Wiring board and wiring board manufacturing method
A wiring board includes a base material, a through hole that is formed in the base material, a magnetic member that is embedded in the through hole, and a plating film that covers end faces of the magnetic member exposed from the through hole. The magnetic member includes a conductor wire that is covered by a magnetic body. A wiring board manufacturing method includes forming a through hole in a base material, forming a magnetic member by covering a conductor wire by a magnetic body, embedding the magnetic member in the through hole, and forming a plating film that covers end faces of the magnetic member exposed from the through hole.
1. A wiring board comprising:
a base material that has metallic foils formed on opposite surfaces thereof;
a through hole that is formed in the base material between the opposite surfaces of the base material;
a magnetic member that is embedded in the through hole; and
a plating film that covers end faces of the magnetic member, the end faces being exposed from the through hole, wherein
the magnetic member includes a conductor wire that is covered by a magnetic body,
the end faces of the magnetic member are polished surfaces that are flush with surfaces of the metallic foils, and
both ends of the magnetic member respectively protrude from the opposite surfaces of the base material with the magnetic member embedded in the through hole, the ends of the magnetic member respectively including the end faces of the magnetic member.
2. The wiring board according to claim 1 , wherein in the end faces of the magnetic member, end portions of the conductor wire are exposed from the magnetic body.
3. The wiring board according to claim 1 , wherein the magnetic body is insulating resin containing magnetic particles.
4. The wiring board according to claim 1 , wherein the magnetic body is a magnetic metal plating film made of a magnetic metal.
5. The wiring board according to claim 1 , wherein the magnetic member includes
a strand wire that is formed by twisting a plurality of conductor wires together, the conductor wires being covered by magnetic bodies; and
insulating resin that covers the strand wire.
6. The wiring board according to claim 1 , wherein the plating film includes
an electroless plating film that covers the end faces of the magnetic member; and
an electroplating film that is laminated on the electroless plating film.
7. The wiring board according to claim 1 , wherein the plating film includes
a first electroless plating film that covers the opposite surfaces of the base material;
a first electroplating film that is laminated on the first electroless plating film;
a second electroless plating film that covers a surface of the first electroplating film and the end faces of the magnetic member; and
a second electroplating film that is laminated on the second electroless plating film.
8. The wiring board according to claim 1 , wherein the plating film covers a part of the end faces of the magnetic member and exposes another part of the end faces of the magnetic member.
9. The wiring board according to claim 1 , further comprising:
another through hole that is formed in the base material between the opposite surfaces of the base material; and
insulating resin that is filled in the other through hole, wherein
the plating film includes
a first plating film that is located between an inner wall surface of the other through hole and the insulating resin; and
a second plating film that covers end faces of the insulating resin, the end faces being exposed from the other through hole.
10. The wiring board according to claim 1 , further comprising:
insulating resin that is located between an inner wall surface of the through hole and the magnetic member.
11. The wiring board according to claim 1 , further comprising:
an insulating layer that is arranged on the opposite surfaces of the base material;
a wiring layer that is arranged on a surface of the insulating layer; and
a via wire that is arranged in the insulating layer, wherein
the wiring layer is connected to the plating film via the via wire.
12. The wiring board according to claim 1 , wherein in the end faces of the magnetic member, each of end faces of the conductor wire is flush with each of end faces of the magnetic body.
13. A wiring board manufacturing method comprising:
forming a through hole in a base material that has metallic foils formed on opposite surfaces thereof, the through hole extending between the opposite surfaces of the base material;
forming a magnetic member by covering a conductor wire by a magnetic body, the magnetic member being formed so that a length between opposite end faces of the magnetic member is greater than a thickness of the base material between the opposite surfaces of the base material;
embedding the magnetic member in the through hole with both ends of the magnetic member respectively protruding from the opposite surfaces of the base material, the ends of the magnetic member respectively including the end faces of the magnetic member; and
forming a plating film that covers end faces of the magnetic member, the end faces being exposed from the through hole, wherein
the wiring board manufacturing method further comprises polishing the end faces exposed from the through hole such that the end faces are flush with surfaces of the metallic foils after the magnetic member is embedded in the through hole before the plating is formed.
14. The wiring board manufacturing method according to claim 13 , wherein
the forming the through hole includes forming the through hole and another through hole in the base material; and
the forming the plating film includes forming the plating film that covers the end faces of the magnetic member exposed from the through hole and an inner wall surface of the other through hole.
15. The wiring board manufacturing method according to claim 14 , further comprising:
filling insulating resin in the other through hole in which the plating film is formed.
16. The wiring board manufacturing method according to claim 13 , further comprising:
forming another through hole in the base material after the magnetic member is embedded in the through hole, wherein
the forming the plating film includes forming the plating film that covers the end faces of the magnetic member exposed from the through hole and an inner wall surface of the other through hole.
17. The wiring board manufacturing method according to claim 16 , further comprising:
filling insulating resin in the other through hole in which the plating film is formed.
18. A wiring board comprising:
a base material;
a through hole that is formed in the base material between opposite surfaces of the base material;
a magnetic member that is embedded in the through hole; and
a plating film that covers end faces of the magnetic member, the end faces being exposed from the through hole, wherein
the magnetic member includes a conductor wire that is covered by a magnetic body,
in the end faces of the magnetic member, each of end faces of the conductor wire is flush with each of end faces of the magnetic body, and
both ends of the magnetic member respectively protrude from the opposite surfaces of the base material with the magnetic member embedded in the through hole, the ends of the magnetic member respectively including the end faces of the magnetic member.
19. The wiring board according to claim 18 , wherein the magnetic body is insulating resin containing magnetic particles.
20. The wiring board according to claim 18 , wherein the magnetic body is a magnetic metal plating film made of a magnetic metal.
21. The wiring board according to claim 18 , wherein the magnetic member includes
a strand wire that is formed by twisting a plurality of conductor wires together, the conductor wires being covered by magnetic bodies; and
insulating resin that covers the strand wire.
22. The wiring board according to claim 18 , wherein the plating film includes
an electroless plating film that covers the end faces of the magnetic member; and
an electroplating film that is laminated on the electroless plating film.
23. The wiring board according to claim 18 , wherein the plating film includes
a first electroless plating film that covers the opposite surfaces of the base material;
a first electroplating film that is laminated on the first electroless plating film;
a second electroless plating film that covers a surface of the first electroplating film and the end faces of the magnetic member; and
a second electroplating film that is laminated on the second electroless plating film.
24. The wiring board according to claim 18 , wherein the plating film covers a part of the end faces of the magnetic member and exposes another part of the end faces of the magnetic member.