Reprint apparatus for circuit board and reprint method using the same
A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.
1. A reprint apparatus, comprising:
a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board;
a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and
a curing unit configured to cure the material filled in the defective portion,
wherein the defect checking unit is configured to calculate a volume of the defective portion,
wherein the material filling unit is configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount,
wherein the defect checking unit, the material filling unit, and the curing unit are integrally formed and are configured to move together from above the circuit board.
2. The reprint apparatus of claim 1 , wherein the material filling unit is configured to calculate the discharge amount in a range of 40% to 90% of the volume of the defective portion.
3. The reprint apparatus of claim 1 , wherein the defective checking unit comprises a laser displacement sensor for measuring the volume of the defective portion.
4. The reprint apparatus of claim 3 , wherein the defective checking unit comprises a first camera for imaging the circuit board when the laser displacement sensor operates.
5. The reprint apparatus of claim 3 , wherein the laser displacement sensor is configured to calculate a central position of the defective portion, and the material filling unit is configured to discharge the filling material at the central position.
6. The reprint apparatus of claim 1 , wherein the material filling unit comprises an electro hydro dynamics (EHD) nozzle for discharging the filling material by an EHD jet printing method.
7. The reprint apparatus of claim 6 , wherein the material filling unit comprises a second camera for imaging the circuit board when the EHD nozzle operates.
8. The reprint apparatus of claim 6 , wherein the EHD nozzle linearly reciprocates in a vertical direction.
9. The reprint apparatus of claim 1 , wherein the curing unit comprises a spot UV curing machine, and is configured to locally irradiate UV to the defective portion.
10. The reprint apparatus of claim 1 , further comprising:
a substrate seating unit on which the circuit board is mounted,
wherein the substrate seating unit is linearly moved in a first direction, and the defect checking unit, the material filling unit, and the curing unit are linearly moved in a second direction,
the first direction and the second direction being orthogonal to each other.
11. The reprint apparatus of claim 1 , wherein, after the filling material is filled in the defective portion, the defect checking unit checks a filling amount of the filling material discharged to the defective portion.
12. The reprint apparatus of claim 1 , further comprising:
a filling checking unit configured to check the filling amount of the filling material discharged to the defective portion, after the filling material is filled in the defective portion.
13. A reprint apparatus, comprising:
a defect checking unit configured to check a defective portion in a solder resist layer;
a material filling unit configured to fill the defective portion with a filling material until a depth or a volume of a remaining portion of the defective portion with respect to a surface of the solder resist layer is within a predetermined range after filling; and
a curing unit configured to cure the material filled in the defective portion,
wherein the defect checking unit, the material filling unit, and the curing unit are integrally formed and are configured to move together from above the circuit board.
14. The reprint apparatus of claim 13 , wherein the defective checking unit comprises a laser displacement sensor for measuring the defective portion.
15. The reprint apparatus of claim 14 , wherein the defective checking unit further comprises a camera for imaging the solder resist layer.
16. The reprint apparatus of claim 14 , wherein the laser displacement sensor is configured to calculate a central position of the defective portion, and the material filling unit is configured to discharge the filling material at the central position.
17. The reprint apparatus of claim 13 , wherein the defect checking unit is configured to determine the depth or the volume of the remaining portion of the defective portion with respect to the surface of the solder resist layer after filling.
18. The reprint apparatus of claim 13 , further comprising a filling checking unit configured to determine the depth or the volume of the remaining portion of the defective portion with respect to the surface of the solder resist layer after filling.