Spacer element for a printed circuit board assembly
A multi-functional spacer element for spacing at least one printed circuit board from an opposite spacing surface. The spacer element can not only accomplish the spacing of one or more printed circuit boards, but can also support a fastening function to a carrier element and an electrical ground connection. A passageway extends through the main body. The spacer element includes a press-in element. The spacer element 1 includes an electrically conductive material for electrically conducting from at least a first contact surface to the press-in element.
1. A spacer element ( 1 ) for spacing at least one printed circuit board ( 30 ) from an opposite spacing surface, comprising:
a main body ( 10 ) having a first contact surface ( 12 ) for bearing against the at least one printed circuit board ( 30 ) and a second contact surface ( 14 ) for bearing against the spacing surface, wherein the main body ( 10 ) has a spacing length (L) between the first contact surface ( 12 ) and the second contact surface ( 14 ) along a main body axis (A), and wherein a passageway ( 16 ) extends through the main body ( 10 ) along the main body axis (A) from the first contact surface ( 12 ) to the second contact surface ( 14 ), and
a press-in element ( 20 ) arranged laterally to the main body axis (A) on the main body ( 10 ) and extending beyond the second contact surface ( 14 ),
wherein the spacer element ( 1 ) comprises an electrically conductive material for electrically conducting from at least the first contact surface ( 12 ) to the press-in element ( 20 ).
2. The spacer element ( 1 ) as claimed in claim 1 , wherein the spacer element ( 1 ) comprises copper.
3. The spacer element ( 1 ) as claimed in claim 1 , wherein the spacer element ( 1 ) is produced in a stamping and bending process.
4. The spacer element ( 1 ) as claimed in claim 1 , further comprising at least one stiffening element ( 25 ) arranged on an outer surface ( 13 ) of the spacer element ( 1 ).
5. The spacer element ( 1 ) as claimed in claim 1 , wherein at least one of the first contact surface ( 12 ) and the second contact surface ( 14 ) comprises at least one contact material having a higher standard electrode potential than at least one of the main body ( 10 ) and the press-in element ( 20 ).
6. The spacer element ( 1 ) as claimed in claim 1 , wherein the press-in element ( 20 ) extends beyond the second contact surface ( 14 ) and forms a first axial end ( 20 a ), and further comprising a pressing surface ( 22 ) formed opposite the first axial end ( 20 a ) on the press-in element ( 20 ).
7. A printed circuit board assembly ( 100 ) for power electronics comprising:
a carrier element ( 40 ) with at least one fastening indentation ( 42 ) and a press-in indentation ( 44 ),
at least one printed circuit board ( 30 ) having at least one fastening recess ( 32 ),
at least one spacer element ( 1 ), which is arranged between the printed circuit board ( 30 ) and the carrier element ( 40 ), for spacing at least one printed circuit board ( 30 ) from an opposite spacing surface, comprising:
a main body ( 10 ) having a first contact surface ( 12 ) for bearing against the at least one printed circuit board ( 30 ) and a second contact surface ( 14 ) for bearing against the spacing surface, wherein the main body ( 10 ) has a spacing length (L) between the first contact surface ( 12 ) and the second contact surface ( 14 ) along a main body axis (A), and wherein a passageway ( 16 ) extends through the main body ( 10 ) along the main body axis (A) from the first contact surface ( 12 ) to the second contact surface ( 14 ), and
a press-in element ( 20 ) arranged laterally to the main body axis (A) on the main body ( 10 ) and extending beyond the second contact surface ( 14 ),
wherein the spacer element ( 1 ) comprises an electrically conductive material for electrically conducting from at least the first contact surface ( 12 ) to the press-in element ( 20 ), and
at least one fastening means ( 50 ) via which the at least one printed circuit board ( 30 ) is fastened to the carrier element ( 40 ).
8. The printed circuit board assembly ( 100 ) as claimed in claim 7 , wherein the press-in element ( 20 ) is pressed into the press-in indentation ( 44 ).
