IP Library › Granted Patent US 12,249,464
Granted Patent B2
US 12,249,464 · App. 17/559,552 · Granted Mar 11, 2025

Electronic component

Inventors: Shinya Onodera (Tokyo, JP); Akitoshi Yoshii (Tokyo, JP); Kyohei Takata (Tokyo, JP)
Assignee: TDK CORPORATION
H01G4/30H01G4/008H01G4/012H01G4/232
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Quick Facts
Patent No.
US 12,249,464
App. No.
17/559,552
Granted
Mar 11, 2025
Kind
B2
Abstract

An external electrode is disposed on an end of the element body in the first direction. The external electrode includes a pair of first electrode portions disposed on the pair of second side surfaces and including a conductive resin layer. Each of the pair of second side surfaces includes a region exposed from the external electrode. An insulating film is disposed on the element body. The insulating film includes film portions disposed on the pair of second side surfaces. Each of the film portions covers an edge of the conductive resin layer and the region of each of the second side surfaces along the edge of the conductive resin layer.

Claims (97)

1. An electronic component, comprising:

an element body of a rectangular parallelepiped shape including a pair of end surfaces opposing each other in a first direction, a pair of first side surfaces opposing each other in a second direction, and a pair of second side surfaces opposing each other in a third direction;

a plurality of external electrodes disposed on both ends of the element body in the first direction;

a plurality of internal electrodes disposed in the element body to be distributed in the second direction and electrically connected to corresponding external electrodes of the plurality of external electrodes; and

an insulating film disposed on the element body,

wherein each of the plurality of external electrodes includes a pair of first electrode portions disposed on the pair of second side surfaces and including a sintered metal layer and a conductive resin layer,

the conductive resin layer covers an edge of the sintered metal layer and a portion of the second side surface, on each of the pair of second side surfaces,

each of the pair of second side surfaces includes a region exposed from the external electrodes,

the insulating film includes film portions disposed on the pair of second side surfaces, and

each of the film portions covers an edge of the conductive resin layer and a portion of the region of each of the second side surfaces that is along the edge of the conductive resin layer.

2. The electronic component according to claim 1 ,

wherein each of the plurality of external electrodes includes a pair of second electrode portions disposed on the pair of first side surfaces and including a sintered metal layer and a conductive resin layer,

the conductive resin layer included in the second electrode portions covers an edge of the sintered metal layer included in the second electrode portions and a portion of the first side surface, on each of the pair of first side surfaces,

each of the pair of first side surfaces includes a region exposed from the external electrodes,

the insulating film includes other film portions disposed on the pair of first side surfaces, and

each of the other film portions covers an edge of the conductive resin layer included in the second electrode portions and a portion of the region of each of the first side surfaces that is along the edge of the conductive resin layer included in the second electrode portions.

3. The electronic component according to claim 1 ,

wherein the conductive resin layer includes a plurality of silver particles.

4. The electronic component according to claim 1 ,

wherein each of the plurality of external electrodes includes a pair of second electrode portions disposed on the pair of first side surfaces and including a conductive resin layer,

for each of the two conductive resin layers located on the same first side surface, one conductive resin layer includes an edge opposing another conductive resin layer,

an outermost internal electrode located outermost in the second direction, of the plurality of internal electrodes, is adjacent in the second direction to the second electrode portion to which the outermost internal electrode is electrically connected, and

assuming that a plane including the end surface to which the outermost internal electrode is exposed is a reference plane, a first length of the outermost internal electrode in the first direction from the reference plane is larger than a second length in the first direction from the reference plane to the edge of the conductive resin layer electrically connected to the outermost internal electrode and included in the second electrode portion, and smaller than a third length from the reference plane to the edge of the conductive resin layer not electrically connected to the outermost internal electrode and included in the second electrode portion.

5. The electronic component according to claim 4 , further comprising:

a dummy conductor located in the same layer as the outermost internal electrode and separated from the outermost internal electrode,

wherein the dummy conductor is electrically connected to the external electrode to which the outermost internal electrode located in the same layer as the dummy conductor is not electrically connected.

