Structure and method of reticle pod having inspection window
A method includes: inspecting a reticle in a reticle pod, the reticle pod including a sealed space to accommodate the reticle, and the reticle pod further comprising a window arranged on an upper surface of the reticle pod, wherein the inspecting is performed through the window; and moving the reticle out of the reticle pod for performing a lithography operation using the reticle.
1. A method comprising:
inspecting a reticle in a reticle pod, the reticle pod including a sealed space to accommodate the reticle, and the reticle pod further comprising a window arranged on an upper surface of the reticle pod, wherein the inspecting is performed through the window; and
moving the reticle out of the reticle pod for performing a lithography operation using the reticle.
2. The method of claim 1 , further comprising performing a first operation for forming a pattern on the reticle subsequent to the moving of the reticle.
3. The method of claim 2 , further comprising performing a second operation for repairing the pattern on the reticle in response to a defect being found during the inspecting.
4. The method of claim 2 , further comprising performing the lithography operation by transferring the pattern on the reticle to a workpiece in response to no defect being found.
5. The method of claim 2 , wherein the first operation includes a development operation for forming a patterned photoresist layer on the reticle, further comprising:
transporting the reticle from the reticle pod to a semiconductor tool subsequent to the inspecting; and
causing a foreign particle to be removed from the reticle in response to the foreign particle being detected during the inspecting.
6. The method of claim 5 , further comprising performing a patterning operation using the patterned photoresist layer as an etch mask subsequent to the removal of the foreign particle.
7. The method of claim 5 , further comprising cleaning a processing tool performing the development operation prior to a patterning operation in response to the foreign particle being detected.
8. The method of claim 2 , wherein the first operation includes a development operation for forming a patterned mask layer on the reticle, further comprising:
transporting the reticle from the reticle pod to a semiconductor tool subsequent to the inspecting; and
repairing a defective portion of the patterned mask layer in response to the defective portion being detected during the inspecting.
9. The method of claim 8 , further comprising performing a patterning operation using the patterned mask layer as an etch mask subsequent to the repairing of the defective portion.
10. The method of claim 1 , wherein the inspecting comprises emitting an inspection radiation to pass through the window and receiving reflected radiation from the reticle.
11. A method comprising:
performing a first operation for forming a pattern on a reticle in a first processing tool;
moving the reticle into a reticle pod and closing the reticle pod; and
determining whether any defect exists in the reticle by transmitting a radiation through a transparent window of the reticle pod without opening the reticle pod.
12. The method of claim 11 , wherein the radiation has a wavelength so as not to react with a photoresist material of the reticle.
13. The method of claim 12 , wherein the wavelength is in a range between about 400 nm and about 700 nm.
14. The method of claim 11 , wherein the transparent window comprises a window body and a transparent film on two sides of the window body.
15. The method of claim 14 , wherein the transparent film comprises at least one of aluminum zinc oxide (AZO), indium tungsten oxide (ITO), fluorine doped tin oxide (FTO) and carbon nanotube.
16. The method of claim 14 , wherein the transparent film comprises a thickness between about 20 nm and about 200 nm.
17. The method of claim 14 , wherein the reticle pod comprises a cover including an opaque material laterally surrounding the transparent window.
18. A method comprising:
performing a first operation using a reticle in a first processing tool;
enclosing the reticle by a reticle pod, the reticle pod comprising a window allowing the reticle to be visible through the window;
performing an inspection operation on the reticle through the window; and
determining that a defect is found during the inspection operation before moving the reticle out of the reticle pod.
19. The method of claim 18 , wherein the reticle is kept within the reticle pod during the inspection operation.
20. The method of claim 18 , wherein the reticle pod further comprises a cover including a film on two sides of the window, wherein the film has a transmittance of greater than about 65% for an inspection radiation used in the inspection operation.