Imaging apparatus system
An imaging apparatus system includes a first imaging apparatus, and a second imaging apparatus. The first imaging apparatus includes a first top casing including a casing top surface, and a common rear casing including a casing rear surface. The second imaging apparatus includes a second top casing including a casing top surface, and the common rear casing. The first top casing has a shape in which a vent hole is formed in the second top casing.
1. An imaging apparatus system comprising:
a first imaging apparatus; and
a second imaging apparatus,
wherein the first imaging apparatus includes
a first top casing including a casing top surface, and
a common rear casing including a casing rear surface,
the second imaging apparatus includes
a second top casing including a casing top surface, and
the common rear casing, and
the first top casing has a shape in which a vent hole is formed in the second top casing.
2. The imaging apparatus system according to claim 1 , wherein
the second top casing includes an upward protruding portion protruding upward, and
the first top casing has a shape in which the vent hole is formed on both respective sides in a left-right direction of the upward protruding portion of the second top casing.
3. The imaging apparatus system according to claim 2 , wherein
the first imaging apparatus includes a first coding module to be disposed in the upward protruding portion, and
the first coding module includes
a fan configured to generate an air flow passing through the vent hole of the first top casing, and
a heat sink to be coded by air blown from the fan.
4. The imaging apparatus system according to claim 3 , wherein
the first imaging apparatus includes
a first image sensor, and
a first circuit board, and
the first image sensor and the first circuit board are connected to the heat sink of the first cooling module.
5. The imaging apparatus system according to claim 2 , wherein
the second imaging apparatus includes a second cooling module to be disposed in the upward protruding portion, and
the second cooling module includes a heat transfer member configured to come into contact with and transfer heat to the second top casing.
6. The imaging apparatus system according to claim 5 , wherein
the second imaging apparatus includes
a second image sensor, and
a second circuit board, and
the second circuit board is connected to the heat transfer member of the second cooling module.
7. The imaging apparatus system according to claim 1 , wherein
the first imaging apparatus includes
a first front casing including a casing front surface, and
a first lens mount attached to the first front casing, and
the second imaging apparatus includes
a second front casing including a casing front surface, and
a second lens mount attached to the second front casing and different from the first lens mount.
8. The imaging apparatus system according to claim 1 , wherein each of the first and second imaging apparatuses includes a common monitor attached to the common rear casing.