Light emitting element ink and method of manufacturing display device
A light emitting element ink comprises a light emitting element solvent, a light emitting element dispersed in the light emitting element solvent, the light emitting element including a plurality of semiconductor layers, and an insulating film surrounding outer surfaces of the plurality of semiconductor layers, and a thickener dispersed in the light emitting element solvent, wherein the thickener includes a compound represented by Chemical Structural Formula 1 as a polyol-based compound capable of forming a hydrogen bond with the light emitting element solvent or another thickener, and the thickener has a boiling point in a range of about 200° C. to about 450° C.
1. A light emitting element ink, comprising:
a light emitting element solvent;
a light emitting element dispersed in the light emitting element solvent, the light emitting element including:
a plurality of semiconductor layers; and
an insulating film surrounding outer surfaces of the plurality of semiconductor layers; and
a thickener dispersed in the light emitting element solvent, wherein
the thickener includes a compound represented by Chemical Structural Formula 1 below as a polyol-based compound capable of forming a hydrogen bond with the light emitting element solvent or another thickener, and
the thickener has a boiling point in a range of about 200° C. to about 450° C.,
wherein, in Chemical Structural Formula 1,
R 1 is a linear or branched alkyl group or a linear or branched alkyl ether group having 1 to 3000 carbon atoms,
the linear or branched alkyl group and the linear or branched alkyl ether group are substituted with a hydroxyl group (—OH) or is unsubstituted, and
I is an integer of 1 to 10.
2. The light emitting element ink of claim 1 , wherein
the thickener includes a compound represented by one of Chemical Formulas 1 to 8 below:
wherein, in Chemical Formulas 7 and 8, n is an integer of 1 to 1000.
3. The light emitting element ink of claim 2 , wherein the thickener forms an intermolecular hydrogen bond with the light emitting element solvent at a temperature of about 25° C. and the thickener to form a network structure.
4. The light emitting element ink of claim 3 , wherein the light emitting element ink has a viscosity in a range of about 20 cP to about 300 cP at a temperature of about 25° C.
5. The light emitting element ink of claim 2 , wherein the light emitting element ink has a viscosity in a range of about 5 cP to about 15 cP at a temperature in a range of about 40° C. to about 60° C.
6. The light emitting element ink of claim 2 , wherein
an amount of the light emitting element is in a range of about 0.01 to about 1 part by weight with respect to 100 parts by weight of the light emitting element ink, and
an amount of the thickener is in a range of about 5 to about 50 parts by weight with respect to 100 parts by weight of the light emitting element ink.
7. The light emitting element ink of claim 6 , further comprising:
a dispersant dispersed in the light emitting element solvent,
wherein an amount of the dispersant is in a range of about 10 to about 100 parts by weight with respect to 100 parts by weight of the light emitting element.
8. The light emitting element ink of claim 1 , wherein
the plurality of semiconductor layers of the light emitting element include:
a first semiconductor layer;
a second semiconductor layer; and
a light emitting layer between the first semiconductor layer and the second semiconductor layer, and
the insulating film of the light emitting element is disposed to surround at least an outer surface of the light emitting layer.
9. A method of manufacturing a display device, comprising:
preparing a light emitting element ink including a light emitting element solvent, a plurality of light emitting elements, and a thickener;
preparing a target substrate provided with a first electrode and a second electrode;
ejecting the light emitting element ink onto the target substrate at a first temperature;
forming an electric field on the target substrate to place the plurality of light emitting elements on the first electrode and the second electrode;
generating a low-pressure environment of about 10 −4 Torr to about 1 Torr; and
heating the light emitting element ink in the low-pressure environment to remove the light element solvent and the thickener.
10. The method of claim 9 , wherein the thickener of the light emitting element ink includes a polyol-based compound capable of forming a hydrogen bond with the light emitting element solvent or another thickener.
11. The method of claim 10 , wherein
the thickener includes a compound represented by one of Chemical Formulas 1 to 8 below:
wherein, in Chemical Formulas 7 and 8, n is an integer of 1 to 1000.
12. The method of claim 10 , wherein
an amount of the plurality of light emitting elements is in a range of about 0.01 to about 1 part by weight with respect to 100 parts by weight of the light emitting element ink, and
an amount of the thickener is in a range of about 100 to about 500 parts by weight with respect to 100 parts by weight of the plurality of light emitting elements.
13. The method of claim 10 , wherein in the preparing of the light emitting element ink, the thickener forms an intermolecular hydrogen bond with the light emitting element solvent and another thickener to form a network structure.
14. The method of claim 13 , wherein in the preparing of the light emitting element ink, the light emitting element ink has a viscosity in a range of about 20 cP to about 300 cP at a temperature of about 25° C.
15. The method of claim 10 , wherein
the ejecting of the light emitting element ink is performed by a printing process by an inkjet printing apparatus, and
the light emitting element ink is ejected onto the target substrate through a nozzle at the first temperature higher than about 25° C.
16. The method of claim 15 , wherein
in the ejecting of the light emitting element ink, the first temperature is in a range of about 40° C. to about 60° C., and
the light emitting element ink has a viscosity in a range about 5 cP to about 15 cP at the first temperature.
17. The method of claim 16 , wherein in the placing of the plurality of light emitting elements, the target substrate is heat-treated to form the electric field at the first temperature or higher.
18. The method of claim 9 , wherein
the first temperature is in a range of about 25° C. to about 150° C.
19. The method of claim 9 , in the placing of the plurality of light emitting elements, a first end of each of the plurality of light emitting elements is disposed on the first electrode, and
a second end of each of the plurality of light emitting elements is disposed on the second electrode.
20. The method of claim 9 , wherein the plurality of light emitting elements includes:
a first semiconductor layer;
a second semiconductor layer;
an active layer between the first semiconductor layer and the second semiconductor layer; and
an insulating film disposed to surround at least an outer surface of the active layer.
21. The method of claim 9 , wherein the thickener has a boiling point in a range of about 200° C. to about 450° C.
22. The method of claim 9 , further comprising applying an ultraviolet light to the plurality of light emitting elements having been ejected on the target substrate while forming the electric field.