High-frequency board, high-frequency package, and high-frequency module
A high-frequency board includes an insulating substrate, a first line conductor, a second line conductor, a capacitor, a first bond, and a second bond. The insulating substrate has a recess on its upper surface. The first line conductor extends from an edge of the recess on the upper surface of the insulating substrate. The second line conductor faces the first line conductor across the recess on the upper surface of the insulating substrate. The capacitor overlaps the recess. The first bond joins the capacitor to the first line conductor. The second bond joins the capacitor to the second line conductor, and is spaced from the first bond.
1. A high-frequency board, comprising:
an insulating substrate including an upper surface and a recess on the upper surface;
a first line conductor located on the upper surface;
a second line conductor facing the first line conductor with the recess therebetween on the upper surface; and
a ground conductor layer spaced from the first line conductor and the second line conductor on the upper surface,
wherein the ground conductor layer is spaced from the recess and extends along the first line conductor and the second line conductor, and
wherein in plan view, a first end of the first line conductor ends at a first side of the recess or the first end of the first line conductor is spaced from the first side, and a first end of the second line conductor ends at a second side of the recess or the first end of the second line conductor is spaced from the second side.
2. The high-frequency board according to claim 1 , wherein
the insulating substrate internally includes a first inner ground conductor layer overlapping the recess.
3. The high-frequency board according to claim 2 , wherein
the first inner ground conductor layer overlaps the first line conductor and the second line conductor in plan view.
4. The high-frequency board according to claim 3 , wherein
the upper surface of the first inner ground conductor layer at a position overlapping the recess is covered with a ceramic material.
5. A high-frequency package, comprising:
a base;
a frame surrounding a top surface of the base; and
the high-frequency board according to claim 1 bonded to the frame.
6. A high-frequency module, comprising:
the high-frequency package according to claim 5 ;
a semiconductor element located on the top surface; and
a lid located on the frame.
7. The high-frequency board according to claim 1 , wherein
the first line conductor comprises a first electrode pad and a first line which extends from the first electrode pad, and
the second line conductor comprises a second electrode pad and a second line which extends from the second electrode pad.
8. The high-frequency board according to claim 7 , wherein
the recess extends in a first direction,
the first direction is a direction different from an extension direction of the first line conductor and the second line conductor, and
a distance between the first line and the ground conductor layer and a distance between the second line and the ground conductor layer are smaller than a distance between each end in the first direction of the recess and the ground conductor layer.
9. The high-frequency board according to claim 8 , wherein
a length in the first direction of the recess is larger than a length in the first direction of each of the first electrode pad and the second electrode pad.
10. The high-frequency board according to claim 7 , further comprising:
a capacitor overlapping the recess;
a first bond joining the capacitor to the first line conductor; and
a second bond joining the capacitor to the second line conductor.
11. The high-frequency board according to claim 10 wherein
the recess extends in a first direction,
the first direction is a direction different from an extension direction of the first line conductor and the second line conductor, and
a dimension in the first direction of the recess is larger than a dimension in the first direction of the capacitor.
12. The high-frequency board according to claim 1 , wherein
the recess includes a bottom surface.
13. The high-frequency board according to claim 12 , wherein
the first side of the recess and the second side of the recess are perpendicular to the bottom surface.
14. The high-frequency board according to claim 1 , wherein
the recess includes curved corner in plan view.
15. The high-frequency board according to claim 1 , wherein
the first line conductor comprises a plurality of first line conductors which are located in parallel with each other, and
parts of the ground conductor layer are located between the plurality of first line conductors.
16. The high-frequency board according to claim 15 , wherein
the second line conductor comprises a plurality of second line conductors which are located in parallel with each other, and
parts of the ground conductor layer are located between the plurality of second line conductors.