Hybrid pitch through hole connector
Connectors with a hybrid pitch are described. In one example, a connector to couple a card or module to a motherboard includes connector housing and a plurality of pins. The plurality of pins include alternating signal and ground pins. Each of the plurality of pins includes a card or module-facing end to couple with the card or module and a lead to couple with a through hole in the motherboard. A first pitch between leads of a pin and a first adjacent pin is different than a second pitch between leads of the pin and a second adjacent pin.
1. A connector to couple a card or module to a motherboard, the connector comprising:
a connector housing; and
a plurality of pins including alternating signal and ground pins, signal pins included in a first row in the connector housing, ground pins included in a second row in the connector housing, each of the plurality of pins to include a card or module-facing end to couple with the card or module and a lead to couple with a through hole in the motherboard;
a first pitch between leads of a pin and a first adjacent pin is different than a second pitch between leads of the pin and a second adjacent pin, wherein leads of a signal pin and a first adjacent ground pin have the first pitch and leads of the signal pin and a second adjacent ground pin have the second pitch, and wherein the first and second adjacent ground pins are included in a same row in the connector housing.
2. The connector of claim 1 , wherein:
pitch of leads of the plurality of pins alternates between the first pitch and the second pitch between each adjacent pair of pins.
3. The connector of claim 1 , wherein:
a third pitch of the card or module-facing ends of the plurality of pins is the same for each adjacent pair of the plurality of pins.
4. The connector of claim 3 , wherein:
the first pitch is less than the third pitch of the card or module-facing ends of the plurality of pins; and
the second pitch is greater than the third pitch of the card or module-facing ends of the plurality of pins.
5. The connector of claim 1 , wherein:
each of the plurality of pins includes a middle section, wherein pitch of middle sections of the plurality of pins is the same between adjacent pairs of pins.
6. The connector of claim 1 , wherein:
the lead of the pin is offset in a direction along an axis of a respective row that includes the pin relative to the card or module-facing end of the pin.
7. The connector of claim 6 , wherein:
a midpoint of the lead of the pin is offset relative to a midpoint of the card or module-facing end of the pin in a direction along the axis of a respective row that includes the pin.
8. The connector of claim 6 , wherein:
the lead of every other pin of the plurality of pins is offset in a direction along the axis of a respective row that includes the pin relative to its card or module-facing end.
9. The connector of claim 6 , wherein:
the lead of each of the plurality of pins is offset in a direction along the axis of a respective row that includes the pin relative to its card or module-facing end.
10. The connector of claim 1 , wherein:
the lead of every other pin of the plurality is offset in a direction orthogonal to a plane of the card or module.
11. The connector of claim 1 , further comprising:
a second plurality of pins including alternating signal and ground pins, signal pins of the second plurality of pins included in a third row in the connector housing, ground pins of the second plurality of pins included in a fourth row in the connector housing; and
a slot between the plurality of pins and the second plurality of pins to receive the card or module.
12. The connector of claim 11 , wherein:
leads of the second plurality of pins have the same pitch as leads of the plurality of pins.
13. A dual inline memory module (DIMM) connector comprising:
a connector housing; and
a plurality of pins including alternating signal and ground pins, signal pins included in a first row in the connector housing, ground pins included in a second row in the connector housing, each of the plurality of pins to include a DIMM-facing end to couple with a DIMM and a lead to couple with a plated through hole in a motherboard;
a first pitch between leads of a pin and a first adjacent pin is different than a second pitch between leads of the pin and a second adjacent pin, wherein leads of a signal pin and a first adjacent ground pin have the first pitch and leads of the signal pin and a second adjacent ground pin have the second pitch, and wherein the first and second adjacent ground pins are included in a same row in the connector housing.
14. The DIMM connector of claim 13 , wherein:
a pitch of the DIMM-facing ends of the plurality of pins is the same between adjacent pairs of pins.
15. A system comprising:
a motherboard including:
a first row of ground plated through holes; and
a second row of signal plated through holes parallel to the first row of ground plated through holes, each of the signal plated through holes is closer to one adjacent ground plated through hole than a second adjacent ground plated through hole; and
a connector coupled with the first row of ground plated through holes and the second row of signal plated through holes on the motherboard, the connector including:
a plurality of pins, wherein a first pitch between leads of a pin and a first adjacent pin is different than a second pitch between leads of the pin and a second adjacent pin, the plurality of pins including alternating signal pins and ground pins, each of the signal pins including a lead to couple with one of the signal plated through holes in the motherboard and each of the ground pins including a lead to couple with one of the ground plated through holes, wherein leads of a signal pin and a first adjacent ground pin have the first pitch and leads of the signal pin and a second adjacent ground pin have the second pitch, and wherein the first and second adjacent ground pins are included in a same row in a housing of the connector.
16. The system of claim 15 , wherein:
a first row of ground plated through holes are evenly spaced; and
the second row of signal plated through holes are evenly spaced.
17. The system of claim 15 , further comprising:
a dual inline memory module (DIMM) coupled with the connector.