IP Library Granted Patent US 12,254,921
Granted Patent B2
US 12,254,921 · App. 18/151,466 · Granted Mar 18, 2025

Sense amplifier circuit architecture

Inventors: Guifen Yang (Hefei, CN); Sungsoo Chi (Hefei, CN)
Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
G11C11/4091
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Quick Facts
Patent No.
US 12,254,921
App. No.
18/151,466
Granted
Mar 18, 2025
Kind
B2
Abstract

A sense amplifier circuit architecture includes a first NMOS layout, a second NMOS layout, a first PMOS layout, a second PMOS layout, a first processing structure layout and a second processing structure layout. The first NMOS layout includes first N-type active layers and first gate layers discretely arranged on the first N-type active layers. The second NMOS layout includes second N-type active layers and second gate layers discretely arranged on the second N-type active layers. The first PMOS layout includes first P-type active layers and third gate layers discretely arranged on the first P-type active layers. The second PMOS layout includes second P-type active layers and fourth gate layers discretely arranged on the second P-type active layers. The first processing structure layout includes first active layers and a first isolation gate. The second processing structure layout includes second active layers and a second isolation gate.

Claims (33)

1. A sense amplifier circuit architecture, comprising:

a first N-Metal-Oxide-Semiconductor (NMOS) layout, comprising first N-type active layers discretely arranged in a first direction, and first gate layers discretely arranged on the first N-type active layers;

a second NMOS layout, comprising second N-type active layers discretely arranged in the first direction, and second gate layers discretely arranged on the second N-type active layers;

a first P-Metal-Oxide-Semiconductor (PMOS) layout, comprising first P-type active layers discretely arranged in the first direction, and third gate layers discretely arranged on the first P-type active layers;

a second PMOS layout, comprising second P-type active layers discretely arranged in the first direction, and fourth gate layers discretely arranged on the second P-type active layers;

a first processing structure layout, comprising first active layers discretely arranged in the first direction and extending in a second direction, and a first isolation gate arranged on the first active layers and extending in the second direction; and

a second processing structure layout, comprising second active layers discretely arranged in the first direction and extending in the second direction, and a second isolation gate arranged on the second active layers and extending in the second direction,

wherein the first direction intersects the second direction;

the first processing structure layout further comprises a first precharge gate, arranged on the first active layers and extending in the first direction, and the first precharge gate and the first isolation gate are arranged in the second direction in sequence; the second processing structure layout further comprises a second precharge gate and a third precharge gate, which are arranged on the second active layers and extending in the first direction, and the second precharge gate, the second isolation gate and the third precharge gate are arranged in the second direction in sequence;

wherein the first processing structure layout further comprises an equalizing gate, arranged on the first active layers and extending in the first direction, and the first precharge gate, the first isolation gate, and the equalizing gate are arranged in the second direction in sequence; or

the first processing structure layout further comprises a first precharge gate and a third precharge gate, which are arranged on the first active layers and extending in the first direction, and the first precharge gate, and the first isolation gate and the third precharge gate are arranged in the second direction in sequence; the second processing structure layout further comprises a second precharge gate, arranged on the second active layers and extending in the first direction, and the second precharge gate and the second isolation gate are arranged in the second direction in sequence; wherein the first processing structure layout further comprises an equalizing gate, arranged on the first active layers and extending in the first direction, and the first precharge gate, the first isolation gate, the equalizing gate, and the third precharge gate are arranged in the second direction in sequence.

2. The sense amplifier circuit architecture of claim 1 , wherein

in the first direction, the first active layers for electrically connecting a preset voltage are connected to each other.

3. The sense amplifier circuit architecture of claim 1 , wherein

in the first direction, the second active layers for electrically connecting a preset voltage are connected to each other.

4. The sense amplifier circuit architecture of claim 1 , wherein

in the second direction, the first processing structure layout, the first NMOS layout, the first PMOS layout, the second PMOS layout, the second NMOS layout, and the second processing structure layout are arranged in sequence.

5. The sense amplifier circuit architecture of claim 1 , wherein

in the second direction, the first processing structure layout, the first PMOS layout, the first NMOS layout, the second NMOS layout, the second PMOS layout, and the second processing structure layout are arranged in sequence.

