Semiconductor device testing with lead extender
A method includes providing a semiconductor package including an encapsulant body and a plurality of leads that protrude out from the encapsulant body; providing a semiconductor device testing apparatus including a package holder, a plurality of contact test probes, and a lead extender; arranging the semiconductor package within the package holder; actuating the semiconductor device testing apparatus such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender; and applying a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.
1. A method of testing a semiconductor device, the method comprising:
providing a semiconductor package comprising an encapsulant body and a plurality of leads that protrude out from the encapsulant body;
providing a semiconductor device testing apparatus comprising a package holder, a plurality of contact test probes, and a lead extender;
arranging the semiconductor package within the package holder;
actuating the semiconductor device testing apparatus such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender; and
applying a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.
2. The method of claim 1 , wherein after actuating the semiconductor device testing apparatus:
the first one of the contact test probes directly contacts the first one of the leads at a first side;
the lead extender directly contacts the first one of the leads at a second side that is opposite from the first side; and
the second one of the contact test probes directly contacts the lead extender.
3. The method of claim 2 , wherein after actuating the semiconductor device testing apparatus two or more of the contact test probes directly contact the first one of the leads at the first side.
4. The method of claim 3 , wherein one of the contact test probes that directly contacts the first one of the leads at the first side applies a sense current.
5. The method of claim 2 , wherein the semiconductor device testing apparatus comprises a first plurality of contact test probes, and wherein after actuating the semiconductor device testing apparatus multiple ones of the contact test probes from the first plurality directly contact the first one of the leads and multiple ones of the contact test probes contact test probes from the first plurality directly contact the lead extender.
6. The method of claim 1 , wherein the semiconductor device testing apparatus comprising further comprises a second lead extender, wherein the semiconductor device testing apparatus is actuated such that a third one of the contact test probes directly contacts a second one of the leads and such that a fourth one of the contact test probes directly contacts the second lead extender.
7. The method of claim 1 , wherein the test current is at least 250 A.
8. The method of claim 1 , wherein the semiconductor package is configured as a straight lead package.
9. The method of claim 1 , wherein the semiconductor package is configured as a surface mount package.
10. The method of claim 9 , wherein the electrically conductive lead extender is configured as a dynamic contact mechanism that moves in response to direct contact between the second one of the contact test probes and the first one of the leads extender.
11. A semiconductor device testing apparatus, comprising:
a package holder;
a plurality of contact test probes; and
a lead extender;
wherein the semiconductor device testing apparatus is configured to actuate with a semiconductor package comprising a plurality of leads, wherein the semiconductor package is arranged within the package holder such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender; and
wherein the semiconductor device testing apparatus is configured to apply a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.
12. The semiconductor device testing apparatus of claim 11 , wherein the semiconductor device testing apparatus is configured such that after the actuating the first one of the contact test probes directly contacts the first one of the leads at a first side, the lead extender directly contacts the first one of the leads at a second side that is opposite from the first side; and
the second one of the contact test probes directly contacts the lead extender.
13. The semiconductor device testing apparatus of claim 12 , wherein the package holder is configured to accommodate a straight lead package, and wherein the electrically conductive lead extender is disposed on an electrically insulating lead backer portion of the package holder.
14. The semiconductor device testing apparatus of claim 13 , wherein the electrically conductive lead extender is a continuous metal structure comprising a first contact surface and a second contact surface, wherein the semiconductor device testing apparatus is configured such that the first one of the leads contacts the first contact surface of the electrically conductive lead extender and such that the second one of the contact test probes directly contacts the second contact surface after the actuating.
15. The semiconductor device testing apparatus of claim 14 , wherein the first contact surface is a roughened surface.
16. The semiconductor device testing apparatus of claim 12 , wherein the package holder is configured to accommodate a surface mount device package, wherein the package holder comprises a device sitting nest and an outer platform region that is disposed outside of the device sitting nest, and wherein the leads extender is arranged within the outer platform region.
17. The semiconductor device testing apparatus of claim 16 , wherein the electrically conductive lead extender comprises a contact mechanism that is configured to move in response to the direct contact between the second contact test probe and the electrically conductive lead extender.
18. The semiconductor device testing apparatus of claim 17 , wherein the contact mechanism is a conductive pad that is disposed in the outer platform region, wherein the conductive pad is configured to elastically deform in response to contact with the second one of the contact test probes.
19. The semiconductor device testing apparatus of claim 17 , wherein the contact mechanism is a pivoting contact block that is configured to pivot about a fulcrum in response to contact with the second one of the contact test probes.
20. The semiconductor device testing apparatus of claim 19 , wherein the contact mechanism is a curved blade that is affixed at one end and is configured to elastically deform in response to contact with one of the leads.