Laser processing device and laser processing method using same
A laser processing device includes a laser oscillator, an optical fiber that is a multi-clad fiber, a beam control mechanism provided in the laser oscillator, and a laser light emitting head attached to the optical fiber. The beam control mechanism includes a condenser lens, an optical path changing and holding mechanism that is disposed between the condenser lens and an incident end face of the optical fiber and changes an optical path of laser light LB, and a controller that controls an operation of the optical path changing and holding mechanism. The beam control mechanism controls a power distribution of the laser light by changing an incident position of the laser light on the incident end face.
1. A laser processing device, comprising at least:
a laser oscillator that generates laser light;
an optical fiber that includes at least a core, a first cladding provided coaxially with the core on an outer peripheral side of the core, and a second cladding provided coaxially with the core on an outer peripheral side of the first cladding, and includes an incident end face and an emission end opposite to the incident end face;
a beam control mechanism that is provided in the laser oscillator, introduces the laser light into the incident end face of the optical fiber, and controls a power distribution of the laser light emitted from the emission end of the optical fiber; and
a laser light emitting head that is attached to the emission end of the optical fiber and illuminates the laser light to a workpiece, wherein
the beam control mechanism includes at least
a condenser lens that receives the laser light and condenses the laser light at a predetermined magnification,
an optical path changing and holding mechanism that is disposed on an optical path of the laser light between the condenser lens and the incident end face of the optical fiber, and changes and holds the optical path of the laser light, and
a controller that controls an operation of the optical path changing and holding mechanism, and
the beam control mechanism controls the power distribution of the laser light emitted from the laser light emitting head by changing an incident position of the laser light on the incident end face of the optical fiber.
2. The laser processing device according to claim 1 , wherein
the optical path changing and holding mechanism includes
a parallel plate-shaped optical member that transmits the laser light, and is provided to be tiltable about a first axis intersecting with an optical axis of the laser light, and
an actuator that is coupled to the optical member, and
the beam control mechanism changes the incident position of the laser light on the incident end face of the optical fiber by the controller that drives the actuator to tilt the optical member about the first axis.
3. The laser processing device according to claim 2 , wherein the beam control mechanism causes the laser light to be incident on at least one of the core and the first cladding.
4. The laser processing device according to claim 1 , wherein the beam control mechanism controls the power distribution of the laser light emitted from the laser light emitting head according to at least one of a material of the workpiece and a shape of a portion of the workpiece to be laser-processed.
5. The laser processing device according to claim 4 , wherein the beam control mechanism is configured to switch between power distributions of the laser light emitted from the laser light emitting head during the laser processing of the workpiece.
6. The laser processing device according to claim 5 , wherein the beam control mechanism is configured to periodically and continuously switch between the power distributions of the laser light emitted from the laser light emitting head during the laser processing of the workpiece.
7. A laser processing method using the laser processing device according to claim 1 , the method comprising at least:
a first illumination step of illuminating the laser light having a first power distribution to the workpiece; and
a second illumination step of subsequently illuminating the laser light having a second power distribution different from the first power distribution to the workpiece.
8. The laser processing method according to claim 7 , wherein
in the first illumination step, a molten pool and a keyhole are formed on a surface of the workpiece, and
in the second illumination step, an opening of the keyhole is expanded, and the molten pool is grown so as to have a desired weld-penetration depth.
9. The laser processing method according to claim 8 , wherein in the second illumination step, the power distributions of the laser light are periodically and continuously switched at a predetermined frequency.
10. The laser processing method according to claim 9 , wherein the predetermined frequency is substantially equal to a natural vibration frequency of a keyhole formed in the workpiece.
11. The laser processing method according to claim 7 , wherein
in the first illumination step, a first portion of the workpiece having a first thickness is illuminated by the laser light, and
in the second illumination step, a second portion of the workpiece having a second thickness different from the first thickness is illuminated by the laser light.