Manufacturing method of RF components
The present description concerns a method of manufacturing a device comprising at least one radio frequency component on a semiconductor substrate comprising: a) a laser anneal of a first thickness of the substrate on the upper surface side of the substrate; b) the forming of an insulating layer on the upper surface of the substrate; and c) the forming of said at least one radio frequency component on the insulating layer.
1. A method of forming a radio frequency device, comprising:
forming an oxide layer at a surface of a substrate;
forming a first defect layer of the substrate containing first defects of a first complex type between carbon atoms and first atoms and of a second complex type between carbon atoms and oxygen atoms, having a first thickness, and being present at the surface of the substrate by laser annealing the substrate with a laser, and forming a second defect layer of the substrate containing second defects of a void type different from the first complex type and the second complex type, having a second thickness, being present between the first defect layer and a first portion of the substrate, and being on the first portion of the substrate by the laser annealing of the substrate, and forming the first defect layer and the second defect layer by the laser annealing of the substrate includes:
melting a second portion of the substrate at the surface of the substrate and on the first portion of the substrate by exposing the second portion of the substrate to the laser;
cooling the second portion of the substrate and the first portion of the substrate, the cooling the second portion of the substrate and the first portion of the substrate including:
forming the first defect layer containing the first defects of the first complex type and the second complex type, being in an amorphous state, and being on the second defect layer; and
forming the second defect layer containing the second defects of the void type, being in a crystalline state, and being present between the first defect layer and the first portion of the substrate, the second defect layer separating the first defect layer from the first portion of the substrate;
forming an insulating layer on the first defect layer; and
forming the radio frequency component on the insulating layer, wherein:
the first and second thicknesses are in a range from 0.5-μm (micrometers) to 2-μm (micrometers), or equal to upper and lower ends of this range.
2. The method according to claim 1 , wherein the substrate has a resistance greater than 3-kΩ (kilo-Ohms).
3. The method according to claim 1 , wherein forming of an oxide layer at the surface of the substrate includes forming the oxide layer having a thickness within a range from 5-nm (nanometers) to 30-nm (nanometers), or equal to upper and lower ends of the range.
4. The method according to claim 1 , wherein the laser annealing includes utilizing a laser with a power in the order of 4 J/cm 2 (Joules per centimeter squared).
5. The method according to claim 1 , wherein the substrate is made of silicon, and the first atoms are silicon atoms.
6. The method according to claim 1 , wherein the substrate is made of gallium nitride, and the first atoms are gallium nitride atoms.
7. The method according to claim 1 , wherein the laser annealing includes utilizing a laser having a wavelength in a range from 300-nm (nanometers) to 700-nm, or equal to upper and lower ends of the range.
8. The method according to claim 1 , wherein forming the first defect layer and forming the second defect layer includes melting the substrate to the first thickness.
9. A method of forming a radio frequency device, comprising:
forming an oxide layer at a surface of a substrate;
forming a charge carrier layer of the substrate and a void layer of the substrate, forming the charge carrier layer and the void layer including:
forming a melted portion of the substrate at the surface of the substrate by exposing the oxide layer at the surface of the substrate to a laser; and
cooling the substrate and the melted portion of the substrate at the surface of the substrate, the cooling of the substrate and the melted portion of the substrate further includes:
forming the void layer containing defects of a void type configured to, in operation, trap possible charge carriers present within the void layer, the void layer being in a crystalline state, and the void layer being on a first portion of the substrate; and
forming the charge carrier layer containing defects of complex types configured to, in operation, trap possible charge carriers in the charge carrier layer, the charge carrier being in an amorphous state, and the charge carrier layer being on the void layer;
forming an insulating layer on the charge carrier layer; and
forming at least one the radio frequency component on the insulating layer, wherein:
forming the charge carrier layer further includes forming the charge carrier layer containing defects of the complex type, the defects of the complex type include first complexes between carbon atoms and silicon atoms and second complexes between the carbon atoms and oxygen atoms,
a first thickness of the charge carrier layer and a second thickness of the void layer are in a range from 0.5-μm (micrometers) to 2-μm (micrometers), or equal to upper and lower ends of this range, and
the charge carrier layer has a first concentration of oxygen atoms greater than a second concentration of oxygen atoms in the substrate, and the void layer has a third concentration of oxygen less than the first concentration of oxygen.
10. The method of claim 9 , wherein:
forming the melted portion of the substrate at the surface of the substrate by exposing the oxide layer at the surface of the substrate to the laser further includes diffusing oxygen atoms present within the oxide layer through the melted portion.
11. A method of forming a radio frequency device, comprising:
forming a first insulating layer at a surface of a substrate by oxidizing a first portion of the substrate at the surface of the substrate;
laser annealing the first insulating layer at the surface of the substrate with a laser, laser annealing the first insulating layer provides a source of oxygen in forming a charge carrier layer of the substrate and a void layer of the substrate, forming the charge carrier layer and the void layer including:
forming a melted portion of the substrate at the surface of the substrate by exposing the first insulating layer at the surface of the substrate to the laser diffusing respective oxygen from the source of oxygen to a first thickness; and
cooling the substrate and the melted portion of the substrate at the surface of the substrate forming the charge carrier layer having first defects including first complex types between carbon atoms and silicon atoms and second complex types between carbon atoms and oxygen atoms, and the first defects configured to, in operation, trap possible charge carriers present within the charge carrier layer;
while cooling the substrate and the melted portion, transforming a second portion of the substrate that remains in crystalline form and is not melted underlying the melted portion of the substrate forming the void layer of a second thickness, and transforming the melted portion to be in an amorphous form and overlying the void layer forming the charge carrier layer on the void layer, the charge carrier layer being separated from a third portion of the substrate by the void layer, and the charge carrier having the first thickness, the void layer configured to, in operation, trap possible charge carriers within the void layer; forming a second insulating layer on the charge carrier layer; and
forming the radio frequency component on the second insulating layer, and wherein:
the first thickness is in a range from 0.5-μm (micrometers) to 2-μm (micrometers), or equal to upper and lower ends of this range; and
the second thickness is in a range from 0.5-μm (micrometers) to 2-μm (micrometers), or equal to upper and lower ends of this range.
12. The method of claim 11 , wherein the laser has a wavelength in a range from 300-nm (nanometers) to 700-nm (nanometers) or equal to upper and lower ends of the range.
13. The method of claim 11 , wherein the substrate has a thickness in a range from 300-μm (micrometers) to 800-μm (micrometers), or equal to upper and lower ends of the range.
14. The method of claim 11 , wherein the first insulating layer has a thickness in a range from 5-nm (nanometers) to 30-nm (nanometers), or equal to upper and lower ends of the range.
15. The method of claim 11 , wherein the first thickness of the void layer is equal to the second thickness of the charge carrier layer.
16. The method of claim 15 , wherein the first thickness of the void layer is different than the second thickness of the charge carrier layer.
17. The method of claim 11 , wherein the laser annealing of the first insulating layer further includes pulsing the laser utilized in the laser annealing of the first insulating layer.
18. The method of claim 9 , wherein the oxide layer has a thickness in a range from 5-nm (nanometers) to 30-nm (nanometers), or equal to upper and lower ends of the range.
19. The method of claim 10 , further comprising forming the melted portion of the substrate at the surface of the substrate by exposing the oxide layer at the surface of the substrate to the laser further includes diffusing oxygen atoms present within the oxide layer through the melted portion to the first thickness.
20. The method of claim 9 , wherein the laser annealing includes utilizing a laser having a wavelength in a range from 300-nm (nanometers) to 700-nm, or equal to upper and lower ends of the range.