Method for producing cured product of heat-curable maleimide resin composition
Provided is a method for producing a cured product of a heat-curable maleimide resin composition, that causes no curing failure and no appearance failure associated therewith. The method is for producing a cured product of a heat-curable maleimide resin composition containing: (A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; and (B) a radical polymerization initiator, wherein the method includes: a laminating step of obtaining a laminate by laminating a release sheet, a resin layer made of the heat-curable maleimide resin composition, and a base material, in such order; and a curing step of heating the laminate to a temperature at which the heat-curable maleimide resin composition of the resin layer cures, without removing the release sheet of the laminate.
1. A method for producing a cured product of a heat-curable maleimide resin composition containing:
(A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; and
(B) a radical polymerization initiator,
wherein the method comprises:
a laminating step of obtaining a laminate by laminating a release sheet, a resin layer made of the heat-curable maleimide resin composition, and a base material, in such order; and
a curing step of heating the laminate to a temperature at which the heat-curable maleimide resin composition of the resin layer cures, without removing the release sheet of the laminate.
2. The method for producing the cured product of the heat-curable maleimide resin composition according to claim 1 , wherein the laminating step is a step in which another release sheet is to be placed on a surface of the base material that is not in contact with the resin layer to obtain a laminate having at least four layers which are the release sheet, the resin layer made of the heat-curable maleimide resin composition, the base material, and the another release sheet.
3. The method for producing the cured product of the heat-curable maleimide resin composition according to claim 1 , wherein the component (A) is a maleimide compound represented by the following formulae (1) and/or (2):
wherein, A independently represents a tetravalent organic group having a cyclic structure; B independently represents a divalent alicyclic hydrocarbon group having 6 to 60 carbon atoms; D independently represents a divalent hydrocarbon group having 6 to 200 carbon atoms, in which at least one D is a dimer acid frame-derived hydrocarbon group; m is 1 to 100; 1 is 1 to 200; no restrictions are imposed on an order of each repeating unit identified by m and 1, and a bonding pattern may be alternate, block or random,
wherein A independently represents a tetravalent organic group having a cyclic structure; D independently represents a divalent hydrocarbon group having 6 to 200 carbon atoms, in which at least one D is a dimer acid frame-derived hydrocarbon group; n is 0 to 100.
4. The method for producing the cured product of the heat-curable maleimide resin composition according to claim 3 , wherein A in the formulae (1) and (2) is a tetravalent organic group represented by any of the following structural formulae:
5. The method for producing the cured product of the heat-curable maleimide resin composition according to claim 1 , wherein the radical polymerization initiator as the component (B) is an organic peroxide.
6. The method for producing the cured product of the heat-curable maleimide resin composition according to claim 1 , wherein the release sheet is a plastic film in which a surface that is to be in contact with the resin layer made of the heat-curable maleimide resin composition has been subjected to a mold release treatment.
7. The method for producing the cured product of the heat-curable maleimide resin composition according to claim 1 , wherein the base material is at least one kind selected from a metal foil, a silicon wafer, a SiC wafer, a sapphire wafer, a compound semiconductor wafer, an organic substrate and a ceramic substrate.
8. The method for producing the cured product of the heat-curable maleimide resin composition according to claim 1 , wherein the resin layer has a thickness of 1 to 300 μm.