6. The electronic component according to claim 1 , further comprising:

a pair of dummy conductors each adjacent to a corresponding first side surface of the pair of first side surfaces in the second direction,

wherein each of the plurality of external electrodes includes a pair of second electrode portions disposed on the pair of first side surfaces and including a conductive resin layer, and

each of the pair of dummy conductors opposes the conductive resin layer not electrically connected to the internal electrode adjacent to the dummy conductor in the second direction and included in the second electrode portion, in the second direction.

7. The electronic component according to claim 1 ,

wherein each of the plurality of external electrodes further includes an electrode portion disposed on the end surface and including a conductive resin layer.

8. The electronic component according to claim 1 ,

wherein each of the film portions covers the conductive resin layer in a first predetermined length range in the first direction from the edge of the conductive resin layer.

9. The electronic component according to claim 8 , wherein

each of the film portions further covers the second side surface in a second predetermined length range in the first direction from the edge of the conductive resin layer, and

a sum of the first predetermined length range and the second predetermined length range is 5% or more of a width of the external electrode in the first direction.

10. An electronic component, comprising:

an element body of a rectangular parallelepiped shape including a pair of end surfaces opposing each other in a first direction, a pair of first side surfaces opposing each other in a second direction, and a pair of second side surfaces opposing each other in a third direction;

a plurality of external electrodes disposed on both ends of the element body in the first direction;

a plurality of internal electrodes disposed in the element body to be distributed in the second direction and electrically connected to corresponding external electrodes of the plurality of external electrodes; and

an insulating film disposed on the element body,

wherein each of the plurality of external electrodes includes a pair of first electrode portions disposed on the pair of second side surfaces and including a conductive resin layer, and a pair of second electrode portions disposed on the pair of first side surfaces and including a conductive resin layer,

each of the pair of second side surfaces includes a region exposed from the external electrodes,

the insulating film includes film portions disposed on the pair of second side surfaces,

each of the film portions covers an edge of the conductive resin layer and a portion of the region of each of the second side surfaces that is along the edge of the conductive resin layer,

for each of the two conductive resin layers located on the same first side surface, one conductive resin layer includes an edge opposing another conductive resin layer,

an outermost internal electrode located outermost in the second direction, of the plurality of internal electrodes, is adjacent in the second direction to the second electrode portion to which the outermost internal electrode is electrically connected, and

when a plane including the end surface to which the outermost internal electrode is exposed is a reference plane, a first length of the outermost internal electrode in the first direction from the reference plane is larger than a second length in the first direction from the reference plane to the edge of the conductive resin layer electrically connected to the outermost internal electrode and included in the second electrode portion, and smaller than a third length from the reference plane to the edge of the conductive resin layer not electrically connected to the outermost internal electrode and included in the second electrode portion.

11. The electronic component according to claim 10 ,

wherein each of the plurality of external electrodes includes a pair of second electrode portions disposed on the pair of first side surfaces and including a sintered metal layer and a conductive resin layer,

the conductive resin layer included in the second electrode portions covers an edge of the sintered metal layer included in the second electrode portions and a portion of the first side surface, on each of the pair of first side surfaces,

each of the pair of first side surfaces includes a region exposed from the external electrodes,

the insulating film includes other film portions disposed on the pair of first side surfaces, and

each of the other film portions covers an edge of the conductive resin layer included in the second electrode portions and a portion of the region of each of the first side surfaces that is along the edge of the conductive resin layer included in the second electrode portions.

12. The electronic component according to claim 10 ,

wherein the conductive resin layer includes a plurality of silver particles.

13. The electronic component according to claim 10 , further comprising:

a dummy conductor located in the same layer as the outermost internal electrode and separated from the outermost internal electrode,

wherein the dummy conductor is electrically connected to the external electrode to which the outermost internal electrode located in the same layer as the dummy conductor is not electrically connected.

