IP Library › Granted Patent US 12,261,194
Granted Patent B2
US 12,261,194 · App. 17/686,430 · Granted Mar 25, 2025

Display device and method for manufacturing the same

Inventor: Kenichi Takemasa (Tokyo, JP)
Assignee: JAPAN DISPLAY INC.
H01L27/156H01L27/1266H01L33/62H01L2933/0016H01L2933/0066
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Quick Facts
Patent No.
US 12,261,194
App. No.
17/686,430
Granted
Mar 25, 2025
Kind
B2
Abstract

A method for manufacturing a display device includes forming a drive circuit to drive an LED element on an insulating substrate; forming a light absorbing layer on the drive circuit; forming an insulating layer covering the light absorbing layer; forming a connecting electrode electrically connected to the drive circuit; arranging the LED element so that the connecting electrode is in contact with a terminal electrode of the LED element; and bonding the connecting electrode and the terminal electrode by irradiating laser light through a semiconductor layer of the LED element to the light absorbing layer.

Claims (21)

1. A method for manufacturing a display device comprising:

forming a drive circuit to drive an LED element on an insulating substrate;

forming a light absorbing layer on the drive circuit;

forming an insulating layer covering the light absorbing layer;

forming a connecting electrode electrically connected to the drive circuit;

arranging the LED element so that the connecting electrode is in contact with a terminal electrode of the LED element; and

bonding the connecting electrode and the terminal electrode by irradiating laser light through a semiconductor layer of the LED element to the light absorbing layer.

2. The method for manufacturing the display device according to claim 1 , wherein

the light absorbing layer is heated by irradiation of the laser light and the heat generated in the light absorbing layer is transferred to the connecting electrode and the terminal electrode through the insulating layer.

3. The method for manufacturing the display device according to claim 1 , wherein

the light absorbing layer is a metal layer containing tungsten, chromium, cobalt, molybdenum, titanium, zinc, nickel, or iron.

4. The method for manufacturing the display device according to claim 1 , wherein

the insulating layer is an aluminum oxide layer.

5. The method for manufacturing the display device according to claim 1 , wherein

bonding the connecting electrode and the terminal electrode includes forming an alloy layer containing the constituent materials of the connecting electrode and the terminal electrode.

6. The method for manufacturing the display device according to claim 5 , wherein

the light absorbing layer has a higher melting point than the alloy layer.

7. The method for manufacturing the display device according to claim 1 , wherein

the laser light is near-infrared light emitted from a YAG laser or YVO 4 laser.

8. The method for manufacturing the display device according to claim 1 , wherein

the connecting electrode is formed so as to overlap a part of the light absorbing layer in a plan view.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2022
From: TAKEMASA, KENICHI
To: JAPAN DISPLAY INC.
Reel/Frame 059320/0686 →
Priority Claims (1)
JP 2021-046568 · Mar 19, 2021 · national
Continuity (1)
Related Publication 20220302204A1 · Sep 22, 2022
References Cited (6)
US 20180031927A1 · Ikeda · 2018 [cited by examiner]
US 20180031974A1 · Prevatte et al. · 2018 [cited by applicant]
US 20210280655A1 · Kanaya · 2021 [cited by examiner]
US 20210296293A1 · Kanaya · 2021 [cited by examiner]
US 20220199879A1 · Shimizu · 2022 [cited by examiner]
US 20220367775A1 · Yamazaki · 2022 [cited by examiner]