Granted Patent B2

US 12,273,993 · App. 18/604,057 · Granted Apr 8, 2025

Inventors: Mathias Bottcher (Moritzburg, DE); Frank Windrich (Moritzburg, DE); Kai Zoschke (Berlin, DE); M. Jürgen Wolf (Moritzburg, DE)

Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

H05K1/0278H05K3/4691H05K2201/09109

Abstract

Claims (22)

1. A method for producing a carrier arrangement, the method comprising:

producing a layer on a surface of a carrier, the layer comprising a first region and a second region connected to the first region, the first region covering a first surface region of the carrier and the second region covering a second surface region of the carrier; and

detaching the second region of the layer from the carrier, the first region of the layer remaining on the first surface region of the carrier and not being separated from the second region, the layer being flexible in the detached second region, wherein, before production of the layer on the surface of the carrier:

an intermediate layer which reinforces an adhesive force is applied on the first surface region of the carrier, wherein the second surface region is left out or the intermediate layer which reinforces the adhesive force is removed from the second surface region of the carrier again before the layer is produced on the surface of the carrier, wherein the intermediate layer which reinforces the adhesive force is formed from only one layer of atoms or molecules of a material of the intermediate layer which reinforces the adhesive force; or

an intermediate layer which reduces an adhesive force is applied on the second surface region of the carrier, wherein the first surface region is left out or the intermediate layer which reduces the adhesive force is removed from the first surface region of the carrier again before the layer is produced on the surface of the carrier, wherein the intermediate layer which reduces the adhesive force is formed from only one layer of atoms or molecules of a material of the intermediate layer which reduces the adhesive force.

2. The method according to claim 1 , wherein the second region of the layer detached from the carrier is bent or folded.

3. The method according to claim 1 , wherein the second region detached from the carrier is connected to a further carrier of the carrier arrangement.

4. The method according to claim 1 , wherein, before or after the second region of the layer is detached from the carrier, the carrier is severed in at least one of the second surface region or between the first surface region and the second surface region without separating the first region of the layer from the second region of the layer.

5. The method according to claim 1 , wherein, before the second region of the layer is detached from the carrier, adhesion of the second region of the layer to the second surface region is reduced by irradiating at least one of the second surface region of the carrier or the second region of the layer adhering to the second surface region with electromagnetic radiation through the carrier.

6. The method according to claim 1 , wherein the second region of the layer is detached from the carrier by etching a region of the carrier which forms the first surface region of the carrier.

7. The method according to claim 1 , wherein at least a portion of the carrier is formed from at least one of silicon, glass, metal, ceramic or a polymer.

8. The method according to claim 1 , wherein the carrier is a wafer, part of a wafer, a plate or a band.

9. The method according to claim 1 , wherein at least a portion of the layer is formed from at least one of a polymer from a metal, from glass from silicon.

10. The method according to claim 1 , wherein the layer has a total thickness between 1 and 300 μm.

11. The method according to claim 1 , wherein during the production of the layer on the surface of the carrier, at least one insulating layer of the layer is formed from an electrically insulating material, wherein the at least one insulating layer covers at least the first surface region and the second surface region of the carrier, wherein at least one conductive layer made of an electrically conductive material is formed on the at least one insulating layer, wherein the at least one conductive layer comprises at least one conductor track.

12. The method according to claim 11 , wherein the at least one conductive layer comprises at least one continuous conductor track which, starting from the first region of the layer, extends into the second region of the layer.

13. The method according to claim 11 , wherein at least one electrical contact element is located on the surface of the carrier within the first surface region, wherein an electrical connection is established between the at least one electrical contact element and the at least one conductor track of the layer.

14. The method according to claim 13 , wherein the at least one electrical contact element, starting from the first surface region of the carrier, at least partially extends through the first region of the layer.

15. The method according to claim 13 , wherein the at least one electrical contact element is connected in an electrically conductive manner to at least one of a conductor track located on the carrier or to an electronic component located on the carrier.

16. The method according to claim 1 , wherein at least one electrical contact element and/or at least one electronic component is located on at least one of the first region or on the second region of the layer or is integrated in at least one of the first region or in the second region of the layer.

17. The method according to claim 1 , wherein the intermediate layer is the intermediate layer which reinforces the adhesive force.

18. The method according to claim 1 , wherein the intermediate layer is the intermediate layer which reduces the adhesive force.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (26)