IP Library › Granted Patent US 12,258,497
Granted Patent B2
US 12,258,497 · App. 17/788,441 · Granted Mar 25, 2025

Moisture-curable adhesive composition

Inventors: Hideyuki Sakata (Hyogo, JP); Kenji Kashihara (Hyogo, JP)
Assignee: TOYOBO MC CORPORATION
C09J183/12C09J7/10C09J11/06C09J123/0892C09J133/10C09J2301/414C09J2423/006
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Quick Facts
Patent No.
US 12,258,497
App. No.
17/788,441
Granted
Mar 25, 2025
Kind
B2
Abstract

An object of this invention is to provide an adhesive composition that comprises a moisture-curable resin and a modified polyolefin and that achieves an excellent liquid state and excellent adhesion to polyolefin resin substrates. Provided is a moisture-curable adhesive resin composition comprising a moisture-curable resin (A) and a modified polyolefin resin (B), wherein the content of the modified polyolefin resin (B) is 2 parts by mass or more per 100 parts by mass of the moisture-curable resin (A).

Claims (13)

1. An adhesive resin composition comprising a moisture-curable resin (A) and a modified polyolefin resin (B), wherein the content of the modified polyolefin resin (B) is 2 parts by mass or more and 100 parts by mass or less, per 100 parts by mass of the moisture-curable resin (A),

wherein the moisture-curable resin (A) is a resin containing a hydrolyzable silyl group at an end and having a main chain comprising a polyether or (meth)acrylate,

wherein the modified polyolefin resin (B) has a polyether structure or a (meth)acrylate polymer structure, and

wherein the modified polyolefin resin (B) is a polyolefin resin having a structure similar to that of the main skeleton of the moisture-curable resin (A).

2. The adhesive resin composition according to claim 1 , wherein the modified polyolefin resin (B) is a resin having an amide bond and/or ester bond.

3. The adhesive resin composition according to claim 1 , wherein the content of the polyether resin or (meth)acrylate polymer in the modified polyolefin resin (B) is 2 to 40 mass %.

4. The adhesive resin composition according to claim 1 , wherein the content of the polyether resin or (meth)acrylate polymer in the modified polyolefin resin (B) is 2 to 40 mass %.

5. The adhesive resin composition according to claim 1 , wherein the modified polyolefin resin (B) has a weight average molecular weight of 10,000 to 150,000.

6. The adhesive resin composition according to claim 1 , further comprising a radical polymerizable monomer (C).

7. The adhesive resin composition according to claim 6 , wherein the radical polymerizable monomer (C) is a compound containing a (meth)acryloyl group at an end.

8. The adhesive resin composition according to claim 1 , further comprising a radical polymerization initiator (D).

9. The adhesive resin composition according to claim 1 , further comprising a silanol condensation catalyst (E).

10. The adhesive resin composition according to claim 1 , wherein the moisture-curable resin (A) is a resin having an olefin component content of 50 mass % or less.

Assignments (2)
ABSORPTION-TYPE COMPANY SPLIT Recorded Sep 28, 2023
From: TOYOBO CO., LTD.
To: TOYOBO MC CORPORATION
Reel/Frame 065080/0848 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2022
From: SAKATA, HIDEYUKI; KASHIHARA, KENJI
To: TOYOBO CO., LTD.
Reel/Frame 060294/0100 →
Priority Claims (1)
JP 2019-238878 · Dec 27, 2019 · national
Continuity (1)
Related Publication 20230090721A1 · Mar 23, 2023
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