IP Library › Granted Patent US 12,244,068
Granted Patent B2
US 12,244,068 · App. 18/109,607 · Granted Mar 4, 2025

Antenna module and electronic device including the same

Inventors: Youngsub Kim (Suwon-si, KR); Junsig Kum (Suwon-si, KR); Seungtae Ko (Suwon-si, KR); Byungchul Kim (Suwon-si, KR); Yoongeon Kim (Suwon-si, KR); Seungho Choi (Suwon-si, KR); Jungmin Park (Suwon-si, KR); Youngju Lee (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01Q21/24H01Q1/248H01Q9/0442H01Q9/045
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Quick Facts
Patent No.
US 12,244,068
App. No.
18/109,607
Granted
Mar 4, 2025
Kind
B2
Abstract

The disclosure relates to a pre-5 th -Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4 th -Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments of the disclosure, an antenna module in a wireless communication system may include: a plurality of antenna elements; a first antenna substrate; a second antenna substrate; and a Printed Circuit Board (PCB). A first side of the first antenna substrate may be coupled to each of the plurality of antenna elements, and a second side of the first antenna substrate opposite to the first side of the first antenna substrate may be coupled to the PCB. A first side of the second antenna substrate may be coupled to each of the plurality of antenna elements, and a second side of the second antenna substrate opposite to the first side of the second antenna substrate may be coupled to the PCB. A face between the first side of the first antenna substrate and the second side of the first antenna substrate may face a face between the first side of the second antenna substrate and the second side of the second antenna substrate.

Claims (63)

1. An antenna module in a wireless communication system, comprising:

a plurality of antenna elements;

a first antenna substrate;

a second antenna substrate; and

a Printed Circuit Board (PCB),

wherein a first side of the first antenna substrate is coupled to each of the plurality of antenna elements, and a second side of the first antenna substrate opposite to the first side of the first antenna substrate is coupled to the PCB,

wherein a first side of the second antenna substrate is coupled to each of the plurality of antenna elements, and a second side of the second antenna substrate opposite to the first side of the second antenna substrate is coupled to the PCB, and

wherein a face between the first side of the first antenna substrate and the second side of the first antenna substrate faces a face between the first side of the second antenna substrate and the second side of the second antenna substrate.

2. The antenna module of claim 1 ,

wherein the first antenna substrate is related to a first polarization,

wherein the second antenna substrate is related to a second polarization, and

wherein the second polarization is orthogonal to the first polarization.

3. The antenna module of claim 2 ,

wherein the first antenna substrate includes a first Radio Frequency (RF) filter and first feeding lines configured to provide an electrical connection between the plurality of antenna elements, and

wherein the second antenna substrate includes a second RF filter and second feeding lines configured to provide an electrical connection between the plurality of antenna elements.

4. The antenna module of claim 2 ,

wherein the plurality of antenna elements include a sub-array,

wherein the first antenna substrate includes a first feeding network circuit for the sub-array, and

wherein the second antenna substrate includes a second feeding network circuit for the sub-array.

5. The antenna module of claim 1 ,

wherein the second side of the first antenna substrate and the second side of the second antenna substrate are mounted on a first face of the PCB, and

wherein at least one RF filter is mounted on a second face of the PCB opposite to the first face of the PCB.

6. The antenna module of claim 5 , wherein on the first face of the PCB, a protruding region formed by a shield cap or a tuning bolt is disposed between a mounting region of the second side of the first antenna substrate and a mounting region of the second side of the second antenna substrate.

7. The antenna module of claim 1 , further comprising a shield cap formed across one or more layers of the PCB.

8. The antenna module of claim 1 ,

wherein the face of the first antenna substrate is mounted to be substantially vertical to a face of the PCB, and

wherein the face of the second antenna substrate is mounted to be substantially vertical to the face of the PCB.

9. The antenna module of claim 1 , wherein the PCB includes a metal plate and a calibration network PCB.

10. The antenna module of claim 1 , wherein the PCB includes a calibration network PCB.

11. An electronic device in a wireless communication system, comprising:

an antenna array including a plurality of sub-arrays;

a plurality of first antenna substrates;

a plurality of second antenna substrates;

a Printed Circuit Board (PCB) on which a plurality of radio frequency (RF) filters are deployed;

a power supply; and

a processor,

wherein a sub-array among the plurality of sub-arrays includes a plurality of antenna elements,

wherein the plurality of first antenna substrates include a first antenna substrate corresponding to the sub-array,

wherein the plurality of second antenna substrates include a second antenna substrate corresponding to the sub-array,

wherein a first side of the first antenna substrate is coupled to each of the plurality of antenna elements, and a second side of the first antenna substrate opposite to the first side of the first antenna substrate is coupled to the PCB,

wherein a first side of the second antenna substrate is coupled to each of the plurality of antenna elements, and a second side of the second antenna substrate opposite to the first side of the second antenna substrate is coupled to the PCB, and

wherein a face between the first side of the first antenna substrate and the second side of the first antenna substrate faces a face between the first side of the second antenna substrate and the second side of the second antenna substrate.

12. The electronic device of claim 11 ,

wherein the first antenna substrate is related to a first polarization,

wherein the second antenna substrate is related to a second polarization, and

wherein the second polarization is orthogonal to the first polarization.

13. The electronic device of claim 12 ,

wherein the plurality of RF filters include a first RF filter and second RF filter for the sub-array,

wherein the first antenna substrate includes the first RF filter and first feeding lines configured to provide an electrical connection between the plurality of antenna elements, and

wherein the second antenna substrate includes the second RF filter and second feeding lines configured to provide an electrical connection between the plurality of antenna elements.

14. The electronic device of claim 12 ,

wherein the first antenna substrate includes a first feeding network circuit for the sub-array, and

wherein the second antenna substrate includes a second feeding network circuit for the sub-array.

15. The electronic device of claim 11 ,

wherein the second side of the first antenna substrate and the second side of the second antenna substrate are mounted on a first face of the PCB, and

wherein the at least one RF filter is mounted on a second face of the PCB opposite to the first face of the PCB.

16. The electronic device of claim 15 , wherein on the first face of the PCB, a protruding region formed by a shield cap or a tuning bolt is disposed between a mounting region of the second side of the first antenna substrate and a mounting region of the second side of the second antenna substrate.

17. The electronic device of claim 11 , further comprising a shield cap formed across one or more layers of the PCB.

18. The electronic device of claim 11 ,

wherein the face of the first antenna substrate is mounted to be substantially vertical to a face of the PCB, and

wherein the face of the second antenna substrate is mounted to be substantially vertical to the face of the PCB.

19. The electronic device of claim 11 , wherein the PCB includes a metal plate and a calibration network PCB.

20. The electronic device of claim 11 , wherein the PCB includes a calibration network PCB.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2023
From: KIM, YOUNGSUB; KUM, JUNSIG; KO, SEUNGTAE; KIM, BYUNGCHUL; KIM, YOONGEON; CHOI, SEUNGHO; PARK, JUNGMIN; LEE, YOUNGJU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 062694/0930 →
Priority Claims (1)
KR 10-2021-0043635 · Apr 2, 2021 · national
Continuity (2)
Continuation PCTKR2022004796 · Apr 4, 2022
Related Publication 20230198167A1 · Jun 22, 2023
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