IP Library › Granted Patent US 12,244,052
Granted Patent B2
US 12,244,052 · App. 16/913,408 · Granted Mar 4, 2025

Communication device having a heat sink antenna

Inventors: Martin R. Pais (North Barrington, IL); Md Rashidul Islam (Lombard, IL); Hugh K. Smith (Palatine, IL)
Assignee: Motorola Mobility LLC
H01Q1/002H01Q5/30H01Q7/00H01Q9/0421H01Q9/30H04W88/06
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,244,052
App. No.
16/913,408
Granted
Mar 4, 2025
Kind
B2
Abstract

A communication device, computer program product, and method provide a heat sink antenna that performs dual functions of thermal energy transferring and radio frequency (RF) communication. The communication device includes a millimeter wave (mmWave) antenna module. The communication device includes a heat sink antenna having a first portion in thermal conductive contact with at least a portion of a surface of the mmWave antenna module. The heat sink antenna has a second portion extending away from the first mmWave antenna module to transfer thermal energy away from the first mmWave antenna module. An RF front end of the communication device includes mmWave transmitter that radiates a mmWave signal via the mmWave antenna module, resulting in generation of the thermal energy.

Claims (65)

1. A communication device comprising:

a first millimeter wave (mmWave) antenna module;

a first heat sink antenna having a first portion in thermal conductive contact with at least a portion of a surface of the first mmWave antenna module and having a second portion extending away from the first mmWave antenna module to transfer thermal energy away from the first mmWave antenna module, the first heat sink antenna configured as a capacitively coupled sub-6 GHz antenna for communication, with a capacitance sensor for human proximity detection; and

a radio frequency (RF) front end comprising a mmWave transmitter that radiates a mmWave signal via the first mmWave antenna module, resulting in generation of the thermal energy, the RF front end further comprising a sub-6 GHz transmitter that radiates a sub-6 GHz signal via the first heat sink antenna.

2. The communication device of claim 1 , wherein the first heat sink antenna operates as a heat sink for the first mmWave antenna module and is configured as one of: (i) a loop antenna; (ii) a capacitively coupled loop antenna; (iii) a planar inverted-F antenna (PIFA); and (iv) a capacitively coupled monopole antenna.

3. The communication device of claim 1 , wherein the first heat sink antenna comprises a copper structure having a thickness of at least 200 μm for thermal and electrical conduction.

4. The communication device of claim 1 , wherein the first heat sink antenna comprises a copper-graphite laminate structure.

5. The communication device of claim 1 , further comprising:

a first impedance sensor that is communicatively coupled to the first heat sink antenna; and

a controller that is communicatively coupled to the first impedance sensor and which:

monitors, via the first impedance sensor, changes in impedance of the first heat sink antenna;

determines, based on the changes in impedance, whether a human is blocking the first mmWave antenna module; and

disables use of the first mmWave antenna module by the mmWave transmitter in response to determining that the human is blocking the first mmWave antenna module.

6. The communication device of claim 1 , further comprising:

a controller; and

more than one dual band assemblies that are each communicatively coupled to the controller and each comprise a corresponding combination of a mmWave antenna, a heat sink antenna, and an impedance sensor;

wherein:

the first mmWave antenna, the first heat sink antenna, and the first impedance sensor comprise a first dual band antenna assembly;

each mmWave antenna respectively of the more than one dual band antenna assemblies comprises a temperature management component, wherein; and

the controller:

monitors a respective temperature of each mmWave antenna of the more than one dual band antenna assemblies;

compares the respective temperature of each mmWave antenna to a temperature threshold; and

in response to the respective temperature being greater than the temperature threshold for any one of the dual band antenna assemblies, identifies a corresponding dual band antenna assembly as unavailable.

7. The communication device of claim 6 , further comprising:

a first impedance sensor that is communicatively coupled to the first heat sink antenna; and

wherein the controller:

monitors, via a respective impedance sensor of each one of the more than one dual band antenna assemblies, changes in impedance of the corresponding heat sink antenna;

for each of the more than one dual band antenna assemblies, identifies a particular dual band antenna assembly as unavailable in response to determining, based on the changes in impedance via the corresponding impedance sensor, that a human is blocking the corresponding mmWave antenna; and

in response to determining that the human is blocking the mmWave antenna of the first dual band antenna assembly, switches the mmWave transmitter to an available mmWave antenna having a temperature that is less than or equal to the temperature threshold and is not blocked by a human.

