Electronic device comprising a package provided with an interconnection structure
A support substrate has a mounting face and a connection face opposite to the mounting face. An electronic chip is mounted to the mounting face and a matrix of connectors is mounted to the connection face. The support substrate includes an interconnection structure formed by a pair of conductive interconnection tracks that electrically connect the electronic chip to the matrix of connectors and circulate differential signals. The two interconnection tracks of the pair of conductive interconnection tracks extend facing each other at different depths of the support substrate. An isolation structure in the support substrate laterally isolates the pair of conductive interconnection tracks. Isolation plates above and below the pair of conductive interconnection tracks provide further isolation.
1. An electronic device, comprising:
a support substrate having a mounting face and a connection face opposite to the mounting face;
an electronic integrated circuit chip mounted to the mounting face; and
a matrix of connectors mounted to the connection face;
wherein the support substrate comprises:
an interconnection structure including a pair of conductive interconnection tracks that connect the electronic integrated circuit chip to the matrix of connectors, wherein the pair of conductive interconnection tracks are configured to circulate differential signals, and wherein the pair of conductive interconnection tracks comprises two interconnection tracks extending parallel to the mounting and connection faces and facing each other at different depths of the support substrate while being separated from each other by a dielectric layer of the support substrate; and
a structure for isolating electromagnetic fields configured to be electrically connected to an electrical reference point, the structure comprising at least two pairs of conductive isolation tracks, configured to be electrically connected to the electrical reference point, each pair of the at least two pairs of conductive isolation tracks comprising two isolation tracks extending parallel to the mounting and connection faces and facing each other at different depths of the substrate while being separated from each other by said dielectric layer; and
wherein the pair of conductive interconnection tracks is located between said at least two pairs of conductive isolation tracks and extending parallel to the at least two pairs of conductive isolation tracks.
2. The device according to claim 1 , wherein the two isolation tracks of each pair of the at least two pairs of conductive isolation tracks are coplanar with corresponding ones of the two interconnection tracks of the pair of conductive interconnection tracks.
3. The device according to claim 1 , wherein the structure for isolating electromagnetic fields further comprises a plurality of conductive vias that electrically connect the two isolation tracks of each pair of the at least two pairs of conductive isolation tracks through the dielectric layer.
4. The device according to claim 3 , wherein the plurality of vias are disposed regularly along each pair of the at least two pairs of conductive isolation tracks and extend through the dielectric layer of the support substrate.
5. The device according to claim 1 , wherein the structure for isolating electromagnetic fields further comprises a plate configured to be electrically connected to the reference point, said plate extending parallel to the dielectric layer and supported by the support substrate.
6. The device according to claim 5 , wherein the plate is positioned between the interconnection structure and the mounting face of the support substrate.
7. The device according to claim 5 , wherein the plate is positioned between the interconnection structure and the connection face of the support substrate.
8. The device according to claim 1 , wherein the structure for isolating electromagnetic fields further comprises:
a first plate configured to be electrically connected to the reference point, said first plate extending parallel to the dielectric layer and supported by the support substrate at a position between the interconnection structure and the mounting face of the support substrate; and
a second plate configured to be electrically connected to the reference point, said second plate extending parallel to the dielectric layer and supported by the support substrate at a position between the interconnection structure and the connection face of the substrate.
9. The device according to claim 1 , wherein said dielectric layer of the support substrate has a thickness of between 40 and 200 micrometers.
10. The device according to claim 1 , wherein each pair of the at least two pairs of conductive isolation tracks is spaced apart from an adjacent pair of conductive interconnection tracks by a constant lateral distance.