IP Library Granted Patent US 12,257,641
Granted Patent B2
US 12,257,641 · App. 17/696,361 · Granted Mar 25, 2025

Work processing apparatus

Inventors: Hideo Aida (Niigata, JP); Hidetoshi Takeda (Niigata, JP); Toshiro Doi (Fukuoka, JP); Tadakazu Miyashita (Nagano, JP); Atsushi Kajikura (Nagano, JP)
Assignees: Toshiro DOI; National University Corporation Nagaoka University of Technology; Fujikoshi Machinery Corp.
B23K10/003H01J37/32541
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Quick Facts
Patent No.
US 12,257,641
App. No.
17/696,361
Granted
Mar 25, 2025
Kind
B2
Abstract

A work processing apparatus performs processing of a surface to be processed of a work by causing a processing head to come into sliding contact with the work held on an upper surface of a holding plate. The processing head includes a plasma electrode that generates plasma and radiates the plasma to the surface to be processed of the work. In the plasma electrode, an annular or solid cylindrical central electrode provided at a center in a radial direction and an annular outer circumferential electrode provided at an outer side in the radial direction with respect to the central electrode are arranged with an annular slit portion intermediating therebetween at a boundary position thereof, the slit portion is configured as a plasma generation space, and a processing pad is provided at bottom surfaces of the central electrode and the outer circumferential electrode.

Claims (11)

1. A work processing apparatus configured to perform processing of a surface to be processed of a work by causing a processing head to come into sliding contact with the work held on an upper surface of a holding plate, the work processing apparatus comprising:

a processing head is provided to be rotatable and including a plasma electrode configured to generate plasma and radiate the plasma to the surface to be processed of the work,

wherein, in the plasma electrode, an annular or solid cylindrical central electrode provided at a center in a radial direction and an annular outer circumferential electrode provided at an outer side in the radial direction with respect to the central electrode are arranged with an annular slit portion intermediating therebetween at a boundary position thereof, the slit portion is configured as a plasma generation space, and a processing pad is provided at bottom surfaces of the central electrode and the outer circumferential electrode;

wherein the plasma electrode includes a projecting portion which projects in a direction to reduce a separation dimension of the slit portion at a lower end position in at least one of two side surfaces facing each other across the slit portion;

wherein the projecting portion is formed into a shape projecting with a mutually identical dimension at a lower end position in each of the two side surfaces; and

wherein regions not provided with the projecting portion in the side surfaces are formed with an insulating material.

2. The work processing apparatus according to claim 1 , wherein the outer circumferential electrode includes a plurality of outer circumferential electrodes, and the slit portion is further provided at respective boundary positions between the plurality of outer circumferential electrodes.

3. The work processing apparatus according to claim 1 , wherein an interval dimension in the radial direction of the two side surfaces is configured to be five or more times an interval dimension in the radial direction of the two projection portions.

4. The work processing apparatus according to claim 1 , wherein the plasma electrode includes an annular additional electrode at the slit portion, and, in planar view, the slit portion is made into spaces divided by the additional electrode, so that each of the spaces is configured as a plasma generation space.

5. The work processing apparatus according to claim 1 , wherein one or a plurality of processing heads are provided with an outer diameter and arrangement allowing a lower end position of the slit portion to face and the processing pad to come into sliding contact with all of regions of surfaces to be processed of all of the works, positions of the all of the regions relative to the processing head are changed by movement of the processing head and the holding plate.

6. The work processing apparatus according to claim 1 , wherein the processing pad includes an extension portion which extends by a predetermined length toward an outer side with respect to a side surface of the plasma electrode and slants upward.

Assignments (1)
COMBINED DECLARATION AND ASSIGNMENT Recorded Mar 16, 2022
From: AIDA, HIDEO; TAKEDA, HIDETOSHI; DOI, TOSHIRO; MIYASHITA, TADAKAZU; KAJIKURA, ATSUSHI
To: NATIONAL UNIVERSITY CORPORATION NAGAOKA UNIVERSITY OF TECHNOLOGY; DOI, TOSHIRO; FUJIKOSHI MACHINERY CORP.
Reel/Frame 059370/0104 →
Priority Claims (2)
JP 2021-044350 · Mar 18, 2021 · national
JP 2021-204585 · Dec 16, 2021 · national
Continuity (1)
Related Publication 20220297223A1 · Sep 22, 2022
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