/512,021 · Granted Mar 4, 2025

Test apparatus

Inventors: Naoyoshi Watanabe (Tokyo, JP); Shigeyuki Sato (Sendai, JP); Ryoichi Utsumi (Sendai, JP)
Assignees: ADVANTEST CORPORATION; TOEI SCIENTIFIC INDUSTRIAL CO., LTD.
G01R31/2601G01R1/0491G01R1/07342G01R31/2831
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,241,926
App. No.
17/512,021
Granted
Mar 4, 2025
Kind
B2
Abstract

A test apparatus tests a wafer under test on which devices under test each including magnetoresistive memory or a magnetic sensor are formed. In a test process, the wafer under test is mounted on a stage. In the test process, a magnetic field application apparatus applies a magnetic field B EX to the wafer under test. A test probe card is used in the test process. Multiple magnetization detection units are formed on a diagnostic wafer. In a diagnostic process of the test apparatus, the diagnostic wafer is mounted on the stage instead of the wafer under test. Each magnetization detection unit is capable of measuring a magnetic field B EX generated by the magnetic field application apparatus. In the diagnostic process, the diagnostic probe card is used instead of the test probe card.

Claims (22)

1. A test method for testing, by a test apparatus, a wafer under test on which devices under test each comprising magnetoresistive memory or a magnetic sensor are formed, the method comprising:

mounting the wafer under test on a stage in a test process;

applying, by a magnetic field application apparatus, a magnetic field to the wafer under test in the test process;

making, by a test probe card, probe contact with the wafer under test in the test process;

removing the wafer under test;

mounting a diagnostic wafer on the stage in a diagnostic process of the test apparatus after the removing the wafer under test, wherein a plurality of magnetization detection units are formed on the diagnostic wafer, and the diagnostic wafer is structured to measure a magnetic field generated by the magnetic field application apparatus by means of each magnetization detection unit in the diagnostic process;

removing the test probe card; and

using a diagnostic probe card in the diagnostic process after the removing the test probe card, and making probe contact with the diagnostic wafer.

2. The test method according to claim 1 , wherein the test apparatus further comprises a connection unit arranged between the test probe card or the diagnostic probe card and a test head of the test apparatus,

wherein the magnetic field application apparatus is provided to the connection unit.

3. The test method according to claim 1 , wherein the plurality of magnetization detection units each comprise:

a magnetic sensor; and

an amplifier structured to amplify an electrical signal output from the magnetic sensor.

4. The test method according to claim 2 , wherein the plurality of magnetization detection units each comprise:

a magnetic sensor; and

an amplifier structured to amplify an electrical signal output from the magnetic sensor.

5. The test method according to claim 1 , wherein the plurality of magnetization detection units each comprise a magnetic sensor,

wherein the diagnostic probe card comprises a plurality of amplifiers that correspond to the plurality of magnetization detection units,

and wherein each amplifier is structured to amplify an electrical signal output from the corresponding magnetic sensor.

6. The test method according to claim 2 , wherein the plurality of magnetization detection units each comprise a magnetic sensor,

wherein the diagnostic probe card comprises a plurality of amplifiers that correspond to the plurality of magnetization detection units,

and wherein each amplifier is structured to amplify an electrical signal output from the corresponding magnetic sensor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2025
From: TOEI SCIENTIFIC INDUSTRIAL CO., LTD.
To: TOEI CO., LTD.
Reel/Frame 073252/0706 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2021
From: WATANABE, NAOYOSHI; SATO, SHIGEYUKI; UTSUMI, RYOICHI
To: ADVANTEST CORPORATION; TOEI SCIENTIFIC INDUSTRIAL CO., LTD.
Reel/Frame 057934/0367 →
Priority Claims (1)
JP 2020-020831 · Feb 10, 2020 · national
Continuity (2)
Continuation PCTJP2020046821 · Dec 15, 2020
Related Publication 20220050136A1 · Feb 17, 2022
References Cited (22)
US 20130009659A1 · Liu · 2013 [cited by examiner]
US 20190137543A1 · Eo · 2019 [cited by examiner]
US 20190178933A1 · Lindenberg · 2019 [cited by examiner]
US 20210172978A1 · Funatoko · 2021 [cited by examiner]
CN 1249535A · 2000 [cited by applicant]
CN 107305236A · 2017 [cited by applicant]
EP 3070486A1 · 2016 [cited by applicant]
JP H04334077A · 1992 [cited by applicant]
JP 2004151056A · 2004 [cited by applicant]
JP 2007024518A · 2007 [cited by applicant]
JP 2007147568A · 2007 [cited by applicant]
JP 2007243068A · 2007 [cited by applicant]
JP 2008139305A · 2008 [cited by applicant]
JP 2009069005A · 2009 [cited by applicant]
JP 2012198102A · 2012 [cited by applicant]
TW 200613740A · 2006 [cited by applicant]
TW 201538986A · 2015 [cited by applicant]
International Search Report for International Application No. PCT/JP2020/046821; Date of Mailing; Feb. 22, 2021. [cited by applicant]
TIPO Notification of Reasons for Rejection for corresponding TW Application No. 110100137; Issued on Jul. 26, 2021. [cited by applicant]
International Preliminary Report on Patentability with Written Opinion of the International Searching Authority for the Internatonal Patent Application No. PCT/JP2020/046821; Mailing Date Aug. 11, 2022. [cited by applicant]
CNIPA First Office Action for corresponding CN Application No. 202080031184.1; Issued Dec. 29, 2023; 15 pages. [cited by applicant]
CNIPA Second Office Action for corresponding CN Application No. 202080031184.1; Issued Jun. 30, 2024. [cited by applicant]