IP Library › Granted Patent US 12,243,866
Granted Patent B2
US 12,243,866 · App. 18/361,454 · Granted Mar 4, 2025

Power switch for backside power distribution

Inventor: Jack Liu (Taipei, TW)
Assignee: Taiwan Semiconductor Manufacturing Company Limited
H01L27/0207G06F30/392H01L21/823475H01L23/5286G06F30/31G06F2117/12
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Quick Facts
Patent No.
US 12,243,866
App. No.
18/361,454
Granted
Mar 4, 2025
Kind
B2
Abstract

Disclosed embodiments herein relate to an integrated circuit including power switches with active regions connected to form a contiguous region. In one aspect, the integrated circuit includes a first layer including a first metal rail extending in a first direction. In one aspect, the integrated circuit includes a second layer above the first layer along a second direction perpendicular to the first direction. The second layer may include active regions for power switches. In one aspect, the active regions of the power switches are connected to form a contiguous region extending in the first direction. The first metal rail may be electrically coupled to the active regions through via contacts. In one aspect, the integrated circuit includes a third layer above the second layer along the second direction. The third layer may include a second metal rail electrically coupled to some of the power switches through additional via contacts.

Claims (36)

1. An integrated circuit, comprising:

a first layer, extending along a first lateral direction, that includes a first active region and a second active region, wherein the first active region and second active region are separated from each other along the first lateral direction;

a second layer, disposed on a first side of the first layer, that includes a first metal rail and a second metal rail separated from each other with a distance along the first lateral direction; and

a third layer, disposed on a second, opposite side of the first layer, that includes a third metal rail,

wherein the first active region has a length along the first lateral direction larger than four times the distance.

2. The integrated circuit of claim 1 , wherein the first metal rail is electrically coupled to the first active region and the second metal rail is electrically coupled to the second active region.

3. The integrated circuit of claim 1 , wherein the first active region is configured to form a set of power switches.

4. The integrated circuit of claim 3 , wherein each of the set of power switches is configured to regulate one or more supply voltages to obtain one or more regulated supply voltages and provide the one or more regulated supply voltages to a corresponding circuit.

5. The integrated circuit of claim 4 , wherein the corresponding circuit is formed by one or more other active regions disposed opposite the second active region from the first active region along the first lateral direction.

6. The integrated circuit of claim 3 , wherein the length of the first active region is at least 1.1×M×N, where the M is a nonzero number of the set of power switches and the N is larger than four times the distance.

7. The integrated circuit of claim 3 , wherein the length of the first active region is less than or equal to 1.4×M×N, where the M is a nonzero number of the set of power switches and the Nis larger than four times the distance.

8. The integrated circuit of claim 1 , wherein the first metal rail, the second metal rail, and the third metal rail are connected to the first active region, the second active region, and the first active region through a first via contact, a second via contact, and a third via contact, respectively.

9. The integrated circuit of claim 8 , wherein the first and second via contacts are formed on the first side of the first layer, and the third via contact is formed on the second side of the first layer.

10. The integrated circuit of claim 1 , further comprising:

a fourth layer, disposed on the first side of the first layer, that includes a plurality of fourth metal rails extending in a second lateral direction orthogonal to the first lateral direction.

11. The integrated circuit of claim 1 , further comprising:

a redistribution layer disposed on the first side of the first layer; and

a bump layer disposed on the first side of the first layer and coupled to the redistribution layer.

12. An integrated circuit, comprising:

a first layer, extending along a first lateral direction, that includes a first active region and a second active region, wherein the first active region and second active region are separated from each other along the first lateral direction;

a second layer, disposed on a first side of the first layer, that includes a first metal rail and a second metal rail separated from each other with a distance along the first lateral direction; and

a third layer, disposed on a second, opposite side of the first layer, that includes a third metal rail,

wherein the first active region has a length along the first lateral direction larger than the distance, and wherein the first active region is configured to form a set of power switches.

13. The integrated circuit of claim 12 , wherein the length of the first active region is at least 1.1×M×N, where the M is a nonzero number of the set of power switches and the N is larger than four times the distance.

14. The integrated circuit of claim 12 , wherein the length of the first active region is less than or equal to 1.4×M×N, where the M is a nonzero number of the set of power switches and the N is larger than four times the distance.

15. The integrated circuit of claim 12 , wherein each of the set of power switches is configured to regulate one or more supply voltages to obtain one or more regulated supply voltages and provide the one or more regulated supply voltages to a corresponding circuit.

16. The integrated circuit of claim 15 , wherein the corresponding circuit is formed by one or more other active regions disposed opposite the second active region from the first active region along the first lateral direction.

17. The integrated circuit of claim 12 , wherein the first metal rail, the second metal rail, and the third metal rail are connected to the first active region, the second active region, and the first active region through a first via contact, a second via contact, and a third via contact, respectively.

18. The integrated circuit of claim 17 , wherein the first and second via contacts are formed on the first side of the first layer, and the third via contact is formed on the second side of the first layer.

19. An integrated circuit, comprising:

a first layer, extending along a first lateral direction, that includes a first active region and a second active region, wherein the first active region and second active region are separated from each other along the first lateral direction;

a second layer, disposed on a first side of the first layer, that includes a first metal rail and a second metal rail separated from each other with a distance along the first lateral direction; and

a third layer, disposed on a second, opposite side of the first layer, that includes a third metal rail;

wherein the first active region has a length along the first lateral direction larger than the distance, and the first active region is configured to form a set of power switches;

wherein the first metal rail, the second metal rail, and the third metal rail are connected to the first active region, the second active region, and the first active region through a first via contact, a second via contact, and a third via contact, respectively.

20. The integrated circuit of claim 19 , wherein the length of the first active region is at least 1.1×M×N and less than or equal to 1.4×M×N, where the M is a nonzero number of the set of power switches and the N is larger than four times the distance.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2023
From: LIU, JACK
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 064471/0048 →
Continuity (2)
Continuation 16877256 · May 18, 2020
Related Publication 20230378157A1 · Nov 23, 2023
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