9. The printed circuit board assembly ( 100 ) as claimed in claim 7 , wherein the fastening means ( 50 ) is a screw, wherein the fastening indentation ( 42 ) is a threaded bore into which the screw is screwed, and wherein the at least one printed circuit board ( 30 ) is braced in the direction of the carrier element ( 40 ) via a screw head ( 51 ) of the screw.
10. The printed circuit board assembly ( 100 ) as claimed in claim 7 , wherein the press-in element ( 20 ) and the press-in indentation ( 44 ) are formed such that cold welding occurs when the press-in element ( 20 ) is pressed in.
11. The printed circuit board assembly ( 100 ) as claimed in claim 9 , wherein the at least one printed circuit board ( 30 ) has an upper board surface ( 31 ) and a lower board surface ( 33 ), wherein the at least one fastening recess ( 32 ) extends from the upper board surface ( 31 ) through the printed circuit board ( 30 ) to the lower board surface ( 33 ).
12. The printed circuit board assembly ( 100 ) as claimed in claim 11 , wherein the at least one printed circuit board ( 30 ) comprises a first printed circuit board ( 30 a ), and wherein the first contact surface ( 12 ) bears, with contact, against the lower board surface ( 33 ) of the first printed circuit board ( 30 a ).
13. The printed circuit board assembly ( 100 ) as claimed in claim 12 , wherein the screw head ( 51 ) bears against the upper board surface ( 31 ) of the first printed circuit board ( 30 a ) and braces it in the direction of the carrier element ( 40 ).
14. The printed circuit board assembly ( 100 ) as claimed in claim 12 , wherein the at least one printed circuit board ( 30 ) comprises a second printed circuit board ( 30 c ) arranged parallel to the first printed circuit board ( 30 a ), and wherein the second contact surface ( 14 ) bears, with contact, against the upper board surface ( 31 ) of the second printed circuit board ( 30 c ).
15. A printed circuit board assembly ( 100 ) for power electronics comprising:
a carrier element ( 40 ) with at least one fastening indentation ( 42 ) and a press-in indentation ( 44 ),
at least one printed circuit board ( 30 ) having at least one fastening recess ( 32 ),
at least one spacer element ( 1 ), which is arranged between the printed circuit board ( 30 ) and the carrier element ( 40 ), for spacing at least one printed circuit board ( 30 ) from an opposite spacing surface, comprising:
a main body ( 10 ) having a first contact surface ( 12 ) for bearing against the at least one printed circuit board ( 30 ) and a second contact surface ( 14 ) for bearing against the spacing surface, wherein the main body ( 10 ) has a spacing length (L) between the first contact surface ( 12 ) and the second contact surface ( 14 ) along a main body axis (A), and wherein a passageway ( 16 ) extends through the main body ( 10 ) along the main body axis (A) from the first contact surface ( 12 ) to the second contact surface ( 14 ), and
a press-in element ( 20 ) arranged laterally to the main body axis (A) on the main body ( 10 ) and extending beyond the second contact surface ( 14 ),
wherein the spacer element ( 1 ) comprises an electrically conductive material for electrically conducting from at least the first contact surface ( 12 ) to the press-in element ( 20 ), and
at least one fastening means ( 50 ) via which the at least one printed circuit board ( 30 ) is fastened to the carrier element ( 40 ),
wherein the fastening means ( 50 ) is a screw, wherein the fastening indentation ( 42 ) is a threaded bore into which the screw is screwed, and wherein the at least one printed circuit board ( 30 ) is braced in the direction of the carrier element ( 40 ) via a screw head ( 51 ) of the screw,
wherein the at least one printed circuit board ( 30 ) comprises a first printed circuit board ( 30 a ), and wherein the first contact surface ( 12 ) bears, with contact, against the lower board surface ( 33 ) of the first printed circuit board ( 30 a ), and
wherein the lower board surface ( 33 ) of the first printed circuit board ( 30 a ) comprises a first contact surface portion ( 52 ) arranged around the at least one fastening recess ( 32 ) and contacting the first contact surface ( 12 ), and wherein the first contact surface portion ( 52 ) and the first contact surface ( 12 ) are configured in such a way that they form a first pair of materials having a maximum electrochemical voltage difference of from 0.0 V to 1.0 V with respect to their standard electrode potentials.