Image sensors including a photodiode
An image sensor including: a semiconductor substrate having a first surface and a second surface; a pixel device isolation film extending from the first surface of the semiconductor substrate into the semiconductor substrate, wherein the pixel device isolation film defines pixels in the semiconductor substrate, and includes a conductive layer; and a device isolation structure located inside a device isolation trench that extends from the first surface of the semiconductor substrate into the semiconductor substrate, wherein the device isolation structure includes a conductive liner electrically connected to the conductive layer, wherein a negative bias is applied to the conductive layer and the conductive liner.
1. An image sensor comprising:
a semiconductor substrate having a first surface and a second surface;
a pixel device isolation film extending from the first surface of the semiconductor substrate into the semiconductor substrate, wherein the pixel device isolation film defines pixels in the semiconductor substrate, and comprises a conductive layer; and
a device isolation structure located inside a device isolation trench that extends from the first surface of the semiconductor substrate into the semiconductor substrate, wherein the device isolation structure comprises a conductive liner electrically connected to the conductive layer,
wherein a negative bias is applied to the conductive layer and the conductive liner.
2. The image sensor of claim 1 , wherein the pixel device isolation film is located inside a pixel trench that penetrates the semiconductor substrate, and
the conductive liner is connected to the conductive layer in a region in which the device isolation trench and the pixel trench overlap each other.
3. The image sensor of claim 2 , wherein the device isolation structure further comprises:
an insulating liner on an inner wall of the device isolation trench; and
a buried insulating layer filling the device isolation trench and disposed on the insulating liner,
wherein the conductive liner is interposed between the insulating liner and the buried insulating layer.
4. The image sensor of claim 3 , wherein the conductive layer has a top surface at a higher level than that of a bottom surface of the device isolation trench.
5. The image sensor of claim 3 , wherein the conductive layer comprises:
a pair of protrusion portions extending outwards with respect to sidewalls of the conductive layer, wherein the pair of protrusion portions are at a level higher than that of a bottom portion of the device isolation trench, and
the pair of protrusion portions are at least partially surrounded by the buried insulating layer.
6. The image sensor of claim 5 , wherein the pixel device isolation film further comprises:
a lower insulating layer arranged inside the pixel trench and covering the sidewalls of the conductive layer; and
an upper insulating layer arranged between the buried insulating layer and the pair of protrusion portions, wherein the upper insulating layer is spaced apart from the lower insulating layer.
7. The image sensor of claim 2 , wherein the device isolation structure comprises:
an insulating liner arranged on an inner wall of the device isolation trench and between the semiconductor substrate and the conductive liner,
a gap-fill conductive layer arranged between the conductive liner and the conductive layer; and
a buried insulating layer filling the device isolation trench and disposed on the conductive liner and the gap-fill conductive layer.
8. The image sensor of claim 7 , wherein the conductive layer comprises:
a pair of protrusion portions at a level higher than that of a bottom portion of the device isolation trench, and
the gap-fill conductive layer overlaps a top surface of the conductive layer and the pair of protrusion portions.
9. The image sensor of claim 7 , wherein the conductive liner and the gap-fill conductive layer each has a top surface at a level lower than that of the first surface of the semiconductor substrate.
10. The image sensor of claim 1 , wherein the conductive liner has a thickness from about 5 nm to about 30 nm.
11. The image sensor of claim 1 , further comprising a backside contact structure located inside a backside contact hole that is formed in the second surface of the semiconductor substrate, wherein the backside contact structure is connected to the conductive layer of the pixel device isolation film.
12. An image sensor comprising:
a semiconductor substrate having a first surface and a second surface;
a pixel device isolation film located inside a pixel trench that penetrates the semiconductor substrate, wherein the pixel device isolation trench comprises a conductive layer; and
a device isolation structure located inside a device isolation trench that extends from the first surface of the semiconductor substrate, wherein the device isolation structure defines an active region,
wherein the device isolation structure comprises:
an insulating liner on an inner wall of the device isolation trench;
a conductive liner on the insulating liner and covering the inner wall of the device isolation trench; and
a buried insulating layer filling the device isolation trench and disposed on the conductive liner,
wherein, in a region in which the device isolation structure and the pixel device isolation film vertically overlap each other, the conductive liner is electrically connected to the conductive layer.
13. The image sensor of claim 12 , wherein the conductive layer comprises:
a pair of protrusion portions extending outwards with respect to sidewalls of the conductive layer, wherein the pair of protrusion portions are at a level higher than that of a bottom portion of the device isolation trench, and
the conductive layer has a top surface at a higher level than that of a bottom surface of the device isolation trench.
14. The image sensor of claim 13 , wherein the pixel device isolation film further comprises:
a lower insulating layer arranged inside the pixel trench and covering the sidewalls of the conductive layer; and
an upper insulating layer arranged between the buried insulating layer and the pair of protrusion portions, wherein the upper insulating layer is spaced apart from the lower insulating layer,
wherein the pair of protrusion portions are at least partially surrounded by the buried insulating layer and the upper insulating layer.
15. The image sensor of claim 13 , wherein the device isolation structure further comprises:
a gap-fill conductive layer arranged between the conductive liner and the pair of protrusion portions, and
the gap-fill conductive layer overlaps a top surface of the conductive layer and the pair of protrusion portions.
16. The image sensor of claim 15 , wherein the conductive liner and the gap-fill conductive layer each has a top surface at a level lower than that of the first surface of the semiconductor substrate.
17. An image sensor comprising:
a semiconductor substrate having a first surface and a second surface;
a pixel device isolation film located inside a pixel trench that penetrates the semiconductor substrate, wherein the pixel device isolation film includes a conductive layer; and
a device isolation structure located inside a device isolation trench that extends from the first surface of the semiconductor substrate into the semiconductor substrate, wherein the device isolation structure defines an active region,
wherein the device isolation structure further comprises:
an insulating liner on an inner wall of the device isolation trench;
a conductive liner covering the inner wall of the device isolation trench and disposed on the insulating liner; and
a buried insulating layer filling the device isolation trench and disposed on the conductive liner,
wherein a negative bias is applied to the conductive liner.
18. The image sensor of claim 17 , wherein the conductive layer comprises:
a pair of protrusion portions extending outwards with respect to sidewalls of the conductive layer, wherein the pair of protrusion portions are at a level higher than that of a bottom portion of the device isolation trench, and
the conductive layer has a top surface at a higher level than that of a bottom surface of the device isolation trench.
19. The image sensor of claim 18 , wherein the pixel device isolation film further comprises:
a lower insulating layer arranged inside the pixel trench and covering the sidewalls of the conductive layer; and
an upper insulating layer arranged between the buried insulating layer and the pair of protrusion portions, wherein the upper insulating layer is spaced apart from the lower insulating layer,
wherein the pair of protrusion portions are at least partially surrounded by the buried insulating layer and the upper insulating layer.
20. The image sensor of claim 18 , further comprising a backside contact structure located inside a backside contact hole formed in the second surface of the semiconductor substrate, wherein the backside contact structure is connected to the conductive layer of the pixel device isolation film.