IP Library › Granted Patent US 12,252,634
Granted Patent B2
US 12,252,634 · App. 17/288,579 · Granted Mar 18, 2025

Polyurethane for polishing layers, polishing layer and polishing pad

Inventors: Mitsuru Kato (Kurashiki, JP); Chihiro Okamoto (Kurashiki, JP); Shinya Kato (Tokyo, JP)
Assignee: KURARAY CO., LTD.
C09G1/16B24B37/22B24B37/24C08G18/283C08G18/2835C08G18/4825C08G18/7671
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Quick Facts
Patent No.
US 12,252,634
App. No.
17/288,579
Granted
Mar 18, 2025
Kind
B2
Abstract

Disclosed are a polyurethane for use in a polishing layer, and a polishing layer and a polishing pad using the same, the polyurethane including a terminal group represented by the following formula (I): R—(OX) n — (I) wherein R represents a monovalent hydrocarbon group having 1 to 30 carbon atoms that may be substituted with a heteroatom or may be interrupted by a heteroatom, X represents an alkylene group having 2 to 4 carbon atoms, 90 to 100% of the alkylene group being an ethylene group, and n represents a number from 8 to 120.

Claims (26)

1. A polishing layer that is a molded body of a polyurethane comprising:

a terminal group represented by formula (I):

R—(OX) n —  (I)

wherein

R represents a monovalent hydrocarbon group having 1 to 30 carbon atoms that are optionally substituted with a heteroatom or are optionally interrupted by a heteroatom,

X represents an alkylene group having 2 to 4 carbon atoms, 90 to 100% of the alkylene group being an ethylene group, and

n represents a number from 8 to 120.

2. The polishing layer according to claim 1 , wherein the polishing layer is non-porous.

3. The polishing layer according to claim 1 , wherein the polishing layer has a JIS-D hardness at 23° C. when immersed in warm water at 50° C. for 72 hours, of 45 to 75.

4. A polishing pad, comprising:

the polishing layer according to claim 1 , and

a cushioning layer having a hardness lower than a hardness of the polishing layer.

5. The polishing layer according to claim 1 , wherein R in the formula (I) is an aliphatic hydrocarbon group having 1 to 22 carbon atoms.

6. The polishing layer according to claim 1 , wherein n in the formula (I) is 15 to 100.

7. The polishing layer according to claim 1 , wherein the polyurethane contains 0.005 to 0.05 mmol/g of the terminal group represented by the formula (I).

8. The polishing layer according to claim 1 , wherein the polyurethane contains 1 to 10 mass % of the terminal group represented by the formula (I).

9. The polishing layer according to claim 1 , wherein the polyurethane is a reaction product of an organic polyisocyanate (A), a polymer polyol (B), a chain extender (C), and a compound (D) represented by formula (II):

R—(OX) n -A H   (II)

wherein

R, X, and n are the same as those in the formula (I), and

A H is a hydroxyl group, an amino group, or a monovalent hydrocarbon group having 1 to 4 carbon atoms and containing a hydroxyl group or an amino group.

10. The polishing layer according to claim 9 , wherein the polyurethane has a ratio of nitrogen atoms derived from an isocyanate group of the organic polyisocyanate (A), of 4.6 to 6.8 mass %.

11. The polishing layer according to claim 9 , wherein a number-average molecular weight of the polymer polyol (B) is 600 to 2000.

12. The polishing layer according to claim 9 , wherein the polymer polyol (B) contains 70 mass % or more of polytetramethylene glycol.

13. The polishing layer according to claim 1 , wherein the polyurethane has a water absorption rate when swollen to saturation with warm water at 50° C., of 3% or less.

14. The polishing layer according to claim 1 , wherein the polyurethane has thermoplasticity.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2021
From: KATO, MITSURU; OKAMOTO, CHIHIRO; KATO, SHINYA
To: KURARAY CO., LTD.
Reel/Frame 056033/0297 →
Priority Claims (1)
JP 2018-226291 · Dec 3, 2018 · national
Continuity (1)
Related Publication 20210388234A1 · Dec 16, 2021
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