Integrated circuit package and method of forming same
A package includes a package substrate including an insulating layer having a trench and a package component bonded to the package substrate. The package component includes a redistribution structure, an optical die bonded to the redistribution structure, the optical die including an edge coupler near a first sidewall of the optical die, a dam structure on the redistribution structure near the first sidewall of the optical die, a first underfill between the optical die and the redistribution structure, an encapsulant encapsulating the optical die, and an optical glue in physical contact with the first sidewall of the optical die. The first underfill does not extend along the first sidewall of the optical die. The optical glue separates the dam structure from the encapsulant. The package further includes a second underfill between the insulating layer and the package component. The second underfill is partially disposed in the trench.
1. A package comprising:
a package substrate comprising an insulating layer having a trench;
a package component bonded to the package substrate adjacent to the trench, the package component comprising:
a redistribution structure;
an optical die bonded to the redistribution structure, the optical die comprising an edge coupler near a first sidewall of the optical die;
a dam structure on the redistribution structure near the first sidewall of the optical die;
a first underfill between the optical die and the redistribution structure, the first underfill being in physical contact with the dam structure, the first underfill not extending along the first sidewall of the optical die;
an encapsulant encapsulating the optical die; and
an optical glue in physical contact with the first sidewall of the optical die, the optical glue separating the dam structure from the encapsulant; and
a second underfill between the insulating layer of the package substrate and the package component, wherein the second underfill is partially disposed in the trench.
2. The package of claim 1 , further comprising a fiber array unit coupled to the optical die, wherein the optical glue is interposed between the edge coupler and the fiber array unit.
3. The package of claim 2 , further comprising an optical fiber attached to the fiber array unit.
4. The package of claim 1 , wherein the dam structure partially overlaps with the optical die in a plan view.
5. The package of claim 1 , wherein the first sidewall of the optical die is vertically aligned to a first sidewall of the dam structure.
6. The package of claim 1 , wherein the trench partially overlaps with the optical die in a plan view.
7. The package of claim 1 , wherein a center of the edge coupler, a center of the dam structure and a center of the trench are aligned along a same line in a plan view.
8. A package comprising:
a package substrate comprising an insulating layer having a trench;
a package component bonded to the package substrate, a first sidewall of the package component being proximate to the trench;
a fiber array unit attached to the first sidewall of the package component, wherein the package component comprises:
a redistribution structure;
an optical die bonded to the redistribution structure, the optical die comprising an edge coupler, wherein a first sidewall of the optical die and the first sidewall of the package component are proximate to the edge coupler;
an optical glue in physical contact with the first sidewall of the optical die and between the edge coupler and the fiber array unit;
a dam structure on the redistribution structure adjacent to the first sidewall of the optical die, the dam structure being embedded into the optical glue; and
a first underfill between the optical die and the redistribution structure, the first underfill being in physical contact with the dam structure and the optical glue, the first underfill not extending between the edge coupler and the optical glue; and
a second underfill between the insulating layer of the package substrate and the package component, wherein the second underfill partially fills the trench, and wherein the second underfill does not extend between the edge coupler and the fiber array unit.
9. The package of claim 8 , further comprising a support structure on the package substrate adjacent to the first sidewall of the package component, wherein the fiber array unit is attached to the support structure.
10. The package of claim 8 , wherein the package component further comprises an encapsulant over the redistribution structure, wherein the optical die and the optical glue are embedded in the encapsulant, and wherein the encapsulant does not extend between the edge coupler and the optical glue.
11. The package of claim 10 , wherein the encapsulant does not extend between the edge coupler and the fiber array unit.
12. The package of claim 8 , further comprising a heat dissipation lid attached to the package substrate and covering the package component, wherein the heat dissipation lid comprises an opening exposing the fiber array unit.
13. The package of claim 12 , further comprising an optical fiber within the opening in the heat dissipation lid and attached to the fiber array unit.
14. The package of claim 8 , wherein the first sidewall of the package component is vertically aligned to a first sidewall of the trench.
15. A method comprising:
forming a package component, wherein forming the package component comprises:
forming a redistribution structure;
forming a dam structure on the redistribution structure;
bonding an optical die to the redistribution structure, the optical die comprising an edge coupler proximate to a first sidewall of the optical die, the first sidewall of the optical die being adjacent to the dam structure;
depositing a first underfill in a first gap between the optical die and the redistribution structure, wherein the first underfill is in physical contact with the dam structure, and wherein the first underfill does not extend along the first sidewall of the optical die;
forming an optical glue over the dam structure, wherein the optical glue extends along and is in physical contact with the first sidewall of the optical die; and
forming an encapsulant over the optical glue, wherein the optical glue separates the dam structure from the encapsulant;
forming a trench in an uppermost insulating layer of a package substrate;
bonding the package component to the package substrate, the edge coupler of the optical die being adjacent to the trench; and
depositing a second underfill in a second gap between the package component and the package substrate, wherein the second underfill partially fills the trench, and wherein the second underfill does not extend along the first sidewall of the optical die.
16. The method of claim 15 , further comprising attaching a fiber array unit to the first sidewall of the optical die, wherein no portion of the first underfill, no portion of the second underfill and no portion of the encapsulant extend between the edge coupler and the fiber array unit.
17. The method of claim 16 , further comprising, before attaching the fiber array unit to the first sidewall of the optical die, attaching a support structure to the uppermost insulating layer of the package substrate adjacent to the first sidewall of the optical die, wherein the fiber array unit is attached to the support structure.
18. The method of claim 16 , further comprising attaching a heat dissipation lid to the package substrate, the heat dissipation lid covering the package component, wherein the heat dissipation lid comprises an opening exposing the fiber array unit.
19. The method of claim 18 , further comprising attaching an optical fiber to the fiber array unit, wherein the optical fiber is disposed in the opening of the heat dissipation lid.
20. The method of claim 15 , further comprising, before bonding the optical die to the redistribution structure, forming a plurality of conductive connectors on the redistribution structure, wherein the plurality of conductive connectors and the dam structure are formed in a same process.