Resistor and manufacturing method of resistor
A resistor is provided with a resistance body and a pair of electrodes connected to the resistance body (a first electrode body, a second electrode body), the resistance body being arranged so as to be at least separated away from a substrate board (a circuit board) when mounted on the substrate board (the circuit board), wherein the resistor has the oxide film on at least one of the resistance body and each of the electrodes (the first electrode body, the second electrode body) at a boundary portion (a bonded portion, a bonded portion) between the resistance body and each of the electrodes (the first electrode body, the second electrode body) on the mounting surface of the resistor.
1. A resistor comprising a resistance body and a pair of electrodes connected to the resistance body, the resistance body being arranged so as to be at least separated away from a substrate board when mounted on the substrate board, wherein
the resistance body and each of the electrodes are directly bonded with each other, and
the resistor has an oxide film due to oxidation of the resistance body or the electrode on at least one surface of the resistance body and each of the electrodes at a boundary portion between the resistance body and each of the electrodes on a mounting surface of the resistor.
2. The resistor according to claim 1 , wherein the oxide film is formed at least on the resistance body.
3. The resistor according to claim 1 , wherein a surface of the resistance body is exposed except for a part formed with the oxide film.
4. The resistor according to claim 1 , wherein the electrodes each has a main body portion connected to the resistance body and a leg portion protruded towards the substrate board, the boundary portion being formed by the resistance body and the main body portion, and
the oxide film is formed at least on the main body portion at the boundary portion between the resistance body and the main body portion.
5. The resistor according to claim 1 , wherein the resistor has a recessed portion at the boundary portion, and
the oxide film is formed in the recessed portion.
6. The resistor according to claim 4 , wherein the resistor has a recessed portion at the boundary portion, and
the oxide film is formed in the recessed portion, the recessed portion being formed so as to extend over both of the main body portion and the resistance body.
7. A manufacturing method of a resistor provided with a resistance body and a pair of electrodes connected to the resistance body, the resistance body being arranged so as to be at least separated away from a substrate board when mounted on the substrate board, the manufacturing method comprising:
a step of directly bonding the resistance body and each of the electrodes with each other, the directly bonding being a solid layer bonding, and
a step of forming an oxide film by irradiating laser on at least one surface of the resistance body and each of the electrodes at a boundary portion between the resistance body and each of the electrodes on a mounting surface of the resistor.