14. The electronic component according to claim 10 , further comprising:

a pair of dummy conductors each adjacent to a corresponding first side surface of the pair of first side surfaces in the second direction,

wherein each of the plurality of external electrodes includes a pair of second electrode portions disposed on the pair of first side surfaces and including a conductive resin layer, and

each of the pair of dummy conductors opposes the conductive resin layer not electrically connected to the internal electrode adjacent to the dummy conductor in the second direction and included in the second electrode portion, in the second direction.

15. The electronic component according to claim 10 ,

wherein each of the plurality of external electrodes further includes an electrode portion disposed on the end surface and including a conductive resin layer.

16. The electronic component according to claim 10 ,

wherein each of the film portions covers the conductive resin layer in a first predetermined length range in the first direction from the edge of the conductive resin layer.

17. The electronic component according to claim 16 , wherein

each of the film portions further covers the second side surface in a second predetermined length range in the first direction from the edge of the conductive resin layer, and

a sum of the first predetermined length range and the second predetermined length range is 5% or more of a width of the external electrode in the first direction.

18. An electronic component, comprising:

an element body of a rectangular parallelepiped shape including a pair of end surfaces opposing each other in a first direction, a pair of first side surfaces opposing each other in a second direction, and a pair of second side surfaces opposing each other in a third direction;

a plurality of external electrodes disposed on both ends of the element body in the first direction;

a plurality of internal electrodes disposed in the element body to be distributed in the second direction and electrically connected to corresponding external electrodes of the plurality of external electrodes; and

an insulating film disposed on the element body,

wherein each of the plurality of external electrodes includes a pair of first electrode portions disposed on the pair of second side surfaces and including a conductive resin layer,

each of the pair of second side surfaces includes a region exposed from the external electrodes,

the insulating film includes film portions disposed on the pair of second side surfaces,

each of the film portions covers an edge of the conductive resin layer and a portion of the region of each of the second side surfaces that is along the edge of the conductive resin layer,

each of the film portions covers the conductive resin layer in a first predetermined length range in the first direction from the edge of the conductive resin layer,

each of the film portions further covers the second side surface in a second predetermined length range in the first direction from the edge of the conductive resin layer, and

a sum of the first predetermined length range and the second predetermined length range is 5% or more of a width of the external electrode in the first direction.

19. The electronic component according to claim 18 ,

wherein each of the plurality of external electrodes includes a pair of second electrode portions disposed on the pair of first side surfaces and including a sintered metal layer and a conductive resin layer,

the conductive resin layer included in the second electrode portions covers an edge of the sintered metal layer included in the second electrode portions and a portion of the first side surface, on each of the pair of first side surfaces,

each of the pair of first side surfaces includes a region exposed from the external electrodes,

the insulating film includes other film portions disposed on the pair of first side surfaces, and

each of the other film portions covers an edge of the conductive resin layer included in the second electrode portions and a portion of the region of each of the first side surfaces that is along the edge of the conductive resin layer included in the second electrode portions.

20. The electronic component according to claim 18 ,

wherein the conductive resin layer includes a plurality of silver particles.

21. The electronic component according to claim 18 , further comprising:

a pair of dummy conductors each adjacent to a corresponding first side surface of the pair of first side surfaces in the second direction,

wherein each of the plurality of external electrodes includes a pair of second electrode portions disposed on the pair of first side surfaces and including a conductive resin layer, and

each of the pair of dummy conductors opposes the conductive resin layer not electrically connected to the internal electrode adjacent to the dummy conductor in the second direction and included in the second electrode portion, in the second direction.

22. The electronic component according to claim 18 ,

wherein each of the plurality of external electrodes further includes an electrode portion disposed on the end surface and including a conductive resin layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2021
From: ONODERA, SHINYA; YOSHII, AKITOSHI; TAKATA, KYOHEI
To: TDK CORPORATION
Reel/Frame 058463/0138 →
Priority Claims (1)
JP 2020-219273 · Dec 28, 2020 · national
Continuity (1)
Related Publication 20220208474A1 · Jun 30, 2022
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