6. The sense amplifier circuit architecture of claim 1 , wherein

in the second direction, the first NMOS layout, the first processing structure layout, the first PMOS layout, the second PMOS layout, the second processing structure layout, and the second NMOS layout are arranged in sequence.

7. The sense amplifier circuit architecture of claim 1 , wherein

in the second direction, the first PMOS layout, the first processing structure layout, the first NMOS layout, the second NMOS layout, the second processing structure layout, and the second PMOS layout are arranged in sequence.

8. The sense amplifier circuit architecture of claim 1 , wherein

in the second direction, the first PMOS layout, the first NMOS layout, the first processing structure layout, the second processing structure layout, the second NMOS layout, and the second PMOS layout are arranged in sequence.

9. The sense amplifier circuit architecture of claim 1 , wherein

in the second direction, the first NMOS layout, the first PMOS layout, the first processing structure layout, the second processing structure layout, the second PMOS layout, and the second NMOS layout are arranged in sequence.

10. The sense amplifier circuit architecture of claim 8 , wherein

the first active layers are connected to each other, and the second active layers are connected to each other.

11. The sense amplifier circuit architecture of claim 9 , wherein

the first active layers are connected to each other, and the second active layers are connected to each other.

12. The sense amplifier circuit architecture of claim 1 , wherein

the first direction is perpendicular to the second direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 9, 2023
From: YANG, GUIFEN; CHI, SUNGSOO
To: CHANGXIN MEMORY TECHNOLOGIES, INC.
Reel/Frame 062305/0816 →
Priority Claims (1)
CN 202111082961.8 · Sep 15, 2021 · national
Continuity (2)
Continuation PCTCN2022072740 · Jan 19, 2022
Related Publication 20230162782A1 · May 25, 2023
References Cited (34)
US 6765815B2 · Fujisawa · 2004 [cited by examiner]
US 7129549B2 · Hasegawa · 2006 [cited by examiner]
US 7208779B2 · Ohta · 2007 [cited by examiner]
US 7525137B2 · Walker · 2009 [cited by examiner]
US 7541649B2 · Ohguro · 2009 [cited by examiner]
US 7649238B2 · Watanabe · 2010 [cited by examiner]
US 8853765B2 · Lee · 2014 [cited by examiner]
US 9196725B2 · Han · 2015 [cited by applicant]
US 9576613B2 · Paak · 2017 [cited by examiner]
US 10050036B2 · Han · 2018 [cited by applicant]
US 10535388B1 · Ingalls · 2020 [cited by applicant]
US 10803925B2 · Kim · 2020 [cited by examiner]
US 11348913B2 · Jeong · 2022 [cited by examiner]
US 11437089B2 · Kang · 2022 [cited by examiner]
US 11462536B2 · Bowonder · 2022 [cited by examiner]
US 11961551B2 · Chang · 2024 [cited by examiner]
US 12033691B2 · Yang · 2024 [cited by examiner]
US 20080080282A1 · Chang · 2008 [cited by examiner]
US 20100097873A1 · Lee · 2010 [cited by examiner]
US 20140197480A1 · Han et al. · 2014 [cited by applicant]
US 20160043086A1 · Han et al. · 2016 [cited by applicant]
US 20180182449A1 · Kim · 2018 [cited by examiner]
US 20200118614A1 · Kim · 2020 [cited by examiner]
US 20210020210A1 · Lee · 2021 [cited by applicant]
US 20210288058A1 · Nishimura · 2021 [cited by examiner]
US 20220076732A1 · Kang · 2022 [cited by examiner]
US 20220383940A1 · Yang · 2022 [cited by examiner]
US 20230005522A1 · Chi · 2023 [cited by examiner]
US 20230162762A1 · Yang · 2023 [cited by examiner]
US 20230162782A1 · Yang · 2023 [cited by examiner]
US 20230223074A1 · Yang · 2023 [cited by examiner]
CN 103928402A · 2014 [cited by applicant]
CN 112582372A · 2021 [cited by applicant]
CN 112992892A · 2021 [cited by applicant]