8. The communication device of claim 1 , wherein the first heat sink antenna has a planar metallic structure.

9. The communication device of claim 1 , wherein the first heat sink antenna is fabricated from materials having both high electrical conductivity and high thermal conductivity to support dual functions of an antenna and a heat sink.

10. A method for reliably radiating a millimeter wave (mmWave) transmit signal from a communication device, the method comprising:

transmitting a mmWave signal via a first mmWave antenna module that is in thermal conductive contact with a first heat sink antenna, the transmitting resulting in generation of thermal energy, wherein the first heat sink antenna is configured as a sub-6 GHz antenna for communication, with a capacitance sensor for human proximity detection; and

communicating using a sub-6 GHz signal via the first heat sink antenna that has a first portion in thermal conductive contact with at least a portion of a surface of the first mmWave antenna module and a second portion extending away from the first mmWave antenna module to transfer the thermal energy away from the first mmWave antenna module.

11. The method of claim 10 , further comprising:

monitoring, via a first impedance sensor coupled to the first heat sink antenna, changes in impedance of the first heat sink antenna;

determining, based on the changes in impedance, whether a human is blocking the first mmWave antenna module; and

disabling use of the first mmWave antenna by the mmWave transmitter, in response to determining that the human is blocking the first mmWave antenna.

12. The method of claim 10 , further comprising transmitting the sub-6 GHz signal via the first heat sink antenna, the first heat sink antenna providing thermal energy transfer away from the first mmWave antenna module and being configured as one of: (i) a loop antenna; (ii) a capacitively coupled loop antenna; (iii) a planar inverted-F antenna (PIFA); and (iv) a capacitively coupled monopole antenna.

13. The method of claim 10 , wherein the first mmWave antenna module, the first heat sink antenna, and the first impedance sensor comprise a first dual band antenna assembly of more than one dual band antenna assemblies within the communication device, the method further comprising:

monitoring a respective temperature of each mmWave antenna of the more than one dual band antenna assemblies;

comparing the respective temperature of each mmWave antenna to a temperature threshold; and

in response to the respective temperature being greater than the temperature threshold for any one of the dual band antenna assemblies, identifying a corresponding dual band antenna assembly as unavailable.

14. The method of claim 13 , further comprising:

monitoring, via a respective impedance sensor of each one of the more than one dual band antenna assemblies, changes in impedance of the corresponding heat sink antenna;

for each of the more than one dual band antenna assemblies, identifying a particular dual band antenna assembly as unavailable in response to determining, based on the changes in impedance via the corresponding impedance sensor, that a human is blocking the corresponding mmWave antenna; and

switching the mmWave transmitter to a mmWave antenna that is available based on both having a temperature that is less than or equal to the temperature threshold and is not blocked by a human in response to determining that the human is blocking the mmWave antenna of the first dual band antenna assembly.

15. A computer program product comprising:

a computer readable storage device; and

program code on the computer readable storage device that when executed by a processor associated with a communication device, the program code enables the communication device to provide the functionality of:

transmitting a mmWave signal via a first mmWave antenna module that is in thermal conductive contact with a first heat sink antenna, the transmitting resulting in generation of thermal energy, wherein the first heat sink antenna is configured as an antenna for sub-6 GHz communication, with a capacitance sensor for human proximity detection; and

communicating using a sub-6 GHz signal via the first heat sink antenna that has a first portion in thermal conductive contact with at least a portion of a surface of the first mmWave antenna module and a second portion extending away from the first mmWave antenna module to transfer the thermal energy away from the first mmWave antenna module, the first heat sink antenna configured to support sub-6 GHz communication.

16. The computer program product of claim 15 , wherein the program code enables the communication device to provide the functionality of:

monitoring, via a first impedance sensor coupled to the first heat sink antenna, changes in impedance of the first heat sink antenna;

determining, based on the changes in impedance, whether a human is blocking the first mmWave antenna module; and—

disabling use of the first mmWave antenna by the mmWave transmitter, in response to determining that the human is blocking the first mmWave antenna module.

17. The computer program product of claim 15 , wherein the program code enables the communication device to provide the functionality of transmitting the sub-6 GHZ signal via the first heat sink antenna, the first heat sink antenna providing thermal energy transfer away from the first mmWave antenna and being configured as one of: (i) a loop antenna; (ii) a capacitively coupled loop antenna; (iii) a planar inverted-F antenna (PIFA); and (iv) a capacitively coupled monopole antenna.

18. The computer program product of claim 15 , wherein the first mmWave antenna module, the first heat sink antenna, and the first impedance sensor comprise a first dual band antenna assembly of more than one dual band antenna assemblies of the communication device, the program code enables the communication device to provide the functionality of:

monitoring a respective temperature of each mmWave antenna of the more than one dual band antenna assemblies;

comparing the respective temperature of each mmWave antenna to a temperature threshold; and

in response to the respective temperature being greater than the temperature threshold for any one of the dual band antenna assemblies, identifying a corresponding dual band antenna assembly as unavailable.

19. The computer program product of claim 18 , wherein the program code enables the communication device to provide the functionality of:

monitoring, via a respective impedance sensor of each one of the more than one dual band antenna assemblies, changes in impedance of the corresponding heat sink antenna;

for each of the more than one dual band antenna assemblies, identifying a particular dual band antenna assembly as unavailable in response to determining, based on the changes in impedance via the corresponding impedance sensor, that a human is blocking the corresponding mmWave antenna; and

switching the mmWave transmitter to a mmWave antenna that is available based on both having a temperature that is less than or equal to the temperature threshold and is not blocked by a human in response to determining that the human is blocking the mmWave antenna of the first dual band antenna assembly.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2020
From: PAIS, MARTIN R.; ISLAM, MD RASHIDUL; SMITH, HUGH K.
To: MOTOROLA MOBILITY LLC
Reel/Frame 053051/0531 →
Continuity (1)
Related Publication 20210408658A1 · Dec 30, 2021
References Cited (40)
US 10069195B1 · Asrani · 2018 [cited by examiner]
US 10490479B1 · Wan · 2019 [cited by examiner]
US 10833424B2 · Ghaemi · 2020 [cited by examiner]
US 20050006085A1 · Nelson · 2005 [cited by examiner]
US 20080024376A1 · Norris · 2008 [cited by examiner]
US 20080303121A1 · Lin · 2008 [cited by examiner]
US 20100277867A1 · Chen · 2010 [cited by examiner]
US 20100327068A1 · Chen · 2010 [cited by examiner]
US 20110032157A1 · Suh · 2011 [cited by examiner]
US 20110075377A1 · Paquette · 2011 [cited by examiner]
US 20110309980A1 · Ali · 2011 [cited by examiner]
US 20120062422A1 · Wu · 2012 [cited by examiner]
US 20120282982A1 · Mujtaba · 2012 [cited by examiner]
US 20140145899A1 · Yang · 2014 [cited by examiner]
US 20150200444A1 · Mercer · 2015 [cited by examiner]
US 20160049723A1 · Baks · 2016 [cited by examiner]
US 20160061983A1 · Heikura · 2016 [cited by examiner]
US 20160118713A1 · Hong · 2016 [cited by examiner]
US 20160181857A1 · Konanur · 2016 [cited by examiner]
US 20160211881A1 · Kang · 2016 [cited by examiner]
US 20170347490A1 · Romig · 2017 [cited by examiner]
US 20180159203A1 · Baks · 2018 [cited by examiner]
US 20180205131A1 · Hwang · 2018 [cited by examiner]
US 20180301799A1 · Imai · 2018 [cited by examiner]
US 20180316082A1 · Keller, III · 2018 [cited by examiner]
US 20180343711A1 · Wixforth · 2018 [cited by examiner]
US 20190006731A1 · Chiu · 2019 [cited by examiner]
US 20190103682A1 · Thai · 2019 [cited by examiner]
US 20190131706A1 · Raney · 2019 [cited by examiner]
US 20190260127A1 · Shi · 2019 [cited by examiner]
US 20200137740A1 · Lim · 2020 [cited by examiner]
US 20200137884A1 · Markish · 2020 [cited by examiner]
US 20200186203A1 · Kim · 2020 [cited by examiner]
US 20200203853A1 · Hu · 2020 [cited by examiner]
US 20200358203A1 · Park · 2020 [cited by examiner]
JP 2011211424A · 2011 [cited by examiner]
Casanova, Joaquin J., et al., Design of a 3-D Fractal Heatsink Antenna, IEEE Antennas and Wireless Propagation Letters, vol. 9, 2010. [cited by applicant]
Qian, Jiawei, et al., “Heatsink Antenna Array for Millimeter-Wave Applications”, IEEE Transactions on Antennas and Propagation, 2020. [cited by applicant]
Covert, Lance et al., “Simulation and Measurement of a Heatsink Antenna: A Dual-Function Structure, IEEE Transactions on Antennas and Propagation”, vol. 54, No. 4, Apr. 2006. [cited by applicant]
Oraon, Neha et al., “Self assembly based 3D heatsink antenna for high density 3D integration”, Conference, 2013 International conference on Circuits, Controls and Communications (CCUBE), 2013. [cited